Uyemura advanced finishing solutions include TWX-40 mixed reaction autocatalytic gold, a reduction-assisted gold bath that meets the demand for thicker gold in ENIG, ENEPIG. Highest uniformity gold deposits up to 8µin independent of pad sizes & PCB surface potential. Also: EVF-R via fill copper for void-free blind via fill; plates aspect ratios of 1:1 and higher, fills blind vias 30-145µm often in ≤90 mins. FlatBOND GT copper produces a profile-free surface without soft etching for complete signal propagation; a powerful enabler for next-gen HF designs ≥25GHz. (less)