APEX EXPO 2018 Agenda Planner - Programs

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IPC APEX EXPO 2018

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Programs: 11 - 20 of 28

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	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM S13: Paste Printing I Moderator: Jeff Schake, Senior Engineer, ASM Assembly Systems Presenter/Committee Chair: Greg Smith, BlueRing Stencils Presenter/Committee Chair: Clive Ashmore, ASM-DEK Moderator: Russell Nowland, Repair Strategy & Supplier Management, Nokia Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 3 S13: Paste Printing I
	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM S14: Corrosion Moderator: Karl Sauter, Principal Engineer, Oracle America, Inc. Presenter/Committee Chair: Prabjit Singh, IBM Presenter/Committee Chair: Christopher Muller, Purafil Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 4 S14: Corrosion
	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM S15: Alloy Reliability I Moderator: Udo Welzel, Development Engineer, Robert Bosch GmbH Presenter/Committee Chair: Ning-Cheng Lee, Indium Corporation Presenter/Committee Chair: Derek Dailly, Senju Comtek Corporation Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 2 S15: Alloy Reliability I
	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM S16: PCB Signal Integrity/ High Speed/ High Frequency Moderator: David Hoover, Sr Field Application Engineer, TTM Technologies Presenter/Committee Chair: Marina Koledintseva, Oracle America, Inc. Presenter/Committee Chair: John Coonrod, Technical Services Engineer, Rogers Corporation Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 1A S16: PCB Signal Integrity/ High Speed/ High Frequency
	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM S17: PCB Surface Finish/ Reliability Moderator: WeiFeng Liu, Flextronics Presenter/Committee Chair: Dennis Willie, Director of Engineering, Flex Advanced Engineering Group (AEG) Labs in Milpitas CA, Flex Advanced Engineering Group Presenter/Committee Chair: Francois Lechleiter, R&D Manager, MEREDIT Presenter/Committee Chair: Kunal Shah, Ph.D., LiloTree Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 3 S17: PCB Surface Finish/ Reliability
	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM S18: Cleaning Moderator: Denis Jean, Technology Manager, Kester Presenter/Committee Chair: Mike Bixenman DBA, Kyzen Corporation Presenter/Committee Chair: Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 2 Cleaning
	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM S19: Solder Paste Testing and Development Moderator: Brook Sandy-Smith, Product Support Specialist, Indium Corporation Presenter/Committee Chair: Neil Poole Ph.D., Henkel Electronic Materials LLC Presenter/Committee Chair: Shantanu Joshi, Koki Solder America Presenter/Committee Chair: Laura Cohen, Continental Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1B S19: Solder Paste Testing and Development
	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM S25: Design Moderator: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Presenter/Committee Chair: Michelle Gleason, Plexus Presenter/Committee Chair: San Wong, GE Presenter/Committee Chair: Robert McCord, Advisory Engineer, Northrop Grumman Seminar Type: Technical Conference Session Track: Design Location: 4 S25: Design
	Wed, Feb 28, 2018 - 3:30 PM to 4:30 PM S20: Rework Moderator: Russell Nowland, Repair Strategy & Supplier Management, Nokia Presenter/Committee Chair: Joerg Nolte, ERSA Presenter/Committee Chair: Lars Bruno, Ericsson Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 3 S20: Rework
	Wed, Feb 28, 2018 - 3:30 PM to 4:30 PM S23: Alloy Reliability II Moderator: Udo Welzel, Development Engineer, Robert Bosch GmbH Presenter/Committee Chair: Mehran Maalekian, AIM Solder Presenter/Committee Chair: Ning-Cheng Lee, Indium Corporation Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 2 S23: Alloy Reliability II

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Programs: 11 - 20 of 28

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