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IPC APEX EXPO 2018
Sat, Feb 24, 2018 - 8:00 AM to 5:00 PM
7-31B: IPC-A-610 Task Group
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Product Assurance
Location: 15A
Sun, Feb 25, 2018 - 8:00 AM to 3:00 PM
5-22A: J-STD-001 Task Group
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Sun, Feb 25, 2018 - 8:00 AM to 4:15 PM
7-31A/D-33A: Joint Meeting - IPC-A-600 and IPC-6012 Task Groups
Presenter/Committee Chair: Mark Buechner, Principal Quality Assurance En, BAE Systems
Presenter/Committee Chair: Randy Reed, Coming Soon
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Circuit Boards
Location: 6E
Sun, Feb 25, 2018 - 9:00 AM to 4:00 PM
2-19A: Critical Components Traceability Task Group
Presenter/Committee Chair: Michael Ford, Aegis Software
Seminar Type: Standards Development Committee
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 14A
Sun, Feb 25, 2018 - 1:00 PM to 4:30 PM
2-18K: Material Declaration Data Exchange for Aerospace and Defense Task Group
Presenter/Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Presenter/Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 11B
Sun, Feb 25, 2018 - 1:00 PM to 3:00 PM
2-40: Electronic Documentation Technology Committee
Presenter/Committee Chair: Gary Carter, Principal, ThingWeaver Solutions, LLC
Seminar Type: Standards Development Committee
Track: Production Design and Development
General Committee: Electronic Documentation Technology
Location: 11A
Sun, Feb 25, 2018 - 1:30 PM to 5:00 PM
iNEMI 2019 Roadmap TWG (Technology Working Group) Kickoff & PEG (Product Emulator Group) Workshop
Seminar Type: Standards Development Committee
Location: 5B
Sun, Feb 25, 2018 - 3:00 PM to 4:30 PM
5-20/7-30: Assembly & Joining Committee - By Invitation Only
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Assembly and Joining
Location: 11A
Sun, Feb 25, 2018 - 4:00 PM to 6:00 PM
CCC: Committee Chairman Council (By Invitation)
Seminar Type: Standards Development Committee
Location: 15A
Sun, Feb 25, 2018 - 6:00 PM to 7:00 PM
IPC Committee Chairmen's Reception(By Invitation )
Seminar Type: Standards Development Committee
Location: West Terrace
Mon, Feb 26, 2018 - 8:00 AM to 3:00 PM
2-18K: Material Declaration Data Exchange for Aerospace and Defense Task Group
Presenter/Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Presenter/Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14B
Mon, Feb 26, 2018 - 8:00 AM to 10:00 AM
1-10B: Current Carrying Capacity Task Group
Presenter/Committee Chair: Michael Jouppi, President, Thermal Man Inc.
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Printed Board Design Technology
Location: 11A
Mon, Feb 26, 2018 - 8:00 AM to 12:00 PM
2-17: Connected Factory Initative
Seminar Type: Standards Development Committee
General Committee: Electronic Product Data Description
Location: 7B
Mon, Feb 26, 2018 - 8:00 AM to 12:00 PM
3-11: Laminate/Prepreg Materials Subcommittee
Presenter/Committee Chair: Tony Senese, Manager, Business Development, Pansonic Industruial Devices Sales Company of America
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 8
Mon, Feb 26, 2018 - 8:00 AM to 5:00 PM
5-22A/7-31B: Synergy Meeting - J-STD-001 & IPC-A-610 Task Groups
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Mon, Feb 26, 2018 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Specification Task Group
Presenter/Committee Chair: David Hillman, Principal Material & Process Engineer, Rockwell Collins
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 9
Mon, Feb 26, 2018 - 8:00 AM to 10:00 AM
5-32A: Ion Chromatography/Ionic Conductivity Task Group
Presenter/Committee Chair: John Radman, Coming Soon
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 11B
Mon, Feb 26, 2018 - 8:00 AM to 12:00 PM
7-31FS: IPC/WHMA-A-620 Space Electronic Assemblies Addendum Task Group
