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IPC APEX EXPO 2023	Thu, Jan 26, 2023 - 8:00 AM to 10:00 AM S29: Special Session: Advanced Packaging Advanced Packaging Special Session: From Mils to Microns – Bridging Capabilities from HDI PCBs to IC-Substrates Instructor/Speaker: Ms. Jan Vardaman, President and Founder, TechSearch International, Inc Instructor/Speaker: Dr. Sam Salama, CEO, Hyperion Technologies Instructor/Speaker: Mr. Matt Kelly, CTO, Vice President Technology Solutions, IPC Instructor/Speaker: Mr. Matthew Neely, Director Process Engineering, North America, TTM Technologies Instructor/Speaker: Mr. James W. Fuller, Jr., Vice President, Engineering and Technology Development, Sanmina Focus: Advanced Packaging Event Type: Technical Conference Session Location: 2 The Foundational Requirements for High Impact Substrate Manufacturing- James W. Fuller, Jr. Sanmina IC Substrate Ecosystem and Future Needs - E. Jan Vardaman, TechSearch From Mils to Micron Bridging Capabilities from HDI-PCB to IC-Substrates- Sam Salama, Hyperion ADVANCED PACKAGING SPECIAL SESSION- Opening Remarks - Matt Kelly, IPC HDI PCB’s to IC Substrates - Matt Neely, TTM Technologies