Tue