Dan is chair of the IPC Printed Electronics Standards Committee and is chair of the group that publishes the iNEMI Large Area Flexible Electronics Roadmap. Dan led the IEEE group to publish the 1st and 2nd printed electronics standards (1620™ and 1620.1™). He serves on technology assessment panels for US agencies (DoE, DoD, NSF) and foreign agencies (A*STAR). Dan was granted 44 patents and co-edited the first book that combined the fields of organic electronics and graphic arts printing. He was named a Motorola Dan Noble Fellow (top 0.1% engineers) and was elevated to IEEE Fellow for contributions to the fields of printed electronics and nanotechnology. Dan earned a Ph.D....