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IPC APEX EXPO 2018
Huasun Technology (HK) Limited
Huasun Technology (HK) Limited
Exhibitor
Booth: 840
Contact Info:
Email: MKT@huasuncorp.com
Phone: 0755-2161 6193
Website: www.huasuncorp.com
Address: 806, Block A, Liwan Building, Qianhai Road, Nanshan District
Shenzhen, Guangdong 518000
China
New Products and Videos:
Conventional PCBs
Layer count up to 40 layer;
Trace width/space down to 3mil;
Aspect Ratio: 20:1;
Hybrid construction;
RF and Microwave circuits;
Heavy copper up to 10oz;
Thick gold up to 80u";
Embbeded coin or...
HDI PCBs
Laser drill step:4+C+4;
Any layer connection for 12layer max.;
Trace width/space down to 2.5mil;
Pad size of via-in-pad:8mil min.;
Laser drill size:4mil min.
Rigid Flex PCBs
Layer count up to:16/8layer(Rigid/Flex);
Trace width/space down to 3mil;
Aspect Ratio: 15:1;
Mechanical drill size: 6mil;
IC Substrate
CSP (Chip Scale Packages):16layer;
FC-CSP (Flip Chip) CSP:16layer;
BOC (Board on Chip):12layer;
FC-BOC (Flip Chip) BOC:12layer;
SiP (System in Package):16layer;
PBGA:16layer;
About the Company:
HUASUN has been dedicating to BARE PCB for more than 20 years and headquarter in SHENZHEN. We are committed to providing one-stop PCB solution including HDI PCB, highlayer PCBs (up to 36 layers), High Speed Backplanes, Line Card PCB, thick-gold and thick-copper PCB.Our team is dedicated to... (more)
Main Contact: Chris Ouyang
Chris Ouyang
86 158 1745 6318
Other Contacts:
Kexiang Ouyang
Booth Staff
Director
Huasun Technology (HK) Limited
Xiaochuan Xie
Booth Staff
Sales Manager
Huasun Technology (HK) Limited
Xi Sheng
Booth Staff
Sales Manager
Huasun Technology (HK) Limited
Xiaochan Zhong
Booth Staff
Sales
Huasun Technology (HK) Limited
Huasun Technology (HK) Limited's Wall: (Public Messages)
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