Agenda Planner - Programs

Wed, Feb 5, 2020 - 8:00 AM to 10:00 AM D-22: High Speed/High Frequency Board Performance SubStandards Development Meeting Committee Chair: Lance Auer, Conductor Analysis Tecnology Seminar Type: Standards Development Meeting Track: PCB Fabrication and Materials General Committee: High Speed/High Frequency Interconnections Location: 23B
Wed, Feb 5, 2020 - 8:00 AM to 12:00 PM D-70: E-Textiles Standards Development Meeting Committee Chair: Carole Winterhalter Committee Chair: Stephanie Rodgers, Director Product Development, Apex Mills, Inc. Seminar Type: Standards Development Meeting Track: E-Textiles General Committee: Wearable Electronics/E-Textiles Location: 29B
Wed, Feb 5, 2020 - 8:00 AM to 12:00 PM E-31: Supplier Declaration SubStandards Development Meeting Committee Chair: Randall Flinders, Sr. Manager of Support, Geensoft Technology Inc. Seminar Type: Standards Development Meeting Track: Quality, Reliability and Test Location: 23C
Wed, Feb 5, 2020 - 9:00 AM to 3:00 PM 2-16: Product Data Description (2581) Committee Chair: Gary Carter, ECAD Product Engineer, XPLM Solution, Inc. Committee Chair: Edward B Acheson, Sr. Principal Product Engineer, Cadence Design Systems Inc. Committee Chair: Chris Shaw, Sr. Design Automation Analyst, Fujitsu Network Communications Seminar Type: Standards Development Meeting Track: Supply Chain/Business Issues Location: 25A
Wed, Feb 5, 2020 - 10:00 AM to 12:00 PM 7-35: Assembly and Joining Handbook SubStandards Development Meeting Committee Chair: Mary Muller, Independent Contractor Seminar Type: Standards Development Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Product Assurance Location: 29C
Wed, Feb 5, 2020 - 10:15 AM to 12:00 PM 5-21F: Ball Grid Array Task Group Committee Chair: Ray Prasad, President, Ray Prasad Consultancy Group Seminar Type: Standards Development Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 29A
Wed, Feb 5, 2020 - 10:15 AM to 12:00 PM 5-22BT: IPC J-STD-001 Training Standards Development Meeting Seminar Type: Standards Development Meeting Location: 28B
Wed, Feb 5, 2020 - 10:15 AM to 12:00 PM 5-23A: Printed Circuit Board Solderability Specifications Task Group Seminar Type: Standards Development Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 28C
Wed, Feb 5, 2020 - 10:15 AM to 3:00 PM 5-33B: Solder Mask Performance Task Group Committee Chair: Fondu Wu, Senior Project Systems Engineer, Raytheon Company Committee Chair: Rene Martinez, Materials & Process Manager, Northrop Grumman Corporatioin Seminar Type: Standards Development Meeting Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 25B
Wed, Feb 5, 2020 - 10:15 AM to 12:00 PM D-12: Flexible Circuits Specifications SubStandards Development Meeting Committee Chair: Nick Koop, Director of Flex Technology, TTM Technologies Seminar Type: Standards Development Meeting Track: PCB Fabrication and Materials General Committee: Flexible and Rigid-Flex Printed Boards Location: 28A