OEM Press Systems offers vacuum enclosed hydraulic press systems incorporating the latest lamination technology for high layer count PCBs, Flexible Circuits, Rigid Flex and CCL. Our exclusive press design provides accurate & repeatable process control with even pressure application & temperature uniformity over the entire surface area of the platen resulting in uniform thickness across the entire product. High temp vacuum presses are offered for LCP, Teflon bonding and high-temp applications. OEM also offers loading/unloading equipment designed to easily handle materials and improve workflow. (less)