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Date
Tue, Feb 27th, 2018
Wed, Feb 28th, 2018
Thu, Mar 1st, 2018
Type
Technical Conference Session
Track
Assembly Processes for Lead Free and Tin-Lead
Cleaning/Coating/Contamination
Design
Emerging Technologies
PCB Fabrication and Materials
Quality, Reliability, and Test
Supply Chain/Business Issues
Speaker
Anna Lifton, Alpha Assembly
Anthony Lentz, FCT Assembly
Beverley Christian, HDPUG User Group
Bhanu Sood, NASA Goddard Space Flight Center
Bob Lansing, Nokia
Brook Sandy-Smith, Indium Corporation
Christopher Muller, Purafil
Clive Ashmore, ASM-DEK
Daniel Schnee, Heraeus Deutschland GmbH & Co. KG
Dave Rohona, Data I/O Corporation
David Edwards, Henkel Electronic Materials LLC
David Geiger, Flex
David Hoover, TTM Technologies
Denis Jean, Kester
Dennis Willie, Flex Advanced Engineering Group
Derek Dailly, Senju Comtek Corporation
Devanshu Kant, Multek
Ed Dodd, DfR
Edward Laliberte, Northrop Grumman
Eliot Nagler, DeNora Tech & Calumet Electronics Corp
Eric Bastow, Indium Corporation
Eva Rogge, Europlasma
Francois Lechleiter, MEREDIT
Franz Gisin, Multek
Greg Smith, BlueRing Stencils
Gustaf Martensson, Mycronic Technologies AB
Hans-Juergen Funke, Nexperia
Heike Schlessmann, SEHO Systems
Howard Osgood, Flex
James Quilici, Radial Electronics
Jason Keeping, Celestica
Javier Gonzalez, LPKF Laser & Electronics
Jeff Schake, ASM Assembly Systems
Jie Lian, Flex
Jim Bielick, IBM Corporation
Joerg Nolte, ERSA
John Coonrod, Rogers Corporation
Jonathan Urquhart, PVA
Julie Silk, Keysight Technologies
Karl Sauter, Oracle America, Inc.
Kunal Shah, LiloTree
Lars Bruno, Ericsson
Laura Cohen, Continental
Maria Nikolova, MacDermid Enthone
Marina Koledintseva, Oracle America, Inc.
Mark Moyer, Optimal Plus
Martin Goetz, Northrop Grumman Corporation
Martin Wickham, NPL
Mehran Maalekian, AIM Solder
Michael Glickman, Multek
Michael Stevens, NXP Semiconductors
Michelle Gleason, Plexus
Mike Bixenman DBA, Kyzen Corporation
Mike Wolverton, Raytheon Systems Company
Neil Hubble, Akrometrix
Neil Poole Ph.D., Henkel Electronic Materials LLC
Nicholas Koop, TTM Technologies
Ning-Cheng Lee, Indium Corporation
Norbert Holle, Robert Bosch
Prabjit Singh, IBM
Qi Tao, AT&S Austria Technologie and Systemtechnik
Ravi Parthasarathy, ZESTRON Americas
Robert McCord, Northrop Grumman
Roger Franz, TE Connectivitiy
Russell Nowland, Nokia
Saminda Dharmarath, MacDermid Enthone
San Wong, GE
Sandra Heinemann, Atotech Deutschland GmbH
Shantanu Joshi, Koki Solder America
Stanton Rak, Continental Automotive Systems
Steve Butkovich, Test Innovation, LLC
Sven Kramer, Lackwerke Peters GmbH & Co. KG
Todd MacFadden, Bose Corporation
Udo Welzel, Robert Bosch GmbH
Wade Goldman, Draper
WeiFeng Liu, Flextronics
William Bowerman, MacDermid Enthone Electronics Solutions
Yoshiyuki Hiroshima, Fujitsu
Zohair Mehkri, Flex
Location
1A
1B
2
3
4
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Programs: 1 - 10 of 28
Programs per Page
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Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
S01: PCB Plating
Moderator: Todd MacFadden, Component & Reliability Engineer, Bose Corporation
Moderator: Bob Lansing, Nokia
Presenter/Committee Chair: Maria Nikolova, MacDermid Enthone
Presenter/Committee Chair: Saminda Dharmarath, MacDermid Enthone
Presenter/Committee Chair: Eliot Nagler, DeNora Tech & Calumet Electronics Corp
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 1B
S01: PCB Plating
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
S03: Bottom Termination Components
Moderator: Beverley Christian, HDPUG User Group
Presenter/Committee Chair: Anna Lifton, Alpha Assembly
Presenter/Committee Chair: Hans-Juergen Funke, Nexperia
Presenter/Committee Chair: Mike Bixenman DBA, Kyzen Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, and Test
