APEX EXPO 2018 Agenda Planner - Programs

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IPC APEX EXPO 2018

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Programs: 151 - 160 of 219

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	Wed, Feb 28, 2018 - 10:15 AM to 3:00 PM 5-33B: Solder Mask Performance Task Group Presenter/Committee Chair: Fonda Wu, Raytheon Systems Company Presenter/Committee Chair: Rene Martinez, Northrop Grumman Aerospace Systems Seminar Type: Standards Development Committee Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 11A
	Wed, Feb 28, 2018 - 10:15 AM to 12:00 PM D-12: Flexible Circuits Specifications Subcommittee Presenter/Committee Chair: Nicholas Koop, Sr. Field Application Engineer, TTM Technologies Seminar Type: Standards Development Committee Track: PCB Fabrication and Materials General Committee: Flexible and Rigid-Flex Printed Boards Location: 11B
	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM 7-34T: IPC-7711/7721 Training Advisory Committee Seminar Type: Standards Development Committee General Committee: Product Assurance Location: 12
	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM BZ5: How E-Textiles are Stretching the Boundaries of Electronics to Meet the Challenges of Today and Tomorrow Moderator: Chris Jorgensen, Director, Technology Transfer, IPC Presenter/Committee Chair: Connie Huffa, Fabdesigns Inc., Presenter/Committee Chair: Stephanie Rodgers, Apex Mills, Inc. Presenter/Committee Chair: Diana Wyman, AATCC Seminar Type: Buzz Session Location: 5A BZ5 - Tara Dunn_E-Textiles Buzz Session Intro Slides
	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM S11: PCB Fabrication II Moderator: Todd MacFadden, Component & Reliability Engineer, Bose Corporation Presenter/Committee Chair: James Quilici, Radial Electronics Presenter/Committee Chair: Michael Glickman, Multek Presenter/Committee Chair: Bhanu Sood, Center Lead and Commodity Risk Assessment Engineer, NASA Goddard Space Flight Center Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 1B S11: PCB Fabrication II
	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM S12: PCB Reliability I Moderator: Julie Silk, Reliability Program Manager, Keysight Technologies Presenter/Committee Chair: Devanshu Kant, Multek Presenter/Committee Chair: Yoshiyuki Hiroshima, Fujitsu Presenter/Committee Chair: Bhanu Sood, Center Lead and Commodity Risk Assessment Engineer, NASA Goddard Space Flight Center Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 1A S12: PCB Reliability I
	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM S13: Paste Printing I Moderator: Jeff Schake, Senior Engineer, ASM Assembly Systems Presenter/Committee Chair: Greg Smith, BlueRing Stencils Presenter/Committee Chair: Clive Ashmore, ASM-DEK Moderator: Russell Nowland, Repair Strategy & Supplier Management, Nokia Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 3 S13: Paste Printing I
	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM S14: Corrosion Moderator: Karl Sauter, Principal Engineer, Oracle America, Inc. Presenter/Committee Chair: Prabjit Singh, IBM Presenter/Committee Chair: Christopher Muller, Purafil Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 4 S14: Corrosion
	Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM S15: Alloy Reliability I Moderator: Udo Welzel, Development Engineer, Robert Bosch GmbH Presenter/Committee Chair: Ning-Cheng Lee, Indium Corporation Presenter/Committee Chair: Derek Dailly, Senju Comtek Corporation Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 2 S15: Alloy Reliability I
	Wed, Feb 28, 2018 - 12:00 PM to 1:00 PM Tradeshow Committee Meeting(By Invitation) Seminar Type: Standards Development Committee Location: 14A

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Programs: 151 - 160 of 219

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