APEX EXPO 2018 Agenda Planner - Programs

Contact Us | About APEX EXPO 2018 Agenda Planner

Login to APEX EXPO 2018 Agenda Planner Now or Register for IPC APEX EXPO 2018 Now.

IPC APEX EXPO 2018

Print List of Programs

Search

1 2 3 4 ... 17 18 19 20 21 22

Programs: 181 - 190 of 219

Programs per Page

	Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM D-13: Flexible Circuits Base Materials Subcommittee Seminar Type: Standards Development Committee Track: PCB Fabrication and Materials General Committee: Flexible and Rigid-Flex Printed Boards Location: 11B
	Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM D-21: High Speed/High Frequency Design Subcommittee Presenter/Committee Chair: Scott Bowles, L-3 Fuzing and Ordnance Systems Seminar Type: Standards Development Committee Track: PCB Fabrication and Materials General Committee: High Speed/High Frequency Interconnections Location: 7B
	Wed, Feb 28, 2018 - 3:30 PM to 5:00 PM 5-31G: Stencil Cleaning Task Group Presenter/Committee Chair: Greg Wade, Global Technical Support Engineer, Indium Corporation Presenter/Committee Chair: Mike Bixenman DBA, Kyzen Corporation Seminar Type: Standards Development Committee Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 14B
	Wed, Feb 28, 2018 - 3:30 PM to 4:30 PM BZ10: Industry 4.0 Moderator: Nancy Jaster, Manager, IPC Design Programs, IPC Presenter/Committee Chair: Michael Ford, Aegis Software Presenter/Committee Chair: Chris Shaw, Fujitsu Network Communications Presenter/Committee Chair: Hemant Shah, Cadence Design Systems Seminar Type: Buzz Session Location: 5B BZ10 - Michael Ford_Aegis Software
	Wed, Feb 28, 2018 - 3:30 PM to 4:30 PM BZ8: Pulse of the Electronics Industry and Business Outlook Presenter/Committee Chair: Sharon Starr, Director, Market Research, IPC Seminar Type: Buzz Session Location: 5A BZ8: Pulse of the Electronics Industry and Business Outlook
	Wed, Feb 28, 2018 - 3:30 PM to 4:30 PM S20: Rework Moderator: Russell Nowland, Repair Strategy & Supplier Management, Nokia Presenter/Committee Chair: Joerg Nolte, ERSA Presenter/Committee Chair: Lars Bruno, Ericsson Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 3 S20: Rework
	Wed, Feb 28, 2018 - 3:30 PM to 4:30 PM S23: Alloy Reliability II Moderator: Udo Welzel, Development Engineer, Robert Bosch GmbH Presenter/Committee Chair: Mehran Maalekian, AIM Solder Presenter/Committee Chair: Ning-Cheng Lee, Indium Corporation Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 2 S23: Alloy Reliability II
	Wed, Feb 28, 2018 - 3:30 PM to 4:30 PM S24: Component Reliability 2 (X-ray and EOS) Moderator: Steve Butkovich, Test Consultant, Test Innovation, LLC Presenter/Committee Chair: Dave Rohona, Data I/O Corporation Presenter/Committee Chair: Michael Stevens, NXP Semiconductors Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 1A Component Reliability 2 (X-ray and EOS)
	Wed, Feb 28, 2018 - 3:30 PM to 4:30 PM S30: Paste Printing II Moderator: Jeff Schake, Senior Engineer, ASM Assembly Systems Presenter/Committee Chair: David Geiger, Flex Presenter/Committee Chair: Gustaf Martensson, Innovation Field Expert, Mycronic Technologies AB Moderator: WeiFeng Liu, Flextronics Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 4 S30: Paste Printing II
	Wed, Feb 28, 2018 - 5:15 PM to 7:00 PM MIT/Certification Center Meet and Greet Seminar Type: Special Event Location: 6D

1 2 3 4 ... 17 18 19 20 21 22

Programs: 181 - 190 of 219

Go to Page

GoExpo stable-v4.15.265, Copyright © 2006-2024 Core-apps LLC.

Privacy · Legal · Contact · About