Wed, Feb 5, 2020 - 12:00 PM to 1:00 PM
Tradeshow Standards Development Meeting Meeting(By Invitation)
Seminar Type: Standards Development Meeting
Location: 23A
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
I-12 Emerging Technology - Laminate Advancements for 5G: Part 2
Moderator: David Hoover, TTM Technologies
Speaker: Daejo Hong, Doosan
Speaker: Alan Cochran, TUC
Speaker: Pierce Lin, EMC
Seminar Type: Sessions @ The Intersection
Location: 33AB
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
I-11 iNEMI PCB Technology Forum - Session 1: Applications Driving Change 
Moderator: Grace O’Malley, Vice President of Technical & Project Operations, iNEMI
Speaker: Emma Hudson, CEO & Owner, Emma Hudson Technical Consultancy Ltd
Speaker: Justin JJ Johno, Field Engineer, PWB/Substrates Materials, Hitachi Chemical Co. America, Ltd.
Speaker: Shiuh-Kao (SK) Chiang, Managing Partner, Prismark Partners
Speaker: Tarja Rapala, Technical Director, EIPC-The European Institute for the PCB Community
Speaker: Marc Benowitz, CEO, iNEMI - International Electronics
Speaker: Daniel Gamota, Vice President, Manufacturing Technology & Innovation, Jabil Circuit, Inc.
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 33C
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
5-21M: Cold Joining/Press-fit Task Group
Committee Chair: Udo Welzel, Robert Bosch GmbH
Committee Chair: Hans-Peter Tranitz
Seminar Type: Standards Development Meeting
Location: 26AB
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
5-24G: IPC Polymerics Standard Task Group
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Location: 23C
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
7-12: Microsection SubStandards Development Meeting
Committee Chair: Vicka Hammill, Fellow Engineer, Honeywell
Seminar Type: Standards Development Meeting
Track: Test
General Committee: Testing
Location: 29B
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
7-31AT: IPC-A-600 Training Standards Development Meeting
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 28B
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
7-31FCRT: IPC WHMA-A-620 Certification Standards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29D
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
D-11: Flexible Circuits Design SubStandards Development Meeting
Committee Chair: William Ortloff, Engineering Fellow, Raytheon
Seminar Type: Standards Development Meeting
Track: Design
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 28A
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
D-23: High Speed/High Frequency Base Materials SubStandards Development Meeting
Committee Chair: Edward Sandor, Application Engineering Mgr, AGC Nelco America
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: High Speed/High Frequency Interconnections
Location: 29A