Agenda Planner - Programs

Mon, Feb 3, 2020 - 10:15 AM to 12:00 PM D-36: Printed Board Process Capability, Quality and Relative Reliability Benchmark Test SubStandards Development Meeting Committee Chair: Albert Block, Chief Manufacturing Strategist, National Instruments Seminar Type: Standards Development Meeting Track: Quality, Reliability and Test General Committee: Rigid Printed Boards Location: 28C
Mon, Feb 3, 2020 - 12:00 PM to 1:30 PM Government Relations Working Lunch(By Invitation) Seminar Type: Standards Development Meeting Location: 27B
Mon, Feb 3, 2020 - 12:00 PM to 1:30 PM ML: Event Awards Luncheon Seminar Type: Special Event Location: 20D
Mon, Feb 3, 2020 - 1:30 PM to 5:00 PM 1-10C: Test Coupon and Artwork Generation Task Group Committee Chair: Philip Henault, Development Engineer, Raytheon Company Seminar Type: Standards Development Meeting Track: Emerging Technologies General Committee: Printed Board Design Technology Location: 28C
Mon, Feb 3, 2020 - 1:30 PM to 5:00 PM 1-14: DFX Standards SubStandards Development Meeting Committee Chair: Dock Brown, Senior Technical Staff, DfR Solutions Committee Chair: Stephen Golemme, Senior Market Development Specialist, Rogers Corporation Committee Chair: Karen McConnell, Manager, EDA, Northrop Grumman Corporatioin Seminar Type: Standards Development Meeting Track: Quality, Reliability and Test General Committee: Printed Board Design Technology Location: 25A
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM 2-19A: Critical Components Traceability Task Group Committee Chair: Cameron Shearon, Principal Engineer, Raytheon Company Committee Chair: Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software Seminar Type: Standards Development Meeting Track: Supply Chain/Business Issues General Committee: Electronic Product Data Description Location: 23C
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM 3-12D: Woven Glass Reinforcement Task Group Seminar Type: Standards Development Meeting Track: PCB Fabrication and Materials General Committee: Base Materials Location: 28A
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM 4-14: Plating Processes SubStandards Development Meeting Committee Chair: George Milad, National Accounts Manager for Technology, Uyemura International Corp. Committee Chair: Gerard O'Brien, President, Solderability Testing and Solutions, Inc. Seminar Type: Standards Development Meeting Track: PCB Fabrication and Materials General Committee: Fabrication Processes Location: 28B
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM 5-24F: Underfill Materials Design, Selection and Process Task Group Committee Chair: Bill Vuono, Sr. Process Engineer, Qorvo US, Inc. Committee Chair: Brian Toleno, Ph.D., Principal Material Scientist, Micrsoft Corporation Seminar Type: Standards Development Meeting Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 29C
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM 5-33C: Conformal Coat Handbook Committee Chair: Amy Hagnauer, Manufacturing Engineer, Raytheon Company Committee Chair: Jason Keeping, Project Manager, Celestica International Seminar Type: Standards Development Meeting Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 29D