SAFI-Tech develops No-Heat SAC305™ liquid metal microcapsules, enabling low temperature processing of the industry-standard soldering alloy for electronics assembly. No-Heat SAC305 microcapsules can be precisely placed, selectively activated, and processed at ambient temperature to form fully-metallic interconnects without the time, expense, and stress of high temperature reflow processes. SAFI-Tech's no-heat paradigm unleashes innovative choices for design and assembly engineers to create thinner, lighter, flexible, miniaturized products while reducing costs and eliminating thermal defects. (less)