Agenda Planner - Programs

Wed, Feb 5, 2020 - 3:15 PM to 5:00 PM B-11a: 3-D Electronic Packages SubStandards Development Meeting Committee Chair: Dudi Amir, Technologist, Intel Corporation Seminar Type: Standards Development Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Packaged Electronic Components Location: 29B
Wed, Feb 5, 2020 - 3:15 PM to 5:00 PM D-13: Flexible Circuits Base Materials SubStandards Development Meeting Committee Chair: Richard Wessel, Technical Supervisor, Dupont Seminar Type: Standards Development Meeting General Committee: Flexible and Rigid-Flex Printed Boards Location: 28A
Wed, Feb 5, 2020 - 3:15 PM to 5:00 PM D-21: High Speed/High Frequency Design SubStandards Development Meeting Committee Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff., DuPont Seminar Type: Standards Development Meeting Track: PCB Fabrication and Materials General Committee: High Speed/High Frequency Interconnections Location: 25A
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM I-15 iNEMI PCB Technology Forum - Session 2: Materials and Testing Challenges Moderator: Grace O’Malley, Vice President of Technical & Project Operations, iNEMI Speaker: Sarah Czaplewski-Campbell, Advisory PCB Qualification Engineer, IBM Speaker: Juan Landeros, Design Engineering, Intel Corporation Speaker: Edward J. Kelley, CTO & Sr. Vice President, Technology, Isola Group SARL Speaker: Marc Benowitz, CEO, iNEMI - International Electronics Speaker: Lenora Clark, Director - Autonomous Driving and Safety Technology, MacDermid Alpha Automotive Speaker: Jan Pedersen, Senior Technical Advisor, Elmatica AS Seminar Type: Sessions @ The Intersection Track: Emerging Technologies Location: 33C
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM I-14 interACTION: E-textiles – Application Opportunities, Challenges and Solutions Moderator: Stephanie Rodgers, Director Product Development, Apex Mills, Inc. Speaker: Mary Alice Gill, Jabil Circuit, Inc. Speaker: Ian Tevis, SAFI-Tech Speaker: Meg Grant, E-Textile Technologist, Meg Grant Consulting Speaker: Oxana Pantchenko, PhD., Program Manager – Medical Devices, NEXTFLEX Speaker: Tricia Danitz, Principle Textile Engineer Speaker: Michael Rein, Senior Product Engineer, AFFOA – Government: Advanced Functional Fabrics Seminar Type: Sessions @ The Intersection Track: Emerging Technologies Location: 31C
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM I-16 interACTION: I4.0 – The Hidden Cost of Data Silos Speaker: Hassan Aluraibi, Advanced Manufacturing Engineering Manager, Flex Speaker: Tim Burke, Chief Technology Officer, Arch Systems Seminar Type: Sessions @ The Intersection Location: 33AB Tim Burke
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM S17: Flux Residue Considerations Moderator: Stanton Rak, Ph.D., Continental Automotive Systems Speaker: Kim Flanagan, Technical Support Engineer, Indium Corporation Speaker: Ning-Cheng Lee, PhD., VP Technology, Indium Corporation Speaker: Douglas Pauls, Principal Materials and Process Engineer, Collins Aerospace Seminar Type: Technical Conference Session Track: Assembly Processes Location: 30A
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM S18: Getting the Most Out of Your Manufacturing Process Speaker: Michael Sivigny, Owner and General Manager, CeTaQ Americas Speaker: Terry York, Regional Product Manager, Kulicke & Soffa Industries Inc Moderator: Udo Welzel, Robert Bosch GmbH Seminar Type: Technical Conference Session Track: Assembly Processes Location: 30BC
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM S19: Surface Finishes 2 Moderator: David Hoover, TTM Technologies Speaker: Saminda Dharmarathna, PhD., Senior Research Scientist, MacDermid Alpha Electronics Solutions Speaker: Rob Weber, Director of Product Management, Fischer Technology, Inc. Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 30DE
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM S20: Strategies to Enable Miniaturization Moderator: Weifeng Liu, PhD., Flex Speaker: Joerg Nolte, Ersa GmbH Speaker: Robert Carter, Vice President of Business Development and Technology, Oak-Mitsui Technologies Speaker: Antonio Caputo, Ph.D., Packaging R & D Engineer, Intel Corporation Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 31AB