Sat, Feb 1, 2020 - 8:00 AM to 5:00 PM
5-22A/7-31B: Synergy Meeting - J-STD-001 & IPC-A-610 Task Groups
Committee Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Committee Chair: Tiberiu Baranyi, Technical Support Manager, Flex
Committee Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Committee Chair: Robert Fornefeld, Master IPC Trainer, STI Electronics, Inc.
Committee Chair: Milea Kammer, Sr. Product Design Engineer, Honeywell International
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
Location: 24 A-C
Sun, Feb 2, 2020 - 8:00 AM to 12:00 PM
5-22A: J-STD-001 Task Group
Committee Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Committee Chair: Tiberiu Baranyi, Technical Support Manager, Flex
Committee Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Committee Chair: Robert Fornefeld, Master IPC Trainer, STI Electronics, Inc.
Committee Chair: Milea Kammer, Sr. Product Design Engineer, Honeywell International
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
Location: 24 A-C
Sun, Feb 2, 2020 - 8:00 AM to 12:00 PM
7-31A/D-33A: Joint Meeting - IPC-A-600 and IPC-6012 Task Groups
Committee Chair: Marck Buechner, Principal Quality Assurance Engineer, BAE Systems
Committee Chair: Randy Reed, Principal Engineer, R. Reed Consultancy LLC
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
Location: 26AB
Sun, Feb 2, 2020 - 8:00 AM to 12:00 PM
D-64: Printed Electronics Final Assembly SubStandards Development Meeting
Committee Chair: Jeff Shubrooks, Engineer, Raytheon Company
Committee Chair: Michael Jawitz, Sr. Principle Engineer, Raytheon Company
Seminar Type: Standards Development Meeting
Location: 25A
Sun, Feb 2, 2020 - 8:00 AM to 11:00 AM
PD01: International Contracting for EMS Supply Chain and Customer Contracts
Instructor: Jeffrey Roth, Attorney, F&B Law Firm PC
Instructor: Allen Anderson, F&B Law Firm PC
Seminar Type: Professional Development
Location: 32AB
Download Presentation - PD01_APEX2020_Allen Anderson
Sun, Feb 2, 2020 - 8:00 AM to 11:00 AM
PD02: PCB Leadership Lessons from History’s Most Ruthless Leaders
Instructor: Steven Williams, President, The Right Approach Consulting
Seminar Type: Professional Development
Location: 31C
Download Presentation - PD02_APEX2020_Steve Willams
Sun, Feb 2, 2020 - 8:00 AM to 11:00 AM
PD04: Introduction to JTAG " Concepts, Tools & Design for Test (DFT)
Instructor: David Ruff, Principal Applications Engineer, XJTAG Limited
Seminar Type: Professional Development
Track: Design
Location: 30DE
Download Presentation - PD04_APEX2020_David Ruff
Sun, Feb 2, 2020 - 8:00 AM to 11:00 AM
PD05: Options to Tackle Electronics Assembly Cleaning
Instructor: Barbara Kanegsberg, President, BFK Solutions
Instructor: Ed Kanegsberg, BFK Solutions
Seminar Type: Professional Development
Track: Quality and Reliability
Location: 30A
Download Presentation_PD05_APEX2020_Kan egsberg
Sun, Feb 2, 2020 - 8:00 AM to 11:00 AM
PD06: Design for Excellence: DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly) and More - Part I
Instructor: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Seminar Type: Professional Development
Track: Design
Location: 30BC
Download Presentation - PD06_Part1_APEX2020_DaleLee
Sun, Feb 2, 2020 - 12:00 PM to 3:00 PM
PD07: Part Placement Choices and Consequences
Instructor: Susy Webb, Sr. PCB Designer, Design Science
Seminar Type: Professional Development
Track: Design
Location: 32AB
Download Presentation - PD07_APEX2020_Susy Webb
Sun, Feb 2, 2020 - 12:00 PM to 3:00 PM
PD08: Supply Chain Management in the 21st Century
Instructor: Steven Williams, President, The Right Approach Consulting
Seminar Type: Professional Development
Track: Supply Chain
Location: 31C
Download Presentation - PD08_APEX2020_Steve Willams
Sun, Feb 2, 2020 - 12:00 PM to 3:00 PM
PD09: Semiconductor Reliability vs EOS
Instructor: Stevan Hunter PhD., Reliability Engineering Consultant, ON Semiconductor
Seminar Type: Professional Development
Track: Quality and Reliability
Location: 31AB
Download Presentation - PD09_APEX2020_Stevan Hunter
Sun, Feb 2, 2020 - 12:00 PM to 3:00 PM
PD10: Non-contact additive technologies in contemporary electronics production and related fields
Instructor: Gustaf Martensson, Ph.D., Expert Complex Fluids, Mycronic AB
Seminar Type: Professional Development
Track: Assembly
Location: 30DE
Download Presentation - PD10_APEX2020_Gustaf Martensson
Sun, Feb 2, 2020 - 12:00 PM to 3:00 PM
PD11: ECM for the Rest of Us. How ECM Affects all Electronic Assemblies and Best-Practice Techniques to Mitigate ECM-Related Failures While Complying with the New IPC Cleanliness Testing Requirements
Instructor: Michael Konrad, President & CEO, Aqueous Technologies
Seminar Type: Professional Development
Track: Quality and Reliability
Location: 30A
Download Presentation - PD11_APEX2020_Eric Camden
Download Presentation_PD11_Mike Konrad
Sun, Feb 2, 2020 - 12:00 PM to 3:00 PM
PD12: Design for Excellence: DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly) and More - Part II
Instructor: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Seminar Type: Professional Development
Track: Design
Location: 30BC
Download Presentation - PD12_Part2_APEX2020_DaleLee
Sun, Feb 2, 2020 - 1:00 PM to 2:30 PM
CCC: Standards Development Meeting Chairman Council (By Invitation)
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
Location: 24 A-C
Sun, Feb 2, 2020 - 3:30 PM to 7:00 PM
IPC Committee Chairmen's Reception (By Invitation)
Seminar Type: Special Event
Track: Quality, Reliability and Test
Location: Ballroom 20 Foyer Area
Mon, Feb 3, 2020 - 7:30 AM to 5:00 PM
EMS Management Meeting
Speaker: Dan Radler, Director of Factory Technology, Tempo Automation
Speaker: Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Speaker: Ken Michael, Vice President and Owner, Dox Electronics, Inc
Speaker: Paul Jarski, Enterprise Electronics Lifecycle Manager, John Deere
Speaker: Haris Basit, CEO, Averatek
Speaker: David Rogers, Global Account Manager, Siemens Industry Inc
Speaker: Andy Marris CPLP, Learning and Development Manager, MRA
Speaker: Roger Smith, DoD Executive Agent, rinted Circuit Board & Interconnect Technologies
Speaker: Matt Turbin, Advisor
Seminar Type: Management
General Committee: Management
Location: 33C
Aegis-Ford-IPC CFX and the Next Phase of Industry 4.0
Averatek-Basit-Semi-Additive Processing
IPC-Cherry-IPC-1791 Trusted Electronic Supplier
IPC-DuBravac-Thriving in a Sluggish Year
IPC-JMitchell-IPC Update - New Positions, Thought Leadership, Education Initiatives
John Deere-Jarski-Electronics Component Lifecycles & Obsolescence
MRA-Marris-Management Drivers of Employee Engagement
Tempo-Radler-Lean Software-Driven PCBA
IPC EMS Management Meeting Attendee Roster for Networking
IPC-CMitchell-Trade Update
Mon, Feb 3, 2020 - 8:00 AM to 12:00 PM
2-17: Connected Factory Initiative
Committee Chair: Jason Spera, CEO, Aegis Software
Committee Chair: Matt Kelly, Senior Technical Staff Member, IBM Corporation
Committee Chair: Marc Peo, President, Heller Industries
Seminar Type: Standards Development Meeting
General Committee: Electronic Product Data Description
Location: 25B
Mon, Feb 3, 2020 - 8:00 AM to 12:00 PM
3-11: Laminate/Prepreg Materials SubStandards Development Meeting
Committee Chair: Tony Senese, Group Manager-Business Development, Panasonic Industrial Devices
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 28A
Mon, Feb 3, 2020 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Specification Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 28B
Mon, Feb 3, 2020 - 8:00 AM to 10:00 AM
5-32A: Ion Chromatography/Ionic Conductivity Task Group
Committee Chair: David Lober, Process Chemist, Kyzen Corporation
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 29D
Mon, Feb 3, 2020 - 8:00 AM to 12:00 PM
7-31FS: IPC/WHMA-A-620 Space Electronic Assemblies Addendum Task Group
Committee Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 25A
Mon, Feb 3, 2020 - 8:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
Location: 23B
Mon, Feb 3, 2020 - 8:00 AM to 10:00 AM
7-31MCRT: Certification Standards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29A
Mon, Feb 3, 2020 - 8:00 AM to 12:00 PM
D-33AT: IPC-6012 Training Standards Development Meeting
Seminar Type: Standards Development Meeting
Location: 25C
Mon, Feb 3, 2020 - 8:00 AM to 5:00 PM
E-31B: Materials Declaration Task Group
Committee Chair: Aidan Turnbull, Managing Director, BomCheck
Committee Chair: Mark Frimann, SC Product Stewardship Mng, Texas Instruments Inc.