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Product Assurance
Location: 14A
Mon, Feb 26, 2018 - 8:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Presenter/Committee Chair: Robert Cooke, NASA Johnson Space Center
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Product Assurance
Location: 17A
Mon, Feb 26, 2018 - 8:00 AM to 10:00 AM
D-32: Thermal Stress Test Methodology Subcommittee
Presenter/Committee Chair: James Monarchio, TTM Technologies
Seminar Type: Standards Development Committee
Track: Test
General Committee: Rigid Printed Circuit Boards
Location: 10
Mon, Feb 26, 2018 - 9:00 AM to 5:00 PM

iNEMI 2019 Roadmap TWG (Technology Working Group) Kickoff & PEG (Product Emulator Group) Workshop

Seminar Type: Standards Development Committee
Location: 5B
Mon, Feb 26, 2018 - 9:00 AM to 12:00 PM
2-19B: Trusted Supplier Task Group
Seminar Type: Standards Development Committee
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 17B
Mon, Feb 26, 2018 - 10:00 AM to 12:00 PM
5-21H: Bottom Termination Components (BTC) Task Group
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 12
Mon, Feb 26, 2018 - 10:15 AM to 12:00 PM
5-23A: Printed Circuit Board Solderability Specifications Task Group
Presenter/Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 9
Mon, Feb 26, 2018 - 10:15 AM to 12:00 PM
5-31J: Cleaning Compatibility Task Group
Presenter/Committee Chair: Eddie Hofer, M&P Engineer
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 11B
Mon, Feb 26, 2018 - 10:15 AM to 12:00 PM
7-11: Test Methods Subcommittee
Presenter/Committee Chair: Joseph Russeau, Precision Analytical Laboratory, Inc.
Seminar Type: Standards Development Committee
Track: Test
General Committee: Testing
Location: 11A
Mon, Feb 26, 2018 - 10:15 AM to 12:00 PM
D-36: Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee
Presenter/Committee Chair: Albert Block, National Instruments
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Rigid Printed Circuit Boards
Location: 10
Mon, Feb 26, 2018 - 12:00 PM to 1:30 PM
IPC Government Relations Steering Committee Meeting (Invitation Only)
Seminar Type: Standards Development Committee
Location: 7A
Mon, Feb 26, 2018 - 1:30 PM to 5:00 PM
1-10C: Test Coupon and Artwork Generation Task Group
Presenter/Committee Chair: Philip Henaul, Development Engineer, Raytheon Systems Company
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Printed Board Design Technology
Location: 10
Mon, Feb 26, 2018 - 1:30 PM to 5:00 PM
1-14: DFX Standards Subcommittee
Presenter/Committee Chair: Dock Brown, Sr. Member of Technical Staff, DfR Solutions
Presenter/Committee Chair: Stephen Golemme, Alphabet Inc.
Presenter/Committee Chair: Karen McConnell CID, Manager, EDA, Northrop Grumman Corporation
Seminar Type: Standards Development Committee
Track: PCB Fabrication, Materials and Design
General Committee: Printed Board Design Technology
Location: 14A
Mon, Feb 26, 2018 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Presenter/Committee Chair: Mike Bryant, Coming Soon
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 8
Mon, Feb 26, 2018 - 1:30 PM to 3:00 PM
5-33C: Conformal Coat Handbook
Presenter/Committee Chair: Amy Hagnauer, Manufacturing Engineer, Raytheon Systems Company
Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 11B
Mon, Feb 26, 2018 - 1:30 PM to 5:00 PM
7-31K: Wire H
Seminar Type: Standards Development Committee
Track: Design
General Committee: Product Assurance
Location: 7B
Mon, Feb 26, 2018 - 1:30 PM to 5:00 PM
7-31MT: IPC-A-640 Fiber Optic Training Advisory Committee
Seminar Type: Standards Development Committee
General Committee: Product Assurance
Location: 17A
Mon, Feb 26, 2018 - 1:30 PM to 3:00 PM
B-10A/JEDEC: Joint Meeting: Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1
Presenter/Committee Chair: Steven Martell, Sonoscan Inc.
