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Date
Wed, Feb 28th, 2018
Type
Technical Conference Session
Track
Quality, Reliability, and Test
Speaker
Dennis Willie, Flex Advanced Engineering Group
Francois Lechleiter, MEREDIT
Kunal Shah, LiloTree
WeiFeng Liu, Flextronics
Location
3
Programs: 1
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Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM
S17: PCB Surface Finish/ Reliability
Moderator: WeiFeng Liu, Flextronics
Presenter/Committee Chair: Dennis Willie, Director of Engineering, Flex Advanced Engineering Group (AEG) Labs in Milpitas CA, Flex Advanced Engineering Group
Presenter/Committee Chair: Francois Lechleiter, R&D Manager, MEREDIT
Presenter/Committee Chair: Kunal Shah, Ph.D., LiloTree
Seminar Type: Technical Conference Session
Track: Quality, Reliability, and Test
Location: 3
S17: PCB Surface Finish/ Reliability
Programs: 1
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