Committee Chair: JB Hollister, Environmental Engineer, Apple Inc.
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 29B
Mon, Feb 3, 2020 - 8:00 AM to 5:00 PM
Press Office
Seminar Type: Special Event
Location: 28D
Mon, Feb 3, 2020 - 9:00 AM to 12:00 PM
PD13: Reliability of Electronics - the Role of Intermetallic Compounds
Instructor: Jennie Hwang, PhD., CEO, H-Technologies Group
Seminar Type: Professional Development
Track: Assembly
Location: 32AB
Download Presentation - PD13_APEX2020_Jennie Hwang
Mon, Feb 3, 2020 - 9:00 AM to 12:00 PM
PD14: AIAG - Effective Problem Solving Workshop - Part 1
Instructor: Jill Kitka-Leonard, AIAG
Seminar Type: Professional Development
Track: Leadership
Location: 31C
Download Presentation - PD14_Part 1_APEX2020_Jill Kitka-Leonard
Mon, Feb 3, 2020 - 9:00 AM to 12:00 PM
PD15: PCB Designers Guide to Flip-Chip, WLP, FOWLP, 2D, 2.5D and 3D Semiconductor Package Technologies
Instructor: Vern Solberg, Principle Consultant, Solberg Technical Consulting
Seminar Type: Professional Development
Track: Design
Location: 31AB
Download Presentation - PD15_APEX2020_Vern Solberg
Mon, Feb 3, 2020 - 9:00 AM to 12:00 PM
PD16: Thermal Management Using Thermal Interface Materials
Instructor: Rita Mohanty, Director of Application Engineering and Technical Customer Service, Henkel Corporation
Seminar Type: Professional Development
Location: 30DE
Download Presentation - PD16_APEX2020_Rita Mohanty
Mon, Feb 3, 2020 - 9:00 AM to 12:00 PM
PD17: Troubleshooting Yield Problems in a Lead Free World
Instructor: Ray Prasad, President, Ray Prasad Consultancy Group
Seminar Type: Professional Development
Track: Assembly
Location: 30BC
Download Presentation - PD17_APEX2020_Ray Prasad
Mon, Feb 3, 2020 - 10:00 AM to 5:00 PM
7-31B: IPC-A-610 Task Group
Committee Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Committee Chair: Tiberiu Baranyi, Technical Support Manager, Flex
Committee Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Committee Chair: Robert Fornefeld, Master IPC Trainer, STI Electronics, Inc.
Committee Chair: Milea Kammer, Sr. Product Design Engineer, Honeywell International
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 24 A-C
Mon, Feb 3, 2020 - 10:00 AM to 5:00 PM
Technical Conference Featuring The Fundamentals Track
Moderator: Brook Sandy-Smith, Technical Education & Conference Program manager, IPC
Seminar Type: Technical Conference Session
Location: 30A
Mon, Feb 3, 2020 - 10:15 AM to 12:00 PM
2-19B: Trusted Supplier Task Group
Committee Chair: Richard Snogren, President, Bristlecone LLC
Committee Chair: William May, Mechanical Engineer, Naval Surface Warefare Ctr
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 23C
Mon, Feb 3, 2020 - 10:15 AM to 12:00 PM
5-31J: Cleaning Compatibility Task Group
Committee Chair: Eddie Hofer, M&P Engineer, Collins Aerospace
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 29D
Mon, Feb 3, 2020 - 10:15 AM to 12:00 PM
5-32b Heffalumps-AT
Committee Chair: Douglas Pauls, Principal Materials and Process Engineer, Collins Aerospace
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 28B
Mon, Feb 3, 2020 - 10:15 AM to 12:00 PM
7-11: Test Methods SubStandards Development Meeting
Committee Chair: Joseph Russeau
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Testing
Location: 29C
Mon, Feb 3, 2020 - 10:15 AM to 12:00 PM
7-43CRT: IPC-7711 7721 Certification Standards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29A
Mon, Feb 3, 2020 - 10:15 AM to 12:00 PM
D-36: Printed Board Process Capability, Quality and Relative Reliability Benchmark Test SubStandards Development Meeting
Committee Chair: Albert Block, Chief Manufacturing Strategist, National Instruments
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Rigid Printed Boards
Location: 28C
Mon, Feb 3, 2020 - 12:00 PM to 1:30 PM
Government Relations Working Lunch(By Invitation)
Seminar Type: Standards Development Meeting
Location: 27B
Mon, Feb 3, 2020 - 12:00 PM to 1:30 PM
ML: Event Awards Luncheon
Seminar Type: Special Event
Location: 20D
Mon, Feb 3, 2020 - 1:30 PM to 5:00 PM
1-10C: Test Coupon and Artwork Generation Task Group
Committee Chair: Philip Henault, Development Engineer, Raytheon Company
Seminar Type: Standards Development Meeting
Track: Emerging Technologies
General Committee: Printed Board Design Technology
Location: 28C
Mon, Feb 3, 2020 - 1:30 PM to 5:00 PM
1-14: DFX Standards SubStandards Development Meeting
Committee Chair: Dock Brown, Senior Technical Staff, DfR Solutions
Committee Chair: Stephen Golemme, Senior Market Development Specialist, Rogers Corporation
Committee Chair: Karen McConnell, Manager, EDA, Northrop Grumman Corporatioin
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Printed Board Design Technology
Location: 25A
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
2-19A: Critical Components Traceability Task Group
Committee Chair: Cameron Shearon, Principal Engineer, Raytheon Company
Committee Chair: Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 23C
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 28A
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
4-14: Plating Processes SubStandards Development Meeting
Committee Chair: George Milad, National Accounts Manager for Technology, Uyemura International Corp.
Committee Chair: Gerard O'Brien, President, Solderability Testing and Solutions, Inc.
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Fabrication Processes
Location: 28B
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
5-24F: Underfill Materials Design, Selection and Process Task Group
Committee Chair: Bill Vuono, Sr. Process Engineer, Qorvo US, Inc.
