PacTech is comprised of three business units: EQUIPMENT MANUFACTURING: ENIG/ENEPIG plating, Laser solder jetting, WL-solder ball transfer, Laser bonders for cantilever assembly/repair. SUBCONTRACT SERVICES: Bumping Services including ENIG/ENEPIG for UBM/OPM. Electroplating, Solder Balling, RDL, Backmetal, Wafer Thinning & Dicing, AOI, X-Ray, SEM, FIB. CHEMISTRY: Pre-Treatment and process chemistry for ENIG/ENEPIG. (less)