Presenter/Committee Chair(s): 21 - 30 of 298
Presenter/Committee Chair
Benjamin Jordan
Sr Product Marketing Engineer
Ben is a Computer Systems and PCB Engineer with over 20 years of experience in embedded systems, FPGA, and PCB design. He started out at Altium as a senior applications engineer more than 14 years ago, traversing roles since as Field Applications Engineer, Tech Support Manager (USA), Product Marketing and Sr....
Beverley Christian, Ph.D.
HDP User Group
Beverley Jordan
Director, Community Tools & Content
Altium LLC
Benjamin holds a Bachelor of Engineering with First Class Honors from the University of Southern Queensland, Australia. He began learning about electronics at 8 years of age, and hand-etched his first printed circuit board with Dalo-pen and Bishop transfers at 11....
Bhanu Sood, PhD.
PCB Risk Assessment Engineer
NASA Goddard Space Flight Center
Dr. Bhanu Sood is a Commodity Risk Assessment Engineer at NASA Goddard Space Flight Center. Dr. Sood serves as the Goddard Center lead and NASA Specialist managing overall development efforts pertaining to risk and reliability of Microelectronics Packaging and Printed Circuit Boards used in NASA Goddard’s flight missions and ground support equipment....
Bihara Patel
SMT Connection Inc
Bihari Patel – Consultant, Speaker & Certified IPC Trainer for IPC 610G & JSTD 001G - Over 40 years’ experience in SMT Assembly and PCB Manufacture with MicroArt Services Inc.(Canada), LCL Electronics (UK), Invotec (UK), RIM (Canada), MacDermid (Global), Nortel Networks (Canada) and Leicester Circuits (England)....
Bill Babe
Principal Process Engineer
Liquid X Printed Metals
Bill Capen
Engineering Tech Specialist
Honeywell Aerospace
Bill Capen has 28 years in the electronics manufacturing industry. First as a equipment technician then worked his way to process engineer then senior process engineer. Currently Bill Capen is a Engineering Technical Specialist at Honeywell FM & T....
Bill Cardoso
Creative Electron, Inc.
Bill Vuono
Sr. Process Engineer
Qorvo US, Inc.
Bio Available Soon
Bob Neves
Chairman and Chief Technology Officer
Microtek Laboratories (China)
Bob Neves has spent the last 33 years as the chairman and CTO of Microtek Laboratories USA & China. He has served as the IPC’s TAEC chairman, Rigid Board & HDI General Committee chairman, Rigid Board Test Method Task Group chairman, IPC TGAsia Technical Liaison, Laboratory Qualifications Committee chairman and has been involved in more than 50 IPC committees in the US and Asia during his career....