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Date
Sat, Feb 24th, 2018
Sun, Feb 25th, 2018
Mon, Feb 26th, 2018
Tue, Feb 27th, 2018
Wed, Feb 28th, 2018
Thu, Mar 1st, 2018
Fri, Mar 2nd, 2018
Type
Standards Development Committee
Track
Assembly Processes for Lead Free and Tin-Lead
Cleaning/Coating/Contamination
Design
Emerging Technologies
Environmental Issues and Compliance
PCB Fabrication and Materials
PCB Fabrication, Materials and Design
Production Design and Development
Quality, Reliability, and Test
Supply Chain/Business Issues
Test
Speaker
Aidan Turnbull Ph.D., BomCheck
Albert Block, National Instruments
Amanda Rickman, Raytheon Systems Company
Amy Hagnauer, Raytheon Systems Company
Bill Vuono, Quorvo
Bradley Schmidt
Bret Bruhn, Coming Soon
Brian Toleno Ph.D., Microsoft Corporation
Brook Sandy-Smith, Indium Corporation
Chris Shaw, Fujitsu Network Communications
Clifford Maddox
David Hillman, Rockwell Collins
David Lober, Kyzen Corporation
David Wynants, Taconic Advanced Dielectric Division
Diana Wyman, AATCC
Dock Brown, DfR Solutions
Doug Sober, Essex Technologies Group Inc.
Douglas Pauls, Rockwell Collins
Dudi Amir, Intel Corporation
Eddie Hofer
Eric Straw, Rockwell Collins
Fonda Wu, Raytheon Systems Company
Gary Carter, ThingWeaver Solutions, LLC
George Milad, Coming Soon
Gerard O'Brian, Solderability Testing & Solutions, Inc.
Greg Wade, Indium Corporation
JB Hollister, Apple, Inc.
James Monarchio, TTM Technologies
Jan Pedersen, Elmatica AS
Jason Gooden, Anthesis
Jason Keeping, Celestica
Jeff Shubrooks, Raytheon Systems Company
Jennie S. Hwang, H-Technologies Group
John Fisher, HDP User Group
John Radman, Coming Soon
John Waryold, HumiSeal Division of Chase Corporation
Joseph Kane, BAE Systems
Joseph Russeau, Precision Analytical Laboratory, Inc.
Karen McConnell CID, Northrop Grumman Corporation
Karen Tellefsen Ph.D., Indium Corporation
Karl Sauter, Oracle America, Inc.
Keith Sellers, NTS-Baltimore
Kevin Kusiak, Lockheed Martin Space Systems Company
Kristopher Moyer CID+, CSUS
Lance Auer, Conductor Anaylsis
Mark Buechner, BAE Systems
Mark Frimann, Coming Soon
Michael Carano, RBP Chemical Technology, Inc.
Michael Ford, Aegis Software
Michael Jawitz, Orbital ATK
Michael Jouppi, Thermal Man Inc.
Mike Bixenman DBA, Kyzen Corporation
Mike Bryant, Coming Soon
Nicholas Koop, TTM Technologies
Nikki Johnson, Total Parts Plys, Inc.
Philip Henaul, Raytheon Systems Company
Rajesh Kumar, Coming Soon
Randy Reed, Coming Soon
Ray Prasad, Ray Prasad Consultancy Group
Rene Martinez, Northrop Grumman Aerospace Systems
Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
Rick Shanks, Pratt & Whitney
Robert Cooke, NASA Johnson Space Center
Rolland Savage, Coming Soon
Russell Shepherd, Coming Soon
Russell Steiner CID+, Allegion
Scott Bowles, L-3 Fuzing and Ordnance Systems
Stephanie Rodgers, Apex Mills, Inc.
Stephen Golemme, Alphabet Inc.
Steven Bowles, All Flex, LLC
Steven Martell, Sonoscan Inc.
Terry Fischer, Coming Soon
Tony Senese, Pansonic Industruial Devices Sales Company of America
Tord Dennis SSC, WSP Parsons Brinckerhoff
Vern Solberg, Solberg Technical Consulting
Vika Hammill, Honeywell Inc. Air Transport Systems
Walter Jager, ECD Compliance
William Ortloff, Raytheon Systems Company
Xianoning Ye
Location
10
11A
11B
12
14A
14B
15A
16B
17A
17B
5B
6E
7A
7B
8
9
West Terrace
General Committee
Assembly and Joining
Base Materials
Cleaning and Coating
Electronic Documentation Technology
Electronic Product Data Description
Embedded Devices
Environment, Health & Saftey (EHS)
Fabrication Processes
Flexible and Rigid-Flex Printed Boards
High Speed/High Frequency Interconnections
Management
Packaged Electronic Components
Printed Board Design Technology
Printed Electronics
Process Control
Product Assurance
Product Reliability
Rigid Printed Boards
Rigid Printed Circuit Boards
Terms and Definitions
Testing
Wearable Electronics/E-Textiles
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Programs: 61 - 70 of 125
Programs per Page
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Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
4-33: Halogen-Free Materials Subcommittee
Presenter/Committee Chair: Doug Sober, Essex Technologies Group Inc.
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Environment, Health & Saftey (EHS)
Location: 10
Tue, Feb 27, 2018 - 1:30 PM to 5:00 PM
5-22AD/5-22AS: Joint Meeting: Req. for Military Systems and Space Electronic Assemblies J-STD-001 Addendum
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Tue, Feb 27, 2018 - 1:30 PM to 3:30 PM
5-22BT: J-STD-001 Technical Training Committee
Seminar Type: Standards Development Committee
General Committee: Assembly and Joining
Location: 17B
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
5-24A: Flux Specifications Task Group
Presenter/Committee Chair: Brook Sandy-Smith, Product Support Specialist, Indium Corporation
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11A
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
5-32E: Conductive Anodic Filament (CAF) Task Group
Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 17A
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
5-33A: Conformal Coating Task Group
Presenter/Committee Chair: John Waryold, Consultant, HumiSeal Division of Chase Corporation
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 15A
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
7-24: Printed Board Process Effects Handbook Subcommittee
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Process Control
Location: 7A
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
D-24C: High Frequency Test Methods Task Group: Frequency-Domain Methods
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: High Speed/High Frequency Interconnections
Location: 16B
Tue, Feb 27, 2018 - 1:30 PM to 5:00 PM
D-31B: IPC-2226A Design Standard
Presenter/Committee Chair: Clifford Maddox
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Printed Board Design Technology
Location: 14B
Tue, Feb 27, 2018 - 1:30 PM to 5:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Presenter/Committee Chair: Rajesh Kumar, Coming Soon
Seminar Type: Standards Development Committee
Track: Emerging Technologies
General Committee: Embedded Devices
Location: 7B
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Programs: 61 - 70 of 125
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