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Programs: 101 - 110 of 220
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
D-24C: High Frequency Test Methods Task Group: Frequency-Domain Methods
Committee Chair: John Coonrod, Technical Marketing Manager, Rogers Corporation
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: High Speed/High Frequency Interconnections
Location: 28B
Tue, Feb 4, 2020 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Committee Chair: Clifford Maddox, Engineering Specialist, Boeing Company
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Printed Board Design Technology
Location: 28A
Tue, Feb 4, 2020 - 1:30 PM to 5:00 PM
D-55/D-55A: Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group - Joint Meeting
Committee Chair: Bhanu Sood, PhD., PCB Risk Assessment Engineer, NASA Goddard Space Flight Center
Committee Chair: Rajesh Kumar, VP of Technology Solutions, TTM Technologies
Seminar Type: Standards Development Meeting
Track: Emerging Technologies
General Committee: Embedded Devices
Location: 29A
Tue, Feb 4, 2020 - 1:30 PM to 5:00 PM
E-31J: Laboratory Report Declaration Task Group
Committee Chair: JB Hollister, Environmental Engineer, Apple Inc.
Committee Chair: Jason Gooden
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 23C
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
I-03 INTERACTION: I4.0 - Inspection as The Currency of The Smart Factory
Moderator: Bill Cardoso, President, Creative Electron, Inc.
Speaker: Jeff Mason, Neotech
Speaker: Oliver Perez, Director of Engineering, Edward Life Sciences
Seminar Type: Sessions @ The Intersection
Location: 33C
Tue, Feb 4, 2020 - 1:30 PM to 2:30 PM
IPC EMS Council Steering Committee
Seminar Type: Standards Development Meeting
Track: Leadership
General Committee: Management
Location: 23A
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
S01: BTC Challenges
Moderator: Milos lazic, Indium Corporation
Speaker: Norman Armendariz, PhD., Engineering Fellow, Raytheon Company
Speaker: Greg Smith, BlueRing Stencils
Speaker: Udo Welzel, Robert Bosch GmbH
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 30DE
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
S02: Design for Manufacturability
Moderator: Julie Silk, Keysight Technologies
Speaker: Antonio Caputo, Ph.D., Packaging R & D Engineer, Intel Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test
Location: 30BC
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
S03: Industry Advancements Related to Standards Updates
Moderator: Beverley Christian, Ph.D., HDP User Group
Speaker: Mike Bixenman, PhD., CTO, Kyzen Corporationporation
Speaker: Stevan Hunter PhD., Reliability Engineering Consultant, ON Semiconductor
Speaker: Ben Gumpert, Manufacturing Engineer, Lockheed Martin
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 31AB
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
S04: Semi-Additive Process
Speaker: Audra Thurston, Process Engineer, Calumet Electronics
Speaker: Mike Vinson, President and COO, Averatek
Moderator: Britta Schafsteller, Ph.D., Global product manager, Atotech Deutschland GmbH
Seminar Type: Technical Conference Session
Track: Environmental Issues and Compliance
Location: 31C