Committee Chair: Brian Toleno, Ph.D., Principal Material Scientist, Micrsoft Corporation
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 29C
Mon, Feb 3, 2020 - 1:30 PM to 3:00 PM
5-33C: Conformal Coat Handbook
Committee Chair: Amy Hagnauer, Manufacturing Engineer, Raytheon Company
Committee Chair: Jason Keeping, Project Manager, Celestica International
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 29D
Mon, Feb 3, 2020 - 1:30 PM to 5:00 PM
7-31FT: IPC WHMA-A-620 Training Standards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Assembly and Joining
Location: 25C
Mon, Feb 3, 2020 - 1:30 PM to 5:00 PM
D-33ACRT: IPC-6012 Certification Standards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29A
Mon, Feb 3, 2020 - 2:00 PM to 5:00 PM
PD18: PCB Quality Metrics that Drive Reliability
Instructor: Bhanu Sood, PhD., PCB Risk Assessment Engineer, NASA Goddard Space Flight Center
Seminar Type: Professional Development
Track: Quality and Reliability
Location: 32AB
Download Presentation - PD18_APEX2020_Bhanu Sood
Mon, Feb 3, 2020 - 2:00 PM to 5:00 PM
PD19: AIAG - Effective Problem Solving Workshop - Part 2
Instructor: Jill Kitka-Leonard, AIAG
Seminar Type: Professional Development
Location: 31C
Download Presentation - PD19_Part 2_APEX2020_Jill Kitka-Leonard
Mon, Feb 3, 2020 - 2:00 PM to 5:00 PM
PD20: Weeding out PCB Fabrication defects before Assembly
Instructor: Bihara Patel, President, SMT Connection Inc
Seminar Type: Professional Development
Track: PCB Fabrication
Location: 31AB
Download Presentation_PD20_APEX2020_Bih ari Patel
Mon, Feb 3, 2020 - 2:00 PM to 5:00 PM
PD21: PCB Fabrication Basics: Process and Specification
Instructor: Jim Vanden Hogen, Sr. PCB Designer, San Diego PCB Design, LLC
Seminar Type: Professional Development
Track: PCB Fabrication
Location: 30DE
Download Presentation - PD21_APEX2020_Jim Vanden Hogen
Mon, Feb 3, 2020 - 2:00 PM to 5:00 PM
PD22: Challenges of Implementing and Improving a Batch Wash System
Instructor: Bill Capen, Engineering Tech Specialist, Honeywell Aerospace
Seminar Type: Professional Development
Track: Quality and Reliability
Location: 30BC
Download Presentation - PD22_APEX2020_Bill Capen
Mon, Feb 3, 2020 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable Task Group
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 28A
Mon, Feb 3, 2020 - 3:15 PM to 5:00 PM
5-32C: Bare Board Cleanliness Assessment Task Group
Committee Chair: David Lober, Process Chemist, Kyzen Corporation
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 29D
Mon, Feb 3, 2020 - 3:15 PM to 5:00 PM
5-33g: Low Pressure Molding Task Group
Seminar Type: Standards Development Meeting
General Committee: Assembly and Joining
Location: 28B
Mon, Feb 3, 2020 - 3:15 PM to 5:00 PM
B-10A/JEDEC: Joint Meeting: Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1
Committee Chair: Stephen Tisdale, Tisdale Environment Consulting LLC
Committee Chair: Steven Martell, Advanced Applications Support Manager, Nordson Sonoscan Inc.
Seminar Type: Standards Development Meeting
Track: Industry Analysis and Issues (ESTC)
Location: 23B
Mon, Feb 3, 2020 - 3:15 PM to 4:30 PM
D-33AM: IPC-6012 Medical Device Addendum Task Group
Committee Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Boards
Location: 25B
Mon, Feb 3, 2020 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling SubStandards Development Meeting
Committee Chair: Joseph Kane, Sr. Principle Engineer, BAE Systems
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Rigid Printed Boards
Location: 29C
Mon, Feb 3, 2020 - 5:00 PM to 6:30 PM
BY INVITATION ONLY: Technical Activities Executive Committee
Seminar Type: Management
Track: PCB Fabrication and Materials
Location: 23A
Mon, Feb 3, 2020 - 5:00 PM to 6:00 PM
Newcomers Networking Reception
Seminar Type: Special Event
Location: Upstairs Foyer Area(Near the Newcomers Lounge)
Mon, Feb 3, 2020 - 5:30 PM to 6:30 PM
International Reception
Seminar Type: Special Event
Location: Ballroom 20 Foyer(Upstairs)
Mon, Feb 3, 2020 - 5:30 PM to 9:00 PM
VIP: IPC EMS Managemnet Dinner
Seminar Type: Management
Tue, Feb 4, 2020 - 7:00 AM to 8:00 AM
Hall of Fame Council Breakfast(By Invitation)
Seminar Type: Special Event
Location: 23A
Tue, Feb 4, 2020 - 7:30 AM to 8:30 AM
Speaker Breakfast (By invitation)
Seminar Type: Special Event
Location: 28E
Tue, Feb 4, 2020 - 8:00 AM to 10:00 AM
001 Handbook Celebration(By Invitation)
Seminar Type: Standards Development Meeting
Location: 29A
Tue, Feb 4, 2020 - 8:00 AM to 9:30 AM
Keynote Sessions - IPC President and CEO, John Mitchell| An IPC Vision of the Future Keynote | Burt Rutan | SpaceShipOne: A New Era in Commercial Space Travel and the New Race for Space
Speaker: Burt Rutan
Speaker: John Mitchell, IPC President and CEO, IPC
Seminar Type: Special Event
Location: 20D
Tue, Feb 4, 2020 - 9:45 AM to 10:00 AM
Ribbon Cutting Ceremony
Seminar Type: Special Event
Location: Lobby D(Near Registration)
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
2-15F: Obsolete and Discontinued Product Task Group
Committee Chair: Adam Wheeler, Principal Consultant, Anthesis Group
Committee Chair: Curtis Grosskopf, Senior Engineer, IBM Corporation
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 25A
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
2-30: Terms and Definitions Standards Development Meeting
Committee Chair: Steven Bowles, Flex Circuit Applications Engineer, DuPont
Committee Chair: Vicka Hammill, Fellow Engineer, Honeywell
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Terms and Definitions
Location: 28A
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
2-40: Electronic Documentation Technology Standards Development Meeting
Committee Chair: Gary Carter, ECAD Product Engineer, XPLM Solution, Inc.
Seminar Type: Standards Development Meeting
Track: Design
General Committee: Electronic Documentation Technology
Location: 23C
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Committee Chair: Erik Bergum, VP Technology and Engineery, Founder PCB USA
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Base Materials
Location: 25B
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
5-21K: IPC-SM-817 SMT Adhesive Task Group
Committee Chair: Lance Brack, Sr. Electrical Engineer, Raytheon Missile Systems
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 26AB
Tue, Feb 4, 2020 - 10:00 AM to 11:00 AM
5-22F: J-STD-001 Handbook Task Group
Committee Chair: John Mastrides
Committee Chair: Scott Meyer, Special Process Compliance Manager, Collins Aerospace
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 29A
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
5-22H/5-45: Reflow Oven Process Control SubStandards Development Meeting and Thermal Profiling Guide Task Group - Joint Meeting
Committee Chair: Linda Woody, LWC Consulting
Committee Chair: Ray Prasad, President, Ray Prasad Consultancy Group
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Assembly and Joining
Location: 23B
IPC 7530A & 7801 Joint Meeting Agenda
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
5-24G: IPC Polymerics Standard Task Group
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Location: 29C
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
5-32B: SIR and Electrochemical Migration Task Group
Committee Chair: Graham Naisbitt, CEO and Chairman, GEn3 Systems Limited
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 28C
Tue, Feb 4, 2020 - 10:00 AM to 5:00 PM
7-31BV: Automotive Addendum Task Group
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 24 A-C
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
D-24D: High Frequency Loss Test Methods Task Group
Committee Chair: Xiaoning Ye, Principal Engineer, Intel Corporation
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: High Speed/High Frequency Interconnections
Location: 28B
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
E-31H: Conflict Minerals Data Exchange Task Group
Committee Chair: Aidan Turnbull, Managing Director, BomCheck
Committee Chair: Nikki Johnson, Environmental Compliance Manager, Total Parts Plus, Inc.
