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Date
Sun, Feb 25th, 2018
Mon, Feb 26th, 2018
Thu, Mar 1st, 2018
Type
Professional Development
Track
Assembly Processes for Lead Free and Tin-Lead
Cleaning/Coating/Contamination
Design
Emerging Technologies
Environmental Issues and Compliance
PCB Fabrication and Materials
Quality, Reliability, and Test
Speaker
Bhanu Sood, NASA Goddard Space Flight Center
Bob Klenke, ITM Consulting Inc
Craig Hillman, DfR Solutions
Dale Lee, Plexus Corporation
Douglas Pauls, Rockwell Collins
Gustaf Martensson, Mycronic Technologies AB
James Barnhart, BEST Inc.
Jean-Paul Clech, EPSI
Jennie S. Hwang, H-Technologies Group
Jim Hall, ITM Consulting Inc.
Jim Vanden Hogen, Plexus
Louis Ungar, Advanced Test Engineering Solutions, Inc.
Mark Finstad, Flexible Circuit Technologies, Inc.
Michael Carano, RBP Chemical Technology, Inc.
Nicholas Koop, TTM Technologies
Norman Mier MIT, BEST Inc.
Phil Zarrow, ITM Consulting Inc.
Richard Hartley, RHartley Enterprises
Robert Hanson, Americom Seminars
S. Manian Ramkumar, Rochester Institute of Technology
Susy Webb, Design Science
Thomas Ratledge, Advanjet
Umut Tosun, ZESTRON Americas
Location
Room 10
Room 11A
Room 11B
Room 1A
Room 1B
Room 2
Room 3
Room 4
Room 5A
Room 7B
Room 8
Room 9
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Programs: 11 - 20 of 30
Programs per Page
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Sun, Feb 25, 2018 - 2:00 PM to 5:00 PM
PD10: Solder Joint Reliability in Electronic Assemblies
PD10 Survey:
https://www.surveymonkey.com/r/APEXPD10
Presenter/Committee Chair: Jean-Paul Clech, President, EPSI
Seminar Type: Professional Development
Track: Quality, Reliability, and Test
Location: Room 5A
PD10 Course Material
Sun, Feb 25, 2018 - 2:00 PM to 5:00 PM
PD12: Flexible Circuits from Design through Test: Lessons Learned - Part 2
PD12 Survey:
https://www.surveymonkey.com/r/APEXPD12
Presenter/Committee Chair: Mark Finstad, Senior Appication Engineer, Flexible Circuit Technologies, Inc.
Presenter/Committee Chair: Nicholas Koop, Sr. Field Application Engineer, TTM Technologies
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Location: Room 1A
PD12 Course Material
Mon, Feb 26, 2018 - 9:00 AM to 12:00 PM
PD13: Assembly: Best Practices for Improving Manufacturing Productivity - Part 1
PD13 Survey:
https://www.surveymonkey.com/r/APEXPD13
Presenter/Committee Chair: Phil Zarrow, President and Principal Consultant, ITM Consulting Inc.
Presenter/Committee Chair: Jim Hall, Principal Consultant, ITM Consulting Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Location: Room 4
PD13 Course Material
Mon, Feb 26, 2018 - 9:00 AM to 12:00 PM
PD15: Stencil Printing Process and Solder Paste Inspection An In-Depth Look
PD15 Survey:
https://www.surveymonkey.com/r/APEXPD15
Presenter/Committee Chair: S. Manian Ramkumar, Dean of the College of Applied Science and Technology, Rochester Institute of Technology
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Location: Room 3
PD15 Course Material
Mon, Feb 26, 2018 - 9:00 AM to 12:00 PM
PD18: Preventing Defects and Product Failures
PD18 Survey:
https://www.surveymonkey.com/r/APEXPD18
Presenter/Committee Chair: Jennie S. Hwang, CEO, H-Technologies Group
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Location: Room 1A
PD18 Course Material
Mon, Feb 26, 2018 - 9:00 AM to 12:00 PM
PD14: Advanced Rework: Hands-on BGA Reballing and Leadless Devices - Part 1
PD14 Survey:
https://www.surveymonkey.com/r/APEXPD14
Presenter/Committee Chair: James Barnhart, Master Instructor/Course Developer, BEST Inc.
Presenter/Committee Chair: Norman Mier MIT, Senior Technical Trainer, BEST Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Location: Room 5A
PD14 Course Material
Mon, Feb 26, 2018 - 9:00 AM to 12:00 PM
PD16: Advanced Printed Circuit Board Trouble Shooting. Getting to the root cause of defects - Part 1
PD16 Survey:
https://www.surveymonkey.com/r/APEXPD16
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Location: Room 2
PD16 Course Material
Mon, Feb 26, 2018 - 9:00 AM to 12:00 PM
PD17: Achieving Improved Reliability with Failure Analysis
PD17 Survey:
https://www.surveymonkey.com/r/APEXPD17
Presenter/Committee Chair: Bhanu Sood, Center Lead and Commodity Risk Assessment Engineer, NASA Goddard Space Flight Center
Seminar Type: Professional Development
Track: Quality, Reliability, and Test
Location: Room 1B
PD17 Course Material
Mon, Feb 26, 2018 - 2:00 PM to 5:00 PM
PD21: Reflow Soldering Process and Influence on Defects An In-Depth Look
PD21 Survey:
https://www.surveymonkey.com/r/APEXPD21
Presenter/Committee Chair: S. Manian Ramkumar, Dean of the College of Applied Science and Technology, Rochester Institute of Technology
Seminar Type: Professional Development
Location: Room 3
PD21 Course Material
Mon, Feb 26, 2018 - 2:00 PM to 5:00 PM
PD19: Assembly: Best Practices for Improving Manufacturing Productivity - Part 2
PD19 Survey:
https://www.surveymonkey.com/r/APEXPD19
Presenter/Committee Chair: Phil Zarrow, President and Principal Consultant, ITM Consulting Inc.
Presenter/Committee Chair: Jim Hall, Principal Consultant, ITM Consulting Inc.
Seminar Type: Professional Development
Track: Assembly Processes for Lead Free and Tin-Lead
Location: Room 4
PD19 Course Material
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Programs: 11 - 20 of 30
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