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Packaged Electronic Components
Location: 12
Mon, Feb 26, 2018 - 3:00 PM to 5:00 PM
2-18: Supplier Declaration Subcommittee
Presenter/Committee Chair: Tord Dennis SSC, Electronics Engrg Asc Mgr, WSP Parsons Brinckerhoff
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14B
Mon, Feb 26, 2018 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable Task Group
Presenter/Committee Chair: Terry Fischer, Coming Soon
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 8
Mon, Feb 26, 2018 - 3:15 PM to 5:00 PM
5-32B: SIR and Electrochemical Migration Task Group
Presenter/Committee Chair: Keith Sellers, Operations Manager, NTS-Baltimore
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 11B
Mon, Feb 26, 2018 - 3:15 PM to 5:00 PM
5-33g: Low Pressure Molding Task Group
Presenter/Committee Chair: Russell Steiner CID+, Sr. PCB Lead Designer Engineer, Allegion
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 9
Mon, Feb 26, 2018 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Presenter/Committee Chair: Joseph Kane, BAE Systems
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Rigid Printed Circuit Boards
Location: 11A
Mon, Feb 26, 2018 - 3:15 PM to 5:00 PM
D33AM: IPC-6012 Medical Device Addendum Task Group
Presenter/Committee Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Boards
Location: 17B
Mon, Feb 26, 2018 - 5:00 PM to 7:00 PM
TAEC: Technical Activities Executive Committee (By Invitation)
Seminar Type: Standards Development Committee
General Committee: Management
Location: 15A
Tue, Feb 27, 2018 - 7:00 AM to 8:00 AM
Hall of Fame Breakfast(By Invitation)
Seminar Type: Standards Development Committee
Location: 8
Tue, Feb 27, 2018 - 10:00 AM to 12:00 PM
2-18K: Material Declaration Data Exchange for Aerospace and Defense Task Group
Presenter/Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Presenter/Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 8
Tue, Feb 27, 2018 - 10:00 AM to 12:00 PM
2-30: Terms and Definitions Committee
Presenter/Committee Chair: Steven Bowles, All Flex, LLC
Presenter/Committee Chair: Vika Hammill, Staff Engineer, Honeywell Inc. Air Transport Systems
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Terms and Definitions
Location: 14B
Tue, Feb 27, 2018 - 10:00 AM to 11:00 AM
5-20T: General IPC Training Committees Meeting - All Training
Seminar Type: Standards Development Committee
General Committee: Assembly and Joining
Location: 17B
Tue, Feb 27, 2018 - 10:00 AM to 12:00 PM
5-21A: IPC-7070 Task Group
Presenter/Committee Chair: Kristopher Moyer CID+, Electrical engineer, CSUS
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 9
Tue, Feb 27, 2018 - 10:00 AM to 12:00 PM
5-22H: Thermal Profiling Guide Task Group
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Seminar Type: Standards Development Committee
General Committee: Assembly and Joining
Location: 7B
Tue, Feb 27, 2018 - 10:00 AM to 12:00 PM
5-33UAT Ultra thin coating WG
Presenter/Committee Chair: Amanda Rickman, Raytheon Systems Company
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 17A
Tue, Feb 27, 2018 - 10:00 AM to 12:00 PM
5-45: Reflow Oven
Seminar Type: Standards Development Committee
General Committee: Process Control
Location: 12
Tue, Feb 27, 2018 - 10:00 AM to 12:00 PM
D-24B: Bereskin Test Method Task Group
Presenter/Committee Chair: David Wynants, Taconic Advanced Dielectric Division
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: High Speed/High Frequency Interconnections
Location: 16B
Tue, Feb 27, 2018 - 10:00 AM to 12:00 PM
V-TSL: Technology Solutions Committee
Seminar Type: Standards Development Committee
Location: 7A
Tue, Feb 27, 2018 - 10:15 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Presenter/Committee Chair: Rolland Savage, Coming Soon
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 10
Tue, Feb 27, 2018 - 10:15 AM to 12:00 PM
