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IPC APEX EXPO 2018
YINCAE Advanced Materials, LLC.
YINCAE Advanced Materials, LLC.
Exhibitor
Booth: 2732
Contact Info:
Website: www.yincae.com
Address: 19 Walker Way
Albany, NY 12205
United States
New Products and Videos:
SMT 256EP
Solder Joint Encapsulant Paste

Low temperature soldering for high temperature applications. Combines our solder joint encapsulants with solder paste. Designed for applications where warpage, ...
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SMT 158UL
Highly filled room temperature flow underfill. SMT 158UL underfills at room temperature without the need to pre-heat the substrate.
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SMT 88UL
Super-fast flow room temperature underfill. Low viscosity, unfilled, and fast cure. Designed for board level and rework applications.
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DA 90
Low temperature highly conductive die attach adhesive. Offers high mechanical strength along with no de-lamination. Designed for applications with temperature sensitive components which requir...
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BP 256
Ball attach adhesive designed to eliminate cleaning processes currently used for ball bumping procedures as well as improve the mechanical strength of the solder balls.
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SMT 256
Solder joint encapsulant adhesive.

Designed to enhance solder joint strength, improve reliability, eliminate underfill for certain applications, improve throughput, and reduce costs
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SMT 158HA
Slow cure and slow flow, high purity liquid epoxy encapsulant. Designed for large chip applications where air entrapment is a major concern
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DA 150
High temperature, fast curing, highly conductive die attach adhesive. Offers high mechanical strength along with no delamination. Designed for applications which require quick curing along wit...
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SMT 158D
Highly thermally conductivity (> 5 W/mK), diamond filled, fast flowing underfill.
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SMT 158
Nano - underfill designed for package level applications and offers high reliability, high thermal cycling performance, as well as improved mechanical shock performance. In addition, SMT 158 o...
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SMT 160L
Low Temperature Cure, Unfilled No – Flow / Reflowable underfill designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT processes...
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SMT 160
Unfilled No – Flow / Reflowable underfill designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT processes, increase throughput,...
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About the Company:
YINCAE Advanced Materials is a manufacturer of proprietary high performance adhesives, encapsulants and coatings for the electronics industry. Our products are focused on the central processor unit (CPU), providing new technologies to support manufacturing processes from wafer level, to package... (more)
Press Releases:
Main Contact: Wusheng Yin
Wusheng Yin
Other Contacts:
Jon Schmitt
Booth Staff
Sales Coordinator
YINCAE Advanced Materials, LLC.
Eric Hexemer
Booth Staff
Technical Support
YINCAE Advanced Materials, LLC.
Dr. Wusheng Yin
Attendee
President, CEO
YINCAE Advanced Materials, LLC.
Dr. Wushing Yin
Booth Staff
President, CEO
YINCAE Advanced Materials, LLC.
YINCAE Advanced Materials, LLC.'s Wall: (Public Messages)
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