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 25C
Tue, Feb 4, 2020 - 10:00 AM to 10:30 AM
Poster Presentations - No charge to attend
Seminar Type: Posters
Location: Ballroom 20 Foyer(Upstairs Meetings Area)
Tue, Feb 4, 2020 - 10:00 AM to 12:00 PM
V-TSL: Technology Solutions Committee
Committee Chair: Michael Carano, VP Technology and Business Development, RBP Chemical Technology
Seminar Type: Standards Development Meeting
General Committee: Management
Location: 27B
Tue, Feb 4, 2020 - 12:00 PM to 1:30 PM
TL: Awards Luncheon and IPC Annual Meeting
Seminar Type: Special Event
Location: Ballroom 20D
Tue, Feb 4, 2020 - 1:00 PM to 5:00 PM
5-22AS/5-22AD: Requirements for Military Systems and Space Electronic Assemblies J-STD-001 Addendum
Committee Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
Location: 26AB
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
I-02  interACTION: Precision Cleaning and Surface Treatment Techniques for Achieving Reliable Conformal Coating Adherence
Moderator: Brook Sandy-Smith, Technical Education & Conference Program manager, IPC
Seminar Type: Sessions @ The Intersection
Track: Quality, Reliability and Test
Location: 33AB
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
I-01 Building Synergies in Power Electronics (in collaboration with PSMA) 
Moderator: Brian Zahnstecher, Director, PowerRox LLC
Seminar Type: Sessions @ The Intersection
Track: Power Electronics
Location: 32AB
Tue, Feb 4, 2020 - 1:30 PM to 5:00 PM
1-13: Land Pattern SubStandards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Printed Board Design Technology
Location: 25A
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
4-33: Halogen-Free Materials SubStandards Development Meeting
Committee Chair: Naji Norder, Principle Hardware Engineer, National Instruments
Seminar Type: Standards Development Meeting
Track: Environmental Issues and Compliance
General Committee: Environment, Health & Saftey (EHS)
Location: 25B
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
5-21H: Bottom Termination Components (BTC) Task Group
Committee Chair: Ray Prasad, President, Ray Prasad Consultancy Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 25C
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
5-24A: Flux Specifications Task Group
Committee Chair: Kelvin Low, Sigma Ming Goa Electronics, President/Technical Director
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 23B
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
5-32E: Conductive Anodic Filament (CAF) Task Group
Committee Chair: Graham Naisbitt, CEO and Chairman, GEn3 Systems Limited
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 28C
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
5-33A: Conformal Coating Task Group
Committee Chair: Jeffrey Sargeant, Analytical & Technical Services Director, HumiSeal Division of Chase Corporation
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 29C
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
7-24:Printed Board Fabrication and Assembly Process Effects Subcommittee
Committee Chair: Michael Carano, VP Technology and Business Development, RBP Chemical Technology
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Process Control
Location: 27B
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
7-31BCRT: IPC-A-610 Certification Standards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29B
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
7-31MT: IPC-A-640 Training Standards Development Meeting
Committee Chair: Debbie Wade, Master IPC Trainer, Advanced Rework Technologies
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29D
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
D-24C: High Frequency Test Methods Task Group: Frequency-Domain Methods
Committee Chair: John Coonrod, Technical Marketing Manager, Rogers Corporation
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: High Speed/High Frequency Interconnections
Location: 28B
Tue, Feb 4, 2020 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Committee Chair: Clifford Maddox, Engineering Specialist, Boeing Company
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Printed Board Design Technology
Location: 28A
Tue, Feb 4, 2020 - 1:30 PM to 5:00 PM
D-55/D-55A: Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group - Joint Meeting
Committee Chair: Bhanu Sood, PhD., PCB Risk Assessment Engineer, NASA Goddard Space Flight Center
Committee Chair: Rajesh Kumar, VP of Technology Solutions, TTM Technologies
Seminar Type: Standards Development Meeting
Track: Emerging Technologies
General Committee: Embedded Devices
Location: 29A
Tue, Feb 4, 2020 - 1:30 PM to 5:00 PM
E-31J: Laboratory Report Declaration Task Group
Committee Chair: JB Hollister, Environmental Engineer, Apple Inc.
Committee Chair: Jason Gooden
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 23C
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
I-03 INTERACTION: I4.0 - Inspection as The Currency of The Smart Factory
Moderator: Bill Cardoso, President, Creative Electron, Inc.
Speaker: Jeff Mason, Neotech
Speaker: Oliver Perez, Director of Engineering, Edward Life Sciences
Seminar Type: Sessions @ The Intersection
Location: 33C
Tue, Feb 4, 2020 - 1:30 PM to 2:30 PM
IPC EMS Council Steering Committee
Seminar Type: Standards Development Meeting
Track: Leadership
General Committee: Management
Location: 23A
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
S01: BTC Challenges
Moderator: Milos lazic, Indium Corporation
Speaker: Norman Armendariz, PhD., Engineering Fellow, Raytheon Company
Speaker: Greg Smith, BlueRing Stencils
Speaker: Udo Welzel, Robert Bosch GmbH
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 30DE
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
S02: Design for Manufacturability
Moderator: Julie Silk, Keysight Technologies
Speaker: Antonio Caputo, Ph.D., Packaging R & D Engineer, Intel Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test
Location: 30BC
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
S03: Industry Advancements Related to Standards Updates
Moderator: Beverley Christian, Ph.D., HDP User Group
Speaker: Mike Bixenman, PhD., CTO, Kyzen Corporationporation
Speaker: Stevan Hunter PhD., Reliability Engineering Consultant, ON Semiconductor
Speaker: Ben Gumpert, Manufacturing Engineer, Lockheed Martin
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 31AB
Tue, Feb 4, 2020 - 1:30 PM to 3:00 PM
S04: Semi-Additive Process
Speaker: Audra Thurston, Process Engineer, Calumet Electronics
Speaker: Mike Vinson, President and COO, Averatek
Moderator: Britta Schafsteller, Ph.D., Global product manager, Atotech Deutschland GmbH
Seminar Type: Technical Conference Session
Track: Environmental Issues and Compliance
Location: 31C
Tue, Feb 4, 2020 - 3:15 PM to 5:00 PM

5-22AROSE: Rose Working Group

Committee Chair: Douglas Pauls, Principal Materials and Process Engineer, Collins Aerospace
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 27B
Tue, Feb 4, 2020 - 3:15 PM to 5:00 PM
3-11F: UL/CSA Task Group
Committee Chair: David Sommervold, Senior Principal Engineer, Henkel US Operations Corp.
