Agenda Planner - Programs

Mon, Feb 3, 2020 - 10:00 AM to 5:00 PM Technical Conference Featuring The Fundamentals Track Moderator: Brook Sandy-Smith, Technical Education & Conference Program manager, IPC Seminar Type: Technical Conference Session Location: 30A
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM S01: BTC Challenges Moderator: Milos lazic, Indium Corporation Speaker: Norman Armendariz, PhD., Engineering Fellow, Raytheon Company Speaker: Greg Smith, BlueRing Stencils Speaker: Udo Welzel, Robert Bosch GmbH Seminar Type: Technical Conference Session Track: Assembly Processes Location: 30DE
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM S02: Design for Manufacturability Moderator: Julie Silk, Keysight Technologies Speaker: Antonio Caputo, Ph.D., Packaging R & D Engineer, Intel Corporation Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 30BC
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM S03: Industry Advancements Related to Standards Updates Moderator: Beverley Christian, Ph.D., HDP User Group Speaker: Mike Bixenman, PhD., CTO, Kyzen Corporationporation Speaker: Stevan Hunter PhD., Reliability Engineering Consultant, ON Semiconductor Speaker: Ben Gumpert, Manufacturing Engineer, Lockheed Martin Seminar Type: Technical Conference Session Track: Assembly Processes Location: 31AB
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM S04: Semi-Additive Process Speaker: Audra Thurston, Process Engineer, Calumet Electronics Speaker: Mike Vinson, President and COO, Averatek Moderator: Britta Schafsteller, Ph.D., Global product manager, Atotech Deutschland GmbH Seminar Type: Technical Conference Session Track: Environmental Issues and Compliance Location: 31C
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM S05: Advances in Dispensing Moderator: Milos lazic, Indium Corporation Speaker: Sunny Agarwal, Applications Engineer III, ITWEAE Speaker: Leonard Allison, , Engineered Materials Systems, Inc. Speaker: Gustaf Martensson, Ph.D., Expert Complex Fluids, Mycronic AB Seminar Type: Technical Conference Session Track: Assembly Processes Location: 30DE
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM S06: Reliability Testing Moderator: Stanton Rak, Ph.D., Continental Automotive Systems Speaker: Lynda Pelley, Teledyne DALSA Speaker: Udo Welzel, Robert Bosch GmbH Speaker: Reza Ghaffarian, PhD., Principal Engineer, Jet Propulsion Laboratory Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 30BC
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM S07: Industry 4.0 Moderator: Martin Goetz, Ph.D., Northrop Grumman Corporation Speaker: Juthika Khargharia, SAS Speaker: Zohair Mehkri, Manager, Flex Speaker: David Huntley, PDF Solutions Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 31C
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM S08: Proposition 65–Important to Any Companies Doing Business in California Moderator: Kelly Scanlon, DrPH, CIH, Director of Environment, Health and Safety Policy and Research, IPC, Government Relations Speaker: Michael Easter, Principal, EnSIGHT Speaker: Carol Monahan Cummings, Chief Counsel, California Office of Environmental Health Hazard Assessment (OEHHA) Seminar Type: Technical Conference Session Track: Environmental Issues and Compliance Location: 31AB
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM S09: Novel Soldering Processes Moderator: Russell Nowland, Nokia Corporation Speaker: Robert McKerrow, Product Specialist for the CMD product lines, Indium Corporation Speaker: Gerjan Diepstraten, Advanced Technology Manager, ITWEAE Seminar Type: Technical Conference Session Track: Assembly Processes Location: 30A
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM S10: Industry 4.0 II Moderator: Martin Goetz, Ph.D., Northrop Grumman Corporation Speaker: Ranjan Chatterjee, Vice President and General Manager, Cimetrix Speaker: Martin Franke, Research Group Leader, Siemens AG, Corporate Technology Speaker: Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software Seminar Type: Technical Conference Session Track: Emerging Technologies Location: 30DE
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM S11: Surface Treatments Moderator: Karl Sauter, Oracle America, Inc. Speaker: Richard Hollman, ASM NEXX Speaker: Roger Massey, Technical Marketing Manager, Atotech GmbH Speaker: Neal Wood, Global Product Marketing Manager, Atotech Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 31AB
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM S12: Automated End-of-line Testing Moderator: Udo Welzel, Robert Bosch GmbH Speaker: Louis Ungar, President, A.T.E. Solutions Inc. Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 30BC
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM S13: Material Considerations for Aerospace Moderator: Brian Toleno, Ph.D., Principal Material Scientist, Micrsoft Corporation Speaker: Yuan (David) Zhao, Principal Engineer, Henkel Corp. Speaker: Daphne Pappas, Ph.D., R&D and Applications Manager, Plasmatreat USA Seminar Type: Technical Conference Session Track: Quality, Reliability and Test Location: 30A
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM S14: Industry 4.0 III Moderator: Martin Goetz, Ph.D., Northrop Grumman Corporation Speaker: Jay Gorajia, Director, Global Services, Siemens Digital Industries Software Speaker: Carl Ogden, VP of Operations, Intraratio Corporation Speaker: Marc Peo, President, Heller Industries Seminar Type: Technical Conference Session Track: Emerging Technologies Location: 30DE