5-21K: IPC-SM-817 SMT Adhesive Task Group
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Tue, Feb 27, 2018 - 10:15 AM to 12:00 PM
5-22ARR: J-STD-001/Conformal Coating Material & Application Industry Assessment
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
Tue, Feb 27, 2018 - 10:15 AM to 5:00 PM
7-31BV: Automotive Addendum Task Group
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Product Assurance
Location: 14A
Tue, Feb 27, 2018 - 11:00 AM to 12:00 PM

2-16/2-17/2-19a Joint Meeting: Overview of The Future of Digital Manufacturing – industry 4.0 and beyond

Seminar Type: Standards Development Committee
Location: 11A
Tue, Feb 27, 2018 - 11:15 AM to 12:00 PM
7-31BT: IPC-A-610 Technical Training Committee
Seminar Type: Standards Development Committee
General Committee: Product Assurance
Location: 17B
Tue, Feb 27, 2018 - 1:30 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Presenter/Committee Chair: Karen McConnell CID, Manager, EDA, Northrop Grumman Corporation
Presenter/Committee Chair: Kristopher Moyer CID+, Electrical engineer, CSUS
Seminar Type: Standards Development Committee
Track: Design
General Committee: Printed Board Design Technology
Location: 9
Tue, Feb 27, 2018 - 1:30 PM to 5:00 PM
2-18H: Conflict Minerals Data Exchange Task Group
Presenter/Committee Chair: Aidan Turnbull Ph.D., Managing Director, BomCheck
Presenter/Committee Chair: Nikki Johnson, Total Parts Plys, Inc.
Presenter/Committee Chair: Eric Straw, Pr. Project Manager, Rockwell Collins
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 8
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
4-33: Halogen-Free Materials Subcommittee
Presenter/Committee Chair: Doug Sober, Essex Technologies Group Inc.
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Environment, Health & Saftey (EHS)
Location: 10
Tue, Feb 27, 2018 - 1:30 PM to 5:00 PM
5-22AD/5-22AS: Joint Meeting: Req. for Military Systems and Space Electronic Assemblies J-STD-001 Addendum
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11B
Tue, Feb 27, 2018 - 1:30 PM to 3:30 PM
5-22BT: J-STD-001 Technical Training Committee
Seminar Type: Standards Development Committee
General Committee: Assembly and Joining
Location: 17B
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
5-24A: Flux Specifications Task Group
Presenter/Committee Chair: Brook Sandy-Smith, Product Support Specialist, Indium Corporation
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11A
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
5-32E: Conductive Anodic Filament (CAF) Task Group
Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 17A
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
5-33A: Conformal Coating Task Group
Presenter/Committee Chair: John Waryold, Consultant, HumiSeal Division of Chase Corporation
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 15A
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
7-24: Printed Board Process Effects Handbook Subcommittee
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Process Control
Location: 7A
Tue, Feb 27, 2018 - 1:30 PM to 3:00 PM
D-24C: High Frequency Test Methods Task Group: Frequency-Domain Methods
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: High Speed/High Frequency Interconnections
Location: 16B
Tue, Feb 27, 2018 - 1:30 PM to 5:00 PM
D-31B: IPC-2226A Design Standard
Presenter/Committee Chair: Clifford Maddox
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Printed Board Design Technology
Location: 14B
Tue, Feb 27, 2018 - 1:30 PM to 5:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Presenter/Committee Chair: Rajesh Kumar, Coming Soon
Seminar Type: Standards Development Committee
Track: Emerging Technologies
General Committee: Embedded Devices
Location: 7B
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
3-11F:UL/CSA Task Group
Presenter/Committee Chair: Doug Sober, Essex Technologies Group Inc.