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Base Materials
Location: 25B
Tue, Feb 4, 2020 - 3:15 PM to 5:00 PM
5-22BCRT: J-STD-001 Certification Standards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29B
Tue, Feb 4, 2020 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Committee Chair: Jennie Hwang, PhD., CEO, H-Technologies Group
Seminar Type: Standards Development Meeting
General Committee: Assembly and Joining
Location: 23B
Tue, Feb 4, 2020 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Test Methods Task Group
Committee Chair: Reza Ghaffarian, PhD., Principal Engineer, Jet Propulsion Laboratory
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
Location: 28C
Tue, Feb 4, 2020 - 3:15 PM to 5:00 PM
7-34: Repairability SubStandards Development Meeting
Committee Chair: Daniel Foster, Quality Assurance Specialist, Missile Defense Agency
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 29C
Tue, Feb 4, 2020 - 3:15 PM to 5:00 PM
7-34T: IPC 7711 7721 Training Standards Development Meeting
Committee Chair: Patricia Scott, Director of Training Services, STI Electronics, Inc.
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29D
Tue, Feb 4, 2020 - 3:15 PM to 5:00 PM
D-24B: Bereskin Test Method Task Group
Committee Chair: David Wynants, Process Engineer, AGC Nelco America
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
Location: 28B
Tue, Feb 4, 2020 - 3:15 PM to 5:00 PM
D-33AA: IPC-6012 Automotive Addendum Task Group
Committee Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Location: 25C
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM
I-05: interACTION: Emerging Technology - Semi-Additive Process
Moderator: Tara Dunn, Omni PCB
Speaker: Roger R Smith, Staff Engineer, Technical Lead, PrCB EA, NSWC Crane
Speaker: Don Dupriest, Lockheed Martin Missiles & Fire Control
Seminar Type: Sessions @ The Intersection
Track: PCB Fabrication and Materials
Location: 33AB
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM
I-04: Why Your Supply Chain Needs Diversity (in collaboration with WBENC)
Moderator: Mia Delano, Executive Lead, Business Development & Engagement, WBENC
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 32AB
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM
I-06  Smart Factory Automation Using IPC-DPMX and IPC-CFX
Moderator: Patrick Crawford, IPC
Speaker: Hemant Shah, Cadence Design Systems Inc.
Speaker: Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Speaker: Chris Shaw, Sr. Design Automation Analyst, Fujitsu Network Communications
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 33C
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM
S05: Advances in Dispensing
Moderator: Milos lazic, Indium Corporation
Speaker: Sunny Agarwal, Applications Engineer III, ITWEAE
Speaker: Leonard Allison, , Engineered Materials Systems, Inc.
Speaker: Gustaf Martensson, Ph.D., Expert Complex Fluids, Mycronic AB
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 30DE
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM
S06: Reliability Testing
Moderator: Stanton Rak, Ph.D., Continental Automotive Systems
Speaker: Lynda Pelley, Teledyne DALSA
Speaker: Udo Welzel, Robert Bosch GmbH
Speaker: Reza Ghaffarian, PhD., Principal Engineer, Jet Propulsion Laboratory
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test
Location: 30BC
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM
S07: Industry 4.0 
Moderator: Martin Goetz, Ph.D., Northrop Grumman Corporation
Speaker: Juthika Khargharia, SAS
Speaker: Zohair Mehkri, Manager, Flex
Speaker: David Huntley, PDF Solutions
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 31C
Tue, Feb 4, 2020 - 3:30 PM to 5:00 PM
S08: Proposition 65–Important to Any Companies Doing Business in California
Moderator: Kelly Scanlon, DrPH, CIH, Director of Environment, Health and Safety Policy and Research, IPC, Government Relations
Speaker: Michael Easter, Principal, EnSIGHT
Speaker: ​Carol Monahan Cummings, Chief Counsel, California Office of Environmental Health Hazard Assessment (OEHHA)
Seminar Type: Technical Conference Session
Track: Environmental Issues and Compliance
Location: 31AB
Tue, Feb 4, 2020 - 4:00 PM to 5:00 PM

Government Relations Reception: From DC to Brussels, Beijing & Beyond Reception.  How IPC Advocates for Your Company & How You Can Get Involved

Seminar Type: Special Event
Location: Ballroom 20 Foyer (Upper level)
Tue, Feb 4, 2020 - 5:00 PM to 6:00 PM
IPC APEX EXPO show floor reception
Seminar Type: Special Event
Tue, Feb 4, 2020 - 6:00 PM to 7:30 PM
Women in Electronics Reception
Speaker: Elaine Larsen
Seminar Type: Special Event
Location: 33A
Wed, Feb 5, 2020 - 7:30 AM to 9:00 AM
2581 Users Group
Seminar Type: Standards Development Meeting
Location: 25A
Wed, Feb 5, 2020 - 8:00 AM to 11:00 AM

5-21N: Cold Joining Press-fit Handbook Task Group

Committee Chair: Hans-Peter Tranitz
Committee Chair: Udo Welzel, Robert Bosch GmbH
Seminar Type: Standards Development Meeting
Location: 23A
Wed, Feb 5, 2020 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
Committee Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 29C
Wed, Feb 5, 2020 - 8:00 AM to 10:00 AM
5-21G: Flip Chip Mounting Task Group
Committee Chair: Ife Hsu, Technology & Standards Development, Intel Corporation
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 29A
Wed, Feb 5, 2020 - 8:00 AM to 10:00 AM
5-24B: Solder Paste Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 25C
Wed, Feb 5, 2020 - 8:00 AM to 10:00 AM
5-33AWG: Conformal Coating Requirements Working Group
Committee Chair: Douglas Pauls, Principal Materials and Process Engineer, Collins Aerospace
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 25B
Wed, Feb 5, 2020 - 8:00 AM to 12:00 PM
7-31ACRT: IPC-A-600 Certification Standards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29D
Wed, Feb 5, 2020 - 8:00 AM to 10:00 AM
7-31BT: IPC-A-610 Training Standards Development Meeting
Committee Chair: Mary Muller, Independent Contractor
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 28B
Wed, Feb 5, 2020 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Committee Chair: Catherine Hanlin, General Manager, Precision Manufacturing Company, Inc.
Committee Chair: Richard Rumas, Technical Manager, Honewell Canada
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 24 A-C
Wed, Feb 5, 2020 - 8:00 AM to 12:00 PM
7-31H/7-31K: Joint Meeting - IPC-HDBK-620 Handbook and Wire Harness Design Task Groups
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Track: Design
General Committee: Product Assurance
Location: 27A
Wed, Feb 5, 2020 - 8:00 AM to 10:00 AM
D-15: Flexible Circuits Test Methods SubStandards Development Meeting
Committee Chair: Russell Shepard
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 28A
Wed, Feb 5, 2020 - 8:00 AM to 10:00 AM
D-22: High Speed/High Frequency Board Performance SubStandards Development Meeting
Committee Chair: Lance Auer, Conductor Analysis Tecnology
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: High Speed/High Frequency Interconnections
Location: 23B
Wed, Feb 5, 2020 - 8:00 AM to 12:00 PM
D-70: E-Textiles Standards Development Meeting
Committee Chair: Carole Winterhalter
Committee Chair: Stephanie Rodgers, Director Product Development, Apex Mills, Inc.
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Committee: Wearable Electronics/E-Textiles
Location: 29B
Wed, Feb 5, 2020 - 8:00 AM to 12:00 PM
E-31: Supplier Declaration SubStandards Development Meeting
Committee Chair: Randall Flinders, Sr. Manager of Support, Geensoft Technology Inc.
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
Location: 23C
Wed, Feb 5, 2020 - 9:00 AM to 3:00 PM
2-16: Product Data Description (2581)
Committee Chair: Gary Carter, ECAD Product Engineer, XPLM Solution, Inc.
