Adhesives and encapsulants for electronics and optoelectronics assembly. Products include electrically conductive and thermally conductive adhesives, ultra-low stress adhesives, ACPs and NCPs,...
Adhesives and encapsulants for electronics and optoelectronics assembly. Products include electrically conductive and thermally conductive adhesives, ultra-low stress adhesives, ACPs and NCPs, UV curable glob top encapsulants, and underfill and reworkable underfill encapsulants for flip chips,... (more)
Adhesives and encapsulants for electronics and optoelectronics assembly. Products include electrically conductive and thermally conductive adhesives, ultra-low stress adhesives, ACPs and NCPs, UV curable glob top encapsulants, and underfill and reworkable underfill encapsulants for flip chips, WLPs, CSPs, BGAs, and POPs. (less)
