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Programs: 41 - 50 of 220
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Mon, Feb 3, 2020 - 10:15 AM to 12:00 PM
D-36: Printed Board Process Capability, Quality and Relative Reliability Benchmark Test SubStandards Development Meeting
Committee Chair: Albert Block, Chief Manufacturing Strategist, National Instruments
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Rigid Printed Boards
Location: 28C
Description
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Mon, Feb 3, 2020 - 12:00 PM to 1:30 PM
Government Relations Working Lunch(By Invitation)
Seminar Type: Standards Development Meeting
Location: 27B
Description
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Mon, Feb 3, 2020 - 12:00 PM to 1:30 PM
ML: Event Awards Luncheon
Seminar Type: Special Event
Location: 20D
Description
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Mon, Feb 3, 2020 - 1:30 PM to 5:00 PM
1-10C: Test Coupon and Artwork Generation Task Group
Committee Chair: Philip Henault, Development Engineer, Raytheon Company
Seminar Type: Standards Development Meeting
Track: Emerging Technologies
General Committee: Printed Board Design Technology
Location: 28C
Description
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Mon, Feb 3, 2020 - 1:30 PM to 5:00 PM
1-14: DFX Standards SubStandards Development Meeting
Committee Chair: Dock Brown, Senior Technical Staff, DfR Solutions
Committee Chair: Stephen Golemme, Senior Market Development Specialist, Rogers Corporation
Committee Chair: Karen McConnell, Manager, EDA, Northrop Grumman Corporatioin
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Printed Board Design Technology
Location: 25A
Description
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Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
2-19A: Critical Components Traceability Task Group
Committee Chair: Cameron Shearon, Principal Engineer, Raytheon Company
Committee Chair: Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 23C
Description
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Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 28A
Description
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Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
4-14: Plating Processes SubStandards Development Meeting
Committee Chair: George Milad, National Accounts Manager for Technology, Uyemura International Corp.
Committee Chair: Gerard O'Brien, President, Solderability Testing and Solutions, Inc.
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Fabrication Processes
Location: 28B
Description
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Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
5-24F: Underfill Materials Design, Selection and Process Task Group
Committee Chair: Bill Vuono, Sr. Process Engineer, Qorvo US, Inc.
Committee Chair: Brian Toleno, Ph.D., Principal Material Scientist, Micrsoft Corporation
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 29C
Description
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Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
5-33C: Conformal Coat Handbook
Committee Chair: Amy Hagnauer, Manufacturing Engineer, Raytheon Company
Committee Chair: Jason Keeping, Project Manager, Celestica International
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 29D
Description