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IPC APEX EXPO 2018
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
S03: Bottom Termination Components
Moderator: Beverley Christian, HDPUG User Group
Presenter/Committee Chair: Anna Lifton, Alpha Assembly
Presenter/Committee Chair: Hans-Juergen Funke, Nexperia
Presenter/Committee Chair: Mike Bixenman DBA, Kyzen Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, and Test
Location: 2
S03: Bottom Termination Components
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
S04: Wearables / Printed Electronics / Emerging Technologies
Moderator: Jeff Schake, Senior Engineer, ASM Assembly Systems
Presenter/Committee Chair: Zohair Mehkri, Flex
Presenter/Committee Chair: Jie Lian, Flex
Presenter/Committee Chair: WeiFeng Liu, Flextronics
Seminar Type: Technical Conference Session
Track: Emerging Technologies
Location: 3
S04: Wearables / Printed Electronics / Emerging Technologies
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
S05: Supply Chain I
Moderator: Steve Butkovich, Test Consultant, Test Innovation, LLC
Presenter/Committee Chair: Mark Moyer, Optimal Plus
Presenter/Committee Chair: Edward Laliberte, Northrop Grumman
Presenter/Committee Chair: Roger Franz, TE Connectivitiy
Moderator: Martin Goetz, Sr. Manager, Northrop Grumman Corporation
Seminar Type: Technical Conference Session
Track: Supply Chain/Business Issues
Location: 4
S05: Supply Chain I
Tue, Feb 27, 2018 - 2:00 PM to 4:00 PM
U.S. DoD Changes and How they May Impact IPC Members
Location: 6C
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
3-11F:UL/CSA Task Group
Presenter/Committee Chair: Doug Sober, Essex Technologies Group Inc.
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Base Materials
Location: 10
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
5-22 ROSE Working Group
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 7A
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Presenter/Committee Chair: Jennie S. Hwang, CEO, H-Technologies Group
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11A
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Test Methods Task Group
Presenter/Committee Chair: Reza Ghaffarian Ph.D., Principal Engineer, Jet Propulsion Laboratory
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Product Reliability
Location: 17A
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
7-31FT: IPC/WHMA-A-620 Training Advisory Committee Meeting
Seminar Type: Standards Development Committee
General Committee: Assembly and Joining
Location: 17B
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
7-34
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Product Assurance
Location: 15A
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