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Base Materials
Location: 10
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
5-22 ROSE Working Group
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 7A
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Presenter/Committee Chair: Jennie S. Hwang, CEO, H-Technologies Group
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 11A
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Test Methods Task Group
Presenter/Committee Chair: Reza Ghaffarian Ph.D., Principal Engineer, Jet Propulsion Laboratory
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Product Reliability
Location: 17A
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
7-31FT: IPC/WHMA-A-620 Training Advisory Committee Meeting
Seminar Type: Standards Development Committee
General Committee: Assembly and Joining
Location: 17B
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
7-34
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Product Assurance
Location: 15A
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
D-24D: High Frequency Loss Test Methods Task Group
Presenter/Committee Chair: Xianoning Ye
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: High Speed/High Frequency Interconnections
Location: 16B
Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM
D-33A: IPC-6012 Automotive Addendum Task Group
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Circuit Boards
Location: 12
Wed, Feb 28, 2018 - 7:30 AM to 9:00 AM
2-16D: IPC-2581 User's Group
Presenter/Committee Chair: Kevin Kusiak, Lockheed Martin Space Systems Company
Presenter/Committee Chair: Gary Carter, Principal, ThingWeaver Solutions, LLC
Seminar Type: Standards Development Committee
Track: PCB Fabrication, Materials and Design
General Committee: Electronic Product Data Description
Location: 8
Wed, Feb 28, 2018 - 8:00 AM to 12:00 PM
2-18B: Materials Delcartion Task Group
Presenter/Committee Chair: Aidan Turnbull Ph.D., Managing Director, BomCheck
Presenter/Committee Chair: Mark Frimann, Coming Soon
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 7B
Wed, Feb 28, 2018 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 16B
Wed, Feb 28, 2018 - 8:00 AM to 10:00 AM
5-21G: Flip Chip Mounting Task Group
Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 10
Wed, Feb 28, 2018 - 8:00 AM to 10:00 AM
5-22F: J-STD-001 Handbook Task Group
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 14B
Wed, Feb 28, 2018 - 8:00 AM to 10:00 AM
5-24B: Solder Paste Task Group
Presenter/Committee Chair: Karen Tellefsen Ph.D., Senior Chemist, Indium Corporation
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 9
Wed, Feb 28, 2018 - 8:00 AM to 10:00 AM
5-33AWG: Conformal Coating Requirements Working Group
Presenter/Committee Chair: Douglas Pauls, Principle Materials Process Engineer, Rockwell Collins
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 11A
Wed, Feb 28, 2018 - 8:00 AM to 9:00 AM
7-31AT: IPC-A-600 Technical Training Committee
Seminar Type: Standards Development Committee
General Committee: Product Assurance
Location: 12
Wed, Feb 28, 2018 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Product Assurance
Location: 15A
Wed, Feb 28, 2018 - 8:00 AM to 12:00 PM
7-35: Assembly and Joining Handbook Subcommittee
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Product Assurance
Location: 17A
Wed, Feb 28, 2018 - 8:00 AM to 10:00 AM
D-15: Flexible Circuits Test Methods Subcommittee
Presenter/Committee Chair: Russell Shepherd, Coming Soon
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 11B
Wed, Feb 28, 2018 - 8:00 AM to 10:00 AM
D-22: High Speed/High Frequency Board Performance Subcommittee
Presenter/Committee Chair: Lance Auer, Conductor Anaylsis
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: High Speed/High Frequency Interconnections
Location: 17B
Wed, Feb 28, 2018 - 9:00 AM to 12:00 PM
2-16: Product Data Description (2581)