Committee Chair: Edward B Acheson, Sr. Principal Product Engineer, Cadence Design Systems Inc.
Committee Chair: Chris Shaw, Sr. Design Automation Analyst, Fujitsu Network Communications
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
Location: 25A
Wed, Feb 5, 2020 - 10:00 AM to 12:00 PM
7-35: Assembly and Joining Handbook SubStandards Development Meeting
Committee Chair: Mary Muller, Independent Contractor
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Product Assurance
Location: 29C
Wed, Feb 5, 2020 - 10:15 AM to 12:00 PM
5-21F: Ball Grid Array Task Group
Committee Chair: Ray Prasad, President, Ray Prasad Consultancy Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 29A
Wed, Feb 5, 2020 - 10:15 AM to 12:00 PM
5-22BT: IPC J-STD-001 Training Standards Development Meeting
Seminar Type: Standards Development Meeting
Location: 28B
Wed, Feb 5, 2020 - 10:15 AM to 12:00 PM
5-23A: Printed Circuit Board Solderability Specifications Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 28C
Wed, Feb 5, 2020 - 10:15 AM to 3:00 PM
5-33B: Solder Mask Performance Task Group
Committee Chair: Fondu Wu, Senior Project Systems Engineer, Raytheon Company
Committee Chair: Rene Martinez, Materials & Process Manager, Northrop Grumman Corporatioin
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Cleaning and Coating
Location: 25B
Wed, Feb 5, 2020 - 10:15 AM to 12:00 PM
D-12: Flexible Circuits Specifications SubStandards Development Meeting
Committee Chair: Nick Koop, Director of Flex Technology, TTM Technologies
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 28A
Wed, Feb 5, 2020 - 10:15 AM to 12:00 PM
SPVC: IPC Solder Products Value Council
Seminar Type: Management
Track: Emerging Technologies
Location: 23B
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM
I-07: interACTION: Best Practices for Strategic Board Procurement
Moderator: Gregory Papandrew, Better Board Buying
Speaker: Nat Mani, CEO
Speaker: Clement Yuen, Managing Director, DirectPCB China—Offshore PCB Supplier
Speaker: Albert Block, Chief Manufacturing Strategist, National Instruments
Seminar Type: Sessions @ The Intersection
Track: PCB Fabrication and Materials
Location: 31C
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM
I-08: interACTION: An Update on the Electronics Manufacturing Industry’s “Hidden Threat” Weak Microvia Interfaces 
Dennis Fritz, Technology Consultant
Jimmy Baccam, Lockheed Martin Missiles & Fire Control
Maarten Cauwe PhD., imec-CMST
Seminar Type: Sessions @ The Intersection
Track: PCB Fabrication and Materials
Location: 32AB
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM
I-09 Emerging Technology - Laminate Advancements for 5G: Part 1
Moderator: David Hoover, TTM Technologies
Speaker: Darren Hitchcock, Panasonic
Speaker: Alexander Ippich, ISOLA
Speaker: John Coonrod, Technical Marketing Manager, Rogers Corporation
Seminar Type: Sessions @ The Intersection
Location: 33AB
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM
S09: Novel Soldering Processes
Moderator: Russell Nowland, Nokia Corporation
Speaker: Robert McKerrow, Product Specialist for the CMD product lines, Indium Corporation
Speaker: Gerjan Diepstraten, Advanced Technology Manager, ITWEAE
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 30A
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM
S10: Industry 4.0 II
Moderator: Martin Goetz, Ph.D., Northrop Grumman Corporation
Speaker: Ranjan Chatterjee, Vice President and General Manager, Cimetrix
Speaker: Martin Franke, Research Group Leader, Siemens AG, Corporate Technology
Speaker: Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Seminar Type: Technical Conference Session
Track: Emerging Technologies
Location: 30DE
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM
S11: Surface Treatments
Moderator: Karl Sauter, Oracle America, Inc.
Speaker: Richard Hollman, ASM NEXX
Speaker: Roger Massey, Technical Marketing Manager, Atotech GmbH
Speaker: Neal Wood, Global Product Marketing Manager, Atotech
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 31AB
Wed, Feb 5, 2020 - 10:30 AM to 12:00 PM
S12: Automated End-of-line Testing
Moderator: Udo Welzel, Robert Bosch GmbH
Speaker: Louis Ungar, President, A.T.E. Solutions Inc.
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test
Location: 30BC
Wed, Feb 5, 2020 - 12:00 PM to 1:30 PM
4-30: Environment, Health & Safety Steering Standards Development Meeting
Committee Chair: Bret Bruhn
Seminar Type: Standards Development Meeting
Location: 25C
Wed, Feb 5, 2020 - 12:00 PM to 1:30 PM
Event Awards Luncheon
Seminar Type: Special Event
Location: 20D
Wed, Feb 5, 2020 - 12:00 PM to 1:00 PM
Tradeshow Standards Development Meeting Meeting(By Invitation)
Seminar Type: Standards Development Meeting
Location: 23A
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
I-12 Emerging Technology - Laminate Advancements for 5G: Part 2
Moderator: David Hoover, TTM Technologies
Speaker: Daejo Hong, Doosan
Speaker: Alan Cochran, TUC
Speaker: Pierce Lin, EMC
Seminar Type: Sessions @ The Intersection
Location: 33AB
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
I-11 iNEMI PCB Technology Forum - Session 1: Applications Driving Change 
Moderator: Grace O’Malley, Vice President of Technical & Project Operations, iNEMI
Speaker: Emma Hudson, CEO & Owner, Emma Hudson Technical Consultancy Ltd
Speaker: Justin JJ Johno, Field Engineer, PWB/Substrates Materials, Hitachi Chemical Co. America, Ltd.
Speaker: Shiuh-Kao (SK) Chiang, Managing Partner, Prismark Partners
Speaker: Tarja Rapala, Technical Director, EIPC-The European Institute for the PCB Community
Speaker: Marc Benowitz, CEO, iNEMI - International Electronics
Speaker: Daniel Gamota, Vice President, Manufacturing Technology & Innovation, Jabil Circuit, Inc.
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 33C
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
5-21M: Cold Joining/Press-fit Task Group
Committee Chair: Udo Welzel, Robert Bosch GmbH
Committee Chair: Hans-Peter Tranitz
Seminar Type: Standards Development Meeting
Location: 26AB
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
5-24G: IPC Polymerics Standard Task Group
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Location: 23C
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
7-12: Microsection SubStandards Development Meeting
Committee Chair: Vicka Hammill, Fellow Engineer, Honeywell
Seminar Type: Standards Development Meeting
Track: Test
General Committee: Testing
Location: 29B
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
7-31AT: IPC-A-600 Training Standards Development Meeting
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 28B
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
7-31FCRT: IPC WHMA-A-620 Certification Standards Development Meeting
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 29D
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
D-11: Flexible Circuits Design SubStandards Development Meeting
Committee Chair: William Ortloff, Engineering Fellow, Raytheon
Seminar Type: Standards Development Meeting
Track: Design
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 28A
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
D-23: High Speed/High Frequency Base Materials SubStandards Development Meeting
Committee Chair: Edward Sandor, Application Engineering Mgr, AGC Nelco America
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: High Speed/High Frequency Interconnections
Location: 29A
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
D-61A: Flexible Printed Electronics Design Standard Task Group
Committee Chair: Alan Burk, President, ALMAX
Seminar Type: Standards Development Meeting
Track: Printed Electronics
General Committee: Printed Electronics
Location: 27A
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
E-31A: Manufacturing Process Declaration Task Group
Committee Chair: Fritz Byle, Production Engineer, Astronautics Corp. of America
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Committee: Electronic Product Data Description
Location: 28C
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
I-10 E-textiles by PEK: Print, Embroider, Knit
Moderator: Stephanie Rodgers, Director Product Development, Apex Mills, Inc.
