APEX EXPO 2018 Agenda Planner - Programs

Contact Us | About APEX EXPO 2018 Agenda Planner

Login to APEX EXPO 2018 Agenda Planner Now or Register for IPC APEX EXPO 2018 Now.

IPC APEX EXPO 2018

Mon, Feb 26, 2018 - 12:00 PM to 1:30 PM ML: Awards Luncheon Seminar Type: Special Event Location: 6A
Mon, Feb 26, 2018 - 1:30 PM to 5:00 PM 1-10C: Test Coupon and Artwork Generation Task Group Presenter/Committee Chair: Philip Henaul, Development Engineer, Raytheon Systems Company Seminar Type: Standards Development Committee Track: Quality, Reliability, and Test General Committee: Printed Board Design Technology Location: 10
Mon, Feb 26, 2018 - 1:30 PM to 5:00 PM 1-14: DFX Standards Subcommittee Presenter/Committee Chair: Dock Brown, Sr. Member of Technical Staff, DfR Solutions Presenter/Committee Chair: Stephen Golemme, Alphabet Inc. Presenter/Committee Chair: Karen McConnell CID, Manager, EDA, Northrop Grumman Corporation Seminar Type: Standards Development Committee Track: PCB Fabrication, Materials and Design General Committee: Printed Board Design Technology Location: 14A
Mon, Feb 26, 2018 - 1:30 PM to 3:00 PM 3-12D: Woven Glass Reinforcement Task Group Presenter/Committee Chair: Mike Bryant, Coming Soon Seminar Type: Standards Development Committee Track: PCB Fabrication and Materials General Committee: Base Materials Location: 8
Mon, Feb 26, 2018 - 1:30 PM to 3:00 PM 5-33C: Conformal Coat Handbook Presenter/Committee Chair: Amy Hagnauer, Manufacturing Engineer, Raytheon Systems Company Presenter/Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica Seminar Type: Standards Development Committee Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 11B
Mon, Feb 26, 2018 - 1:30 PM to 5:00 PM 7-31K: Wire H Seminar Type: Standards Development Committee Track: Design General Committee: Product Assurance Location: 7B
Mon, Feb 26, 2018 - 1:30 PM to 5:00 PM 7-31MT: IPC-A-640 Fiber Optic Training Advisory Committee Seminar Type: Standards Development Committee General Committee: Product Assurance Location: 17A
Mon, Feb 26, 2018 - 1:30 PM to 3:00 PM B-10A/JEDEC: Joint Meeting: Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1 Presenter/Committee Chair: Steven Martell, Sonoscan Inc. Seminar Type: Standards Development Committee Track: Quality, Reliability, and Test General Committee: Packaged Electronic Components Location: 12
Mon, Feb 26, 2018 - 2:00 PM to 5:00 PM PD21: Reflow Soldering Process and Influence on Defects An In-Depth Look PD21 Survey: https://www.surveymonkey.com/r/APEXPD21 Presenter/Committee Chair: S. Manian Ramkumar, Dean of the College of Applied Science and Technology, Rochester Institute of Technology Seminar Type: Professional Development Location: Room 3 PD21 Course Material
Mon, Feb 26, 2018 - 2:00 PM to 5:00 PM PCB EXECUTIVE FORUM WORKSHOP: Lead Time Reduction Strategies for High-Mix, Low-Volume PCB Manufacturing to Steve Williams, President, TRA Consulting Seminar Type: Management Location: 6C PCB EXECUTIVE FORUM WORKSHOP Handout

GoExpo stable-v4.15.265, Copyright © 2006-2024 Core-apps LLC.

Privacy · Legal · Contact · About