Presenter/Committee Chair: Gary Carter, Principal, ThingWeaver Solutions, LLC
Presenter/Committee Chair: Chris Shaw, Fujitsu Network Communications
Seminar Type: Standards Development Committee
Track: PCB Fabrication, Materials and Design
General Committee: Electronic Product Data Description
Location: 8
Wed, Feb 28, 2018 - 9:15 AM to 10:15 AM
D-33AT: IPC-6012 Technical Training Committe
Seminar Type: Standards Development Committee
General Committee: Rigid Printed Boards
Location: 12
Wed, Feb 28, 2018 - 9:30 AM to 11:00 AM
SMEMA Council Meeting(By Invitation Only)
Seminar Type: Standards Development Committee
Location: 14A
Wed, Feb 28, 2018 - 10:15 AM to 12:00 PM
4-14: Plating Processes Subcommittee
Presenter/Committee Chair: George Milad, Coming Soon
Presenter/Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Fabrication Processes
Location: 14B
Wed, Feb 28, 2018 - 10:15 AM to 12:00 PM
5-21F: Ball Grid Array Task Group
Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 10
Wed, Feb 28, 2018 - 10:15 AM to 3:00 PM
5-33B: Solder Mask Performance Task Group
Presenter/Committee Chair: Fonda Wu, Raytheon Systems Company
Presenter/Committee Chair: Rene Martinez, Northrop Grumman Aerospace Systems
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 11A
Wed, Feb 28, 2018 - 10:15 AM to 12:00 PM
D-12: Flexible Circuits Specifications Subcommittee
Presenter/Committee Chair: Nicholas Koop, Sr. Field Application Engineer, TTM Technologies
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 11B
Wed, Feb 28, 2018 - 10:30 AM to 12:00 PM
7-34T: IPC-7711/7721 Training Advisory Committee
Seminar Type: Standards Development Committee
General Committee: Product Assurance
Location: 12
Wed, Feb 28, 2018 - 12:00 PM to 1:00 PM
Tradeshow Committee Meeting(By Invitation)
Seminar Type: Standards Development Committee
Location: 14A
Wed, Feb 28, 2018 - 1:30 PM to 5:00 PM
4-30: Environment, Health & Safety Committee
Presenter/Committee Chair: Bret Bruhn, Coming Soon
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Environment, Health & Saftey (EHS)
Location: 7A
Wed, Feb 28, 2018 - 1:30 PM to 5:00 PM
5-21M: Cold Joining/Press-fit Task Group 
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 17A
Wed, Feb 28, 2018 - 1:30 PM to 5:00 PM
5-22PT: Process Engineering Program Technical Training Committee
Seminar Type: Standards Development Committee
General Committee: Assembly and Joining
Location: 12
Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM
5-24F: Underfill Materials Design, Selection and Process Task Group
Presenter/Committee Chair: Bill Vuono, Quorvo
Presenter/Committee Chair: Brian Toleno Ph.D., Principal Material Scientist, Microsoft Corporation
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 7B
Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM
7-12: Microsection Subcommittee
Presenter/Committee Chair: Russell Shepherd, Coming Soon
Seminar Type: Standards Development Committee
Track: Test
General Committee: Testing
Location: 17B
Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM
D-11: Flexible Circuits Design Subcommittee
Presenter/Committee Chair: William Ortloff, Raytheon Systems Company
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 11B
Wed, Feb 28, 2018 - 1:30 PM to 5:00 PM
D-60: Printed Electronics Committee - Reporting Session
Seminar Type: Standards Development Committee
General Committee: Printed Electronics
Location: 14A
Wed, Feb 28, 2018 - 1:30 PM to 3:00 PM
SPVC: IPC Solder Products Value Council
Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
Seminar Type: Standards Development Committee
Location: 9
Wed, Feb 28, 2018 - 2:00 PM to 3:00 PM
PCB Suppliers Council Steering Committee
Seminar Type: Standards Development Committee
Location: 8
Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM
5-32C: Bare Board Cleanliness Assessment Task Group
Presenter/Committee Chair: David Lober, Process Chemist, Kyzen Corporation
