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	Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM S20: Strategies to Enable Miniaturization Moderator: Weifeng Liu, PhD., Flex Speaker: Joerg Nolte, Ersa GmbH Speaker: Robert Carter, Vice President of Business Development and Technology, Oak-Mitsui Technologies Speaker: Antonio Caputo, Ph.D., Packaging R & D Engineer, Intel Corporation Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 31AB
	Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM S21: Curable Encapsulants Moderator: Brian Toleno, Ph.D., Principal Material Scientist, Micrsoft Corporation Speaker: Kent Larson, Dow Performance Silicones Speaker: Aysegul Kascatan Nebioglu, Ph.D., Sr. R&D team manager, Dymax Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 33AB
	Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM S22: Thermal Interface Solutions Moderator: Jason Keeping, Project Manager, Celestica International Speaker: Sanjay Misra, Senior Scientific Principal, Henkel Corporation Speaker: Ning-Cheng Lee, PhD., VP Technology, Indium Corporation Seminar Type: Technical Conference Session Track: Assembly Processes Location: 31C
	Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM S24: Alloy Reliability with Bismuth Moderator: Weifeng Liu, PhD., Flex Speaker: Sa'd Hamasha, PhD., Auburn University Speaker: Jasbir Bath, Support Advisory Engineer, Koki Solder America Seminar Type: Technical Conference Session Track: Assembly Processes Location: 32AB
	Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM S25: Reliability Considerations for Cleaning Moderator: Stanton Rak, Ph.D., Continental Automotive Systems Speaker: Jigar Patel, ZESTRON Americas Speaker: David Lober, Process Chemist, Kyzen Corporation Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 31AB
	Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM S26: Process Improvements for NPI and Rework Moderator: Russell Nowland, Nokia Corporation Speaker: Peter Lu, Senior Engineer, Curtiss Wright Speaker: Keith Bryant, SMART Group Speaker: Brian Czaplicki, Director of Technical Marketing Programs, Air-Vac Engineering Company, Inc. Seminar Type: Technical Conference Session Track: Assembly Processes Location: 30DE
	Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM S27: High Frequency Moderator: John Coonrod, Technical Marketing Manager, Rogers Corporation Speaker: Juhee Lee, Assistant Research Engineer, ISU Petasys Speaker: John Coonrod, Technical Marketing Manager, Rogers Corporation Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 31AB
	Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM S28: PCB Fabrication Moderator: Bhanu Sood, PhD., PCB Risk Assessment Engineer, NASA Goddard Space Flight Center Speaker: Ta Chang Chen, Statistician, Gold Circuit Electronics Ltd. Speaker: Raanan Novik, Orbotech Speaker: Hailey Jordan, Quality Engineer, Draper Speaker: Wade Goldman, Draper Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 32AB
	Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM S29: Materials for Automotive Applications Moderator: Jason Keeping, Project Manager, Celestica International Speaker: Arvind Karthikeyan, Auburn University Speaker: Outi Rusanen, Ph.D., TactoTek Speaker: Lenora Clark, Director - Autonomous Driving and Safety Technology, MacDermid Alpha Automotive Seminar Type: Technical Conference Session Track: Assembly Processes Location: 31C

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