APEX EXPO 2018 Agenda Planner - Programs

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IPC APEX EXPO 2018

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Programs: 171 - 180 of 219

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	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM S17: PCB Surface Finish/ Reliability Moderator: WeiFeng Liu, Flextronics Presenter/Committee Chair: Dennis Willie, Director of Engineering, Flex Advanced Engineering Group (AEG) Labs in Milpitas CA, Flex Advanced Engineering Group Presenter/Committee Chair: Francois Lechleiter, R&D Manager, MEREDIT Presenter/Committee Chair: Kunal Shah, Ph.D., LiloTree Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 3 S17: PCB Surface Finish/ Reliability
	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM S18: Cleaning Moderator: Denis Jean, Technology Manager, Kester Presenter/Committee Chair: Mike Bixenman DBA, Kyzen Corporation Presenter/Committee Chair: Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 2 Cleaning
	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM S19: Solder Paste Testing and Development Moderator: Brook Sandy-Smith, Product Support Specialist, Indium Corporation Presenter/Committee Chair: Neil Poole Ph.D., Henkel Electronic Materials LLC Presenter/Committee Chair: Shantanu Joshi, Koki Solder America Presenter/Committee Chair: Laura Cohen, Continental Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1B S19: Solder Paste Testing and Development
	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM S25: Design Moderator: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Presenter/Committee Chair: Michelle Gleason, Plexus Presenter/Committee Chair: San Wong, GE Presenter/Committee Chair: Robert McCord, Advisory Engineer, Northrop Grumman Seminar Type: Technical Conference Session Track: Design Location: 4 S25: Design
	Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM SPVC: IPC Solder Products Value Council Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc. Seminar Type: Standards Development Committee Location: 9
	Wed, Feb 28, 2018 - 2:00 PM to 3:00 PM PCB Suppliers Council Steering Committee Seminar Type: Standards Development Committee Location: 8
	Wed, Feb 28, 2018 - 2:30 PM to 3:30 PM Ice Cream Social on the Show Floor Seminar Type: Special Event
	Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM 5-32C: Bare Board Cleanliness Assessment Task Group Presenter/Committee Chair: David Lober, Process Chemist, Kyzen Corporation Seminar Type: Standards Development Committee Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 11A
	Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM 8-41: Technology Roadmap Subcommittee Presenter/Committee Chair: John Fisher, HDP User Group Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc. Seminar Type: Standards Development Committee Track: Supply Chain/Business Issues General Committee: Management Location: 8
	Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM B-11: 3-D Electronic Packages Subcommittee Presenter/Committee Chair: Dudi Amir, Intel Corporation Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting Seminar Type: Standards Development Committee Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Packaged Electronic Components Location: 17B

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Programs: 171 - 180 of 219

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