Speaker: Connie Huffa, President, Fabdesigns, Inc.
Speaker: Bill Babe, Principal Process Engineer, Liquid X Printed Metals
Speaker: Christopher Anderson, Ph.D., ZSK Research and Training Center A Division of ZSK Stickmaschinen GmbH
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 31C
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
I-13  What Management Needs to Know About 2020 IT and Security Best Practices
Speaker: Ken Michael, Vice President and Owner, Dox Electronics, Inc
Speaker: Larry Cohen, Senior Account Executive, Dox Electronics Inc.
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 32AB
Wed, Feb 5, 2020 - 1:30 PM to 5:00 PM
PERM Steering Standards Development Meeting(By Invitation Only)
Seminar Type: Standards Development Meeting
Location: 29C
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
S13: Material Considerations for Aerospace
Moderator: Brian Toleno, Ph.D., Principal Material Scientist, Micrsoft Corporation
Speaker: Yuan (David) Zhao, Principal Engineer, Henkel Corp.
Speaker: Daphne Pappas, Ph.D., R&D and Applications Manager, Plasmatreat USA
Seminar Type: Technical Conference Session
Track: Quality, Reliability and Test
Location: 30A
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
S14: Industry 4.0 III
Moderator: Martin Goetz, Ph.D., Northrop Grumman Corporation
Speaker: Jay Gorajia, Director, Global Services, Siemens Digital Industries Software
Speaker: Carl Ogden, VP of Operations, Intraratio Corporation
Speaker: Marc Peo, President, Heller Industries
Seminar Type: Technical Conference Session
Track: Emerging Technologies
Location: 30DE
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
S15: Surface Finishes 1
Moderator: Beverley Christian, Ph.D., HDP User Group
Speaker: Tom Scimeca, PhD., Main Owner, EFT Plating Services
Speaker: Kunal Shah, PhD., President and chief Scientist, LiloTree
Speaker: Britta Schafsteller, Ph.D., Global product manager, Atotech Deutschland GmbH
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 30BC
Wed, Feb 5, 2020 - 1:30 PM to 3:00 PM
S16: Testing Microvias
Moderator: Bhanu Sood, PhD., PCB Risk Assessment Engineer, NASA Goddard Space Flight Center
Speaker: Roger Massey, Technical Marketing Manager, Atotech GmbH
Speaker: Maarten Cauwe PhD., imec-CMST
Speaker: Kevin Knadle, Principal Engineer, TTM technologies
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 31AB
Wed, Feb 5, 2020 - 2:30 PM to 3:30 PM
Ice Cream Social on the Show Floor
Seminar Type: Special Event
Wed, Feb 5, 2020 - 3:15 PM to 5:00 PM
B-11a: 3-D Electronic Packages SubStandards Development Meeting
Committee Chair: Dudi Amir, Technologist, Intel Corporation
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Packaged Electronic Components
Location: 29B
Wed, Feb 5, 2020 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials SubStandards Development Meeting
Committee Chair: Richard Wessel, Technical Supervisor, Dupont
Seminar Type: Standards Development Meeting
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 28A
Wed, Feb 5, 2020 - 3:15 PM to 5:00 PM
D-21: High Speed/High Frequency Design SubStandards Development Meeting
Committee Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff., DuPont
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: High Speed/High Frequency Interconnections
Location: 25A
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
I-15 iNEMI PCB Technology Forum - Session 2: Materials and Testing Challenges 
Moderator: Grace O’Malley, Vice President of Technical & Project Operations, iNEMI
Speaker: Sarah Czaplewski-Campbell, Advisory PCB Qualification Engineer, IBM
Speaker: Juan Landeros, Design Engineering, Intel Corporation
Speaker: Edward J. Kelley, CTO & Sr. Vice President, Technology, Isola Group SARL
Speaker: Marc Benowitz, CEO, iNEMI - International Electronics
Speaker: Lenora Clark, Director - Autonomous Driving and Safety Technology, MacDermid Alpha Automotive
Speaker: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 33C
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
I-14  interACTION: E-textiles – Application Opportunities, Challenges and Solutions
Moderator: Stephanie Rodgers, Director Product Development, Apex Mills, Inc.
Speaker: Mary Alice Gill, Jabil Circuit, Inc.
Speaker: Ian Tevis, SAFI-Tech
Speaker: Meg Grant, E-Textile Technologist, Meg Grant Consulting
Speaker: Oxana Pantchenko, PhD., Program Manager – Medical Devices, NEXTFLEX
Speaker: Tricia Danitz, Principle Textile Engineer
Speaker: Michael Rein, Senior Product Engineer, AFFOA – Government: Advanced Functional Fabrics
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 31C
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
I-16 interACTION: I4.0 – The Hidden Cost of Data Silos
Speaker: Hassan Aluraibi, Advanced Manufacturing Engineering Manager, Flex
Speaker: Tim Burke, Chief Technology Officer, Arch Systems
Seminar Type: Sessions @ The Intersection
Location: 33AB
Tim Burke
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
S17: Flux Residue Considerations
Moderator: Stanton Rak, Ph.D., Continental Automotive Systems
Speaker: Kim Flanagan, Technical Support Engineer, Indium Corporation
Speaker: Ning-Cheng Lee, PhD., VP Technology, Indium Corporation
Speaker: Douglas Pauls, Principal Materials and Process Engineer, Collins Aerospace
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 30A
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
S18: Getting the Most Out of Your Manufacturing Process
Speaker: Michael Sivigny, Owner and General Manager, CeTaQ Americas
Speaker: Terry York, Regional Product Manager, Kulicke & Soffa Industries Inc
Moderator: Udo Welzel, Robert Bosch GmbH
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 30BC
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
S19: Surface Finishes 2
Moderator: David Hoover, TTM Technologies
Speaker: Saminda Dharmarathna, PhD., Senior Research Scientist, MacDermid Alpha Electronics Solutions
Speaker: Rob Weber, Director of Product Management, Fischer Technology, Inc.