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM S15: Surface Finishes 1 Moderator: Beverley Christian, Ph.D., HDP User Group Speaker: Tom Scimeca, PhD., Main Owner, EFT Plating Services Speaker: Kunal Shah, PhD., President and chief Scientist, LiloTree Speaker: Britta Schafsteller, Ph.D., Global product manager, Atotech Deutschland GmbH Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 30BC
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM S16: Testing Microvias Moderator: Bhanu Sood, PhD., PCB Risk Assessment Engineer, NASA Goddard Space Flight Center Speaker: Roger Massey, Technical Marketing Manager, Atotech GmbH Speaker: Maarten Cauwe PhD., imec-CMST Speaker: Kevin Knadle, Principal Engineer, TTM technologies Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 31AB
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM S17: Flux Residue Considerations Moderator: Stanton Rak, Ph.D., Continental Automotive Systems Speaker: Kim Flanagan, Technical Support Engineer, Indium Corporation Speaker: Ning-Cheng Lee, PhD., VP Technology, Indium Corporation Speaker: Douglas Pauls, Principal Materials and Process Engineer, Collins Aerospace Seminar Type: Technical Conference Session Track: Assembly Processes Location: 30A
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM S18: Getting the Most Out of Your Manufacturing Process Speaker: Michael Sivigny, Owner and General Manager, CeTaQ Americas Speaker: Terry York, Regional Product Manager, Kulicke & Soffa Industries Inc Moderator: Udo Welzel, Robert Bosch GmbH Seminar Type: Technical Conference Session Track: Assembly Processes Location: 30BC
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM S19: Surface Finishes 2 Moderator: David Hoover, TTM Technologies Speaker: Saminda Dharmarathna, PhD., Senior Research Scientist, MacDermid Alpha Electronics Solutions Speaker: Rob Weber, Director of Product Management, Fischer Technology, Inc. Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 30DE
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM S20: Strategies to Enable Miniaturization Moderator: Weifeng Liu, PhD., Flex Speaker: Joerg Nolte, Ersa GmbH Speaker: Robert Carter, Vice President of Business Development and Technology, Oak-Mitsui Technologies Speaker: Antonio Caputo, Ph.D., Packaging R & D Engineer, Intel Corporation Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 31AB
Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM S21: Curable Encapsulants Moderator: Brian Toleno, Ph.D., Principal Material Scientist, Micrsoft Corporation Speaker: Kent Larson, Dow Performance Silicones Speaker: Aysegul Kascatan Nebioglu, Ph.D., Sr. R&D team manager, Dymax Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 33AB
Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM S22: Thermal Interface Solutions Moderator: Jason Keeping, Project Manager, Celestica International Speaker: Sanjay Misra, Senior Scientific Principal, Henkel Corporation Speaker: Ning-Cheng Lee, PhD., VP Technology, Indium Corporation Seminar Type: Technical Conference Session Track: Assembly Processes Location: 31C
Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM S24: Alloy Reliability with Bismuth Moderator: Weifeng Liu, PhD., Flex Speaker: Sa'd Hamasha, PhD., Auburn University Speaker: Jasbir Bath, Support Advisory Engineer, Koki Solder America Seminar Type: Technical Conference Session Track: Assembly Processes Location: 32AB
Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM S25: Reliability Considerations for Cleaning Moderator: Stanton Rak, Ph.D., Continental Automotive Systems Speaker: Jigar Patel, ZESTRON Americas Speaker: David Lober, Process Chemist, Kyzen Corporation Seminar Type: Technical Conference Session Track: Cleaning/Coating/Contamination Location: 31AB
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM S26: Process Improvements for NPI and Rework Moderator: Russell Nowland, Nokia Corporation Speaker: Peter Lu, Senior Engineer, Curtiss Wright Speaker: Keith Bryant, SMART Group Speaker: Brian Czaplicki, Director of Technical Marketing Programs, Air-Vac Engineering Company, Inc. Seminar Type: Technical Conference Session Track: Assembly Processes Location: 30DE
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM S27: High Frequency Moderator: John Coonrod, Technical Marketing Manager, Rogers Corporation Speaker: Juhee Lee, Assistant Research Engineer, ISU Petasys Speaker: John Coonrod, Technical Marketing Manager, Rogers Corporation Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 31AB
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM S28: PCB Fabrication Moderator: Bhanu Sood, PhD., PCB Risk Assessment Engineer, NASA Goddard Space Flight Center Speaker: Ta Chang Chen, Statistician, Gold Circuit Electronics Ltd. Speaker: Raanan Novik, Orbotech Speaker: Hailey Jordan, Quality Engineer, Draper Speaker: Wade Goldman, Draper Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 32AB
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM S29: Materials for Automotive Applications Moderator: Jason Keeping, Project Manager, Celestica International Speaker: Arvind Karthikeyan, Auburn University Speaker: Outi Rusanen, Ph.D., TactoTek Speaker: Lenora Clark, Director - Autonomous Driving and Safety Technology, MacDermid Alpha Automotive Seminar Type: Technical Conference Session Track: Assembly Processes Location: 31C