Uyemura is the global leader in final finishes, including TWX-42 “RAIG,” a 5th generation mixed reaction process for non-porous, pure gold deposits. Displacement occurs on the nickel surface; autocatalytic reaction prevents nickel corrosion. TWX-42 deposits 6-8 µin gold...
(more)Uyemura is the global leader in final finishes, including TWX-42 “RAIG,” a 5th generation mixed reaction process for non-porous, pure gold deposits. Displacement occurs on the nickel surface; autocatalytic reaction prevents nickel corrosion. TWX-42 deposits 6-8 µin gold while increasing process speeds, reducing waste. Talon 3 Electroless Palladium plates directly onto electroless nickel, copper, zincated aluminum & electroless nickel plated circuitry. Gold and aluminum wire bondable when topcoated with immersion gold. Talon 3 is the foundation of EPIG and EPAG final finish layer deposits.
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