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 30DE
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
S20: Strategies to Enable Miniaturization
Moderator: Weifeng Liu, PhD., Flex
Speaker: Joerg Nolte, Ersa GmbH
Speaker: Robert Carter, Vice President of Business Development and Technology, Oak-Mitsui Technologies
Speaker: Antonio Caputo, Ph.D., Packaging R & D Engineer, Intel Corporation
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 31AB
Wed, Feb 5, 2020 - 4:30 PM to 5:00 PM
Poster Presentations - No charge to attend
Seminar Type: Posters
Location: Ballroom 20 Foyer(Upstairs Meetings Area)
Wed, Feb 5, 2020 - 5:30 PM to 7:30 PM
MIT Meet and Greet(By Invitation Only)
Seminar Type: Special Event
Location: 27B
Wed, Feb 5, 2020 - 6:00 PM to 7:30 PM
Trivia Networking Night
Seminar Type: Special Event
Location: 33A
Thu, Feb 6, 2020 - 8:00 AM to 10:00 AM
3-11G: Corrosion of Metal Finishes Task Group
Committee Chair: Beverley Christian, Ph.D., HDP User Group
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Committee: Base Materials
Location: 25A
Thu, Feb 6, 2020 - 8:00 AM to 12:00 PM
5-21M: Cold Joining/Press-fit Task Group
Committee Chair: Hans-Peter Tranitz
Committee Chair: Udo Welzel, Robert Bosch GmbH
Seminar Type: Standards Development Meeting
Location: 28B
Thu, Feb 6, 2020 - 8:00 AM to 5:00 PM
7-31J: Electronic Box Assemblies Task Group
Committee Chair: Eddie Hofer, M&P Engineer, Collins Aerospace
Committee Chair: Richard Rumas, Technical Manager, Honewell Canada
Seminar Type: Standards Development Meeting
General Committee: Product Assurance
Location: 24A-C
Thu, Feb 6, 2020 - 8:00 AM to 5:00 PM
8-80: PERM Meeting No. 43
Seminar Type: Standards Development Meeting
Location: 26AB
Thu, Feb 6, 2020 - 8:00 AM to 5:00 PM
E-31K: Material Declaration Data Exchange for Aerospace and Defense Task Group
Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
Seminar Type: Standards Development Meeting
Location: 28A
Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM
I-18 interACTION: Conscientious Engineering - Environment
Speaker: Kay Parker, Indium Corporation
Seminar Type: Sessions @ The Intersection
Location: 33C
Thu, Feb 6, 2020 - 9:00 AM to 12:00 PM
PD23: Micro Packaging on Organic Materials
Instructor: David Carmody, Division Manager, San Diego PCB Design
Seminar Type: Professional Development
Track: Design
Location: 30BC
Download Presentation - PD23_APEX2020_David Carmody
Thu, Feb 6, 2020 - 9:00 AM to 12:00 PM
PD24: Fostering Team Effectiveness is a New Competitive Advantage
Instructor: Melanie Proshchenko, Principal Coach & Facilitator, Honeycomb Team Solutions
Seminar Type: Professional Development
Track: Leadership
Location: 30A
Download Presentation - PD24_APEX2020_Melanie Proshchenko
Thu, Feb 6, 2020 - 9:00 AM to 12:00 PM
PD25: Generating Objective Evidence fo J-STD-001 Rev G Am 1
Instructor: Douglas Pauls, Principal Materials and Process Engineer, Collins Aerospace
Seminar Type: Professional Development
Track: Quality and Reliability
Location: 29D
Download Presentation - PD25_APEX2020_Doug Pauls
Thu, Feb 6, 2020 - 9:00 AM to 12:00 PM
PD26: Lessons Learned from the Trenches of SMT Assembly and a Decade of Board Talk
Instructor: Phil Zarrow, President and Principal Consultant, ITM Consulting Inc.
Instructor: W. James Hall, Principal Consultant, ITM Consulting Inc.
Seminar Type: Professional Development
Track: Assembly
Location: 29C
Download Presentation - PD26_APEX EXPO_Phil Zarrow_Jim Hall
Thu, Feb 6, 2020 - 9:00 AM to 12:00 PM
PD27: Dry Film Resist Related Imaging Topics
Instructor: Sean Hill, Product Manager, Eternal Technology Corporation
Seminar Type: Professional Development
Track: PCB Fabrication
Location: 29B
Download Presentation - PD27_APEX2020_SeanHill
Thu, Feb 6, 2020 - 9:00 AM to 12:00 PM
PD28: A Beginner's Guide to Intuitive RF/Microwave PCB design and Prototyping        
Instructor: Benjamin Jordan, Sr Product Marketing Engineer
Seminar Type: Professional Development
Track: Design
Location: 29A
Download Presentation - PD28_APEX2020_Ben Jordan
Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM
S21: Curable Encapsulants
Moderator: Brian Toleno, Ph.D., Principal Material Scientist, Micrsoft Corporation
Speaker: Kent Larson, Dow Performance Silicones
Speaker: Aysegul Kascatan Nebioglu, Ph.D., Sr. R&D team manager, Dymax
Seminar Type: Technical Conference Session
Track: Cleaning/Coating/Contamination
Location: 33AB
Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM
S22: Thermal Interface Solutions
Moderator: Jason Keeping, Project Manager, Celestica International
Speaker: Sanjay Misra, Senior Scientific Principal, Henkel Corporation
Speaker: Ning-Cheng Lee, PhD., VP Technology, Indium Corporation
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 31C
Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM
S24: Alloy Reliability with Bismuth
Moderator: Weifeng Liu, PhD., Flex
Speaker: Sa'd Hamasha, PhD., Auburn University
Speaker: Jasbir Bath, Support Advisory Engineer, Koki Solder America
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 32AB
Thu, Feb 6, 2020 - 9:00 AM to 10:00 AM
S25: Reliability Considerations for Cleaning
Moderator: Stanton Rak, Ph.D., Continental Automotive Systems
Speaker: Jigar Patel, ZESTRON Americas
Speaker: David Lober, Process Chemist, Kyzen Corporation
Seminar Type: Technical Conference Session
Track: Cleaning/Coating/Contamination
Location: 31AB
Thu, Feb 6, 2020 - 9:00 AM to 10:30 AM
SMEMA Council Meeting
Seminar Type: Standards Development Meeting
Track: Printed Electronics
Location: 27A
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM
I-19 interACTION: IPC-7093A Highlights from the New Revision of BTC Design and Assembly Guidelines
Moderator: Ray Prasad, President, Ray Prasad Consultancy Group
Seminar Type: Sessions @ The Intersection
Location: 33AB
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM
I-20 interACTION: Conscientious Engineering: Social Justice and Global Responsibility
Speaker: Kay Parker, Indium Corporation
Seminar Type: Sessions @ The Intersection
Location: 33C
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM
S26: Process Improvements for NPI and Rework
Moderator: Russell Nowland, Nokia Corporation
Speaker: Peter Lu, Senior Engineer, Curtiss Wright
Speaker: Keith Bryant, SMART Group
Speaker: Brian Czaplicki, Director of Technical Marketing Programs, Air-Vac Engineering Company, Inc.
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 30DE
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM
S27: High Frequency
Moderator: John Coonrod, Technical Marketing Manager, Rogers Corporation
Speaker: Juhee Lee, Assistant Research Engineer, ISU Petasys
Speaker: John Coonrod, Technical Marketing Manager, Rogers Corporation
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 31AB
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM
S28: PCB Fabrication
Moderator: Bhanu Sood, PhD., PCB Risk Assessment Engineer, NASA Goddard Space Flight Center
Speaker: Ta Chang Chen, Statistician, Gold Circuit Electronics Ltd.
Speaker: Raanan Novik, Orbotech
Speaker: Hailey Jordan, Quality Engineer, Draper
Speaker: Wade Goldman, Draper
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 32AB
Thu, Feb 6, 2020 - 10:30 AM to 12:00 PM
S29: Materials for Automotive Applications
Moderator: Jason Keeping, Project Manager, Celestica International
Speaker: Arvind Karthikeyan, Auburn University
Speaker: Outi Rusanen, Ph.D., TactoTek
Speaker: Lenora Clark, Director - Autonomous Driving and Safety Technology, MacDermid Alpha Automotive
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 31C
Thu, Feb 6, 2020 - 10:30 AM to 2:00 PM
UL STP Committee (By invitation only)
Seminar Type: Standards Development Meeting
Track: Quality, Reliability and Test
Location: 25A
Thu, Feb 6, 2020 - 12:00 PM to 1:00 PM

PCB Suppliers Council Steering Committee Meeting(By Invitation)

Seminar Type: Standards Development Meeting
Location: 27A
Thu, Feb 6, 2020 - 1:00 PM to 1:30 PM
Passport to Prizes
Seminar Type: Special Event
Location: Booth 3635
Fri, Feb 7, 2020 - 8:00 AM to 5:00 PM
8-80: PERM Meeting No. 43
Seminar Type: Standards Development Meeting
Location: 26AB