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 11A
Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM
8-41: Technology Roadmap Subcommittee
Presenter/Committee Chair: John Fisher, HDP User Group
Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Committee
Track: Supply Chain/Business Issues
General Committee: Management
Location: 8
Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM
B-11: 3-D Electronic Packages Subcommittee
Presenter/Committee Chair: Dudi Amir, Intel Corporation
Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Packaged Electronic Components
Location: 17B
Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials Subcommittee
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 11B
Wed, Feb 28, 2018 - 3:15 PM to 5:00 PM
D-21: High Speed/High Frequency Design Subcommittee
Presenter/Committee Chair: Scott Bowles, L-3 Fuzing and Ordnance Systems
Seminar Type: Standards Development Committee
Track: PCB Fabrication and Materials
General Committee: High Speed/High Frequency Interconnections
Location: 7B
Wed, Feb 28, 2018 - 3:30 PM to 5:00 PM
5-31G: Stencil Cleaning Task Group
Presenter/Committee Chair: Greg Wade, Global Technical Support Engineer, Indium Corporation
Presenter/Committee Chair: Mike Bixenman DBA, Kyzen Corporation
Seminar Type: Standards Development Committee
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 14B
Thu, Mar 1, 2018 - 8:00 AM to 12:00 PM
2-18B: Materials Declaration Task Group
Presenter/Committee Chair: Aidan Turnbull Ph.D., Managing Director, BomCheck
Presenter/Committee Chair: Mark Frimann, Coming Soon
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14B
Thu, Mar 1, 2018 - 8:00 AM to 12:00 PM
5-21M: Cold Joining/Press-fit Task Group
Seminar Type: Standards Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 17A
Thu, Mar 1, 2018 - 8:00 AM to 5:00 PM
7-31J: Electronic Box Assemblies Task Group
Seminar Type: Standards Development Committee
General Committee: Product Assurance
Location: 15A
Thu, Mar 1, 2018 - 8:00 AM to 5:00 PM
D-64: Printed Electronics Final Assembly Subcommittee
Presenter/Committee Chair: Jeff Shubrooks, Raytheon Systems Company
Presenter/Committee Chair: Michael Jawitz, Orbital ATK
Seminar Type: Standards Development Committee
General Committee: Printed Electronics
Location: 14A
Thu, Mar 1, 2018 - 8:00 AM to 5:00 PM
D-72: E-Textiles Materials Subcommittee
Presenter/Committee Chair: Diana Wyman, AATCC
Presenter/Committee Chair: Stephanie Rodgers, Apex Mills, Inc.
Seminar Type: Standards Development Committee
Track: Design
General Committee: Wearable Electronics/E-Textiles
Location: 12
Thu, Mar 1, 2018 - 8:00 AM to 5:00 PM
PERM Meeting No. 35
Seminar Type: Standards Development Committee
Location: 6E
Thu, Mar 1, 2018 - 10:00 AM to 2:00 PM
UL STP Committee (By invitation only)
Presenter/Committee Chair: Bradley Schmidt
Seminar Type: Standards Development Committee
Track: Quality, Reliability, and Test
General Committee: Testing
Location: 17B
Thu, Mar 1, 2018 - 1:00 PM to 5:00 PM
2-18J: Laboratory Report Declaration Task Group
Presenter/Committee Chair: JB Hollister, Environmental Engineer, Apple, Inc.
Presenter/Committee Chair: Jason Gooden, Partner, Anthesis
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 14B
Fri, Mar 2, 2018 - 8:00 AM to 5:00 PM
PERM Meeting No. 35
Seminar Type: Standards Development Committee
Location: 6E
Fri, Mar 2, 2018 - 8:00 AM to 10:00 AM
2-18F: Declaration of Shipping, Pack and Packing Materials Task Group
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 15A
Fri, Mar 2, 2018 - 10:00 AM to 1:00 PM
2-18: Supplier Delcaration Subcommitee
Presenter/Committee Chair: Tord Dennis SSC, Electronics Engrg Asc Mgr, WSP Parsons Brinckerhoff
Seminar Type: Standards Development Committee
Track: Environmental Issues and Compliance
General Committee: Electronic Product Data Description
Location: 15A
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