328 Martin Avenue Santa Clara, CA 95050 United States
About the Company:
PacTech, (group member of NAGASE & CO., Ltd.) is headquartered in Nauen, Germany, with wholly-owned subsidiaries: PacTech USA - Packaging Technologies Inc. in Silicon Valley, USA and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of two unique advanced packaging units: 1-... (more)
PacTech, (group member of NAGASE & CO., Ltd.) is headquartered in Nauen, Germany, with wholly-owned subsidiaries: PacTech USA - Packaging Technologies Inc. in Silicon Valley, USA and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of two unique advanced packaging units: 1- EQUIPMENT MANUFACTURING: PacLine 300 A50: Automatic ENIG & ENEPIG plating tools. SB-Jet: Laser solder jetting tool Ultra-SB: Wafer level solder ball transfer system LAPLACE: Laser-assisted flip-chip bonders 2- SUBCONTRACT SERVICES: Flip Chip and Wafer Level Package Bumpi (less)