Location: 2
S03: Bottom Termination Components
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
S04: Wearables / Printed Electronics / Emerging Technologies
Moderator: Jeff Schake, Senior Engineer, ASM Assembly Systems
Presenter/Committee Chair: Zohair Mehkri, Flex
Presenter/Committee Chair: Jie Lian, Flex
Presenter/Committee Chair: WeiFeng Liu, Flextronics
Seminar Type: Technical Conference Session
Track: Emerging Technologies
Location: 3
S04: Wearables / Printed Electronics / Emerging Technologies
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
S05: Supply Chain I
Moderator: Steve Butkovich, Test Consultant, Test Innovation, LLC
Presenter/Committee Chair: Mark Moyer, Optimal Plus
Presenter/Committee Chair: Edward Laliberte, Northrop Grumman
Presenter/Committee Chair: Roger Franz, TE Connectivitiy
Moderator: Martin Goetz, Sr. Manager, Northrop Grumman Corporation
Seminar Type: Technical Conference Session
Track: Supply Chain/Business Issues
Location: 4
S05: Supply Chain I
Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM
S06: PCB Fabrication I
Moderator: Stanton Rak, Head of Materials Technology, Continental Automotive Systems
Presenter/Committee Chair: Sven Kramer, Lackwerke Peters GmbH & Co. KG
Presenter/Committee Chair: Sandra Heinemann, Atotech Deutschland GmbH
Presenter/Committee Chair: Javier Gonzalez, Sales Manager, LPKF Laser & Electronics
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 1A
S06: PCB Fabrication I
Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM
S07: Component Reliability 1 (Warpage and Adhesives)
Moderator: Beverley Christian, HDPUG User Group
Presenter/Committee Chair: Jim Bielick, IBM Corporation
Presenter/Committee Chair: Neil Hubble, Akrometrix
Seminar Type: Technical Conference Session
Track: Quality, Reliability, and Test
Location: 2
S07: Component Reliability 1 (Warpage and Adhesives)
Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM
S08: Voiding
Moderator: Brook Sandy-Smith, Product Support Specialist, Indium Corporation
Presenter/Committee Chair: Anthony Lentz, FCT Assembly
Presenter/Committee Chair: Norbert Holle, Robert Bosch
Seminar Type: Technical Conference Session
Track: Assembly Processes for Lead Free and Tin-Lead
Location: 1B
S08: Voiding
Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM
S10: SIR (Surface Insulation Resistance)
Moderator: Karl Sauter, Principal Engineer, Oracle America, Inc.
Presenter/Committee Chair: David Edwards, Henkel Electronic Materials LLC
Presenter/Committee Chair: Eric Bastow, Indium Corporation
Presenter/Committee Chair: Beverley Christian, HDPUG User Group
Seminar Type: Technical Conference Session
Track: Quality, Reliability, and Test
Location: 4
S10: SIR (Surface Insulation Resistance)
Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM
S11: PCB Fabrication II
Moderator: Todd MacFadden, Component & Reliability Engineer, Bose Corporation
Presenter/Committee Chair: James Quilici, Radial Electronics
Presenter/Committee Chair: Michael Glickman, Multek
Presenter/Committee Chair: Bhanu Sood, Center Lead and Commodity Risk Assessment Engineer, NASA Goddard Space Flight Center
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 1B
S11: PCB Fabrication II
Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM
S12: PCB Reliability I
Moderator: Julie Silk, Reliability Program Manager, Keysight Technologies
Presenter/Committee Chair: Devanshu Kant, Multek
Presenter/Committee Chair: Yoshiyuki Hiroshima, Fujitsu
Presenter/Committee Chair: Bhanu Sood, Center Lead and Commodity Risk Assessment Engineer, NASA Goddard Space Flight Center
Seminar Type: Technical Conference Session
Track: Quality, Reliability, and Test
Location: 1A
S12: PCB Reliability I
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Programs: 1 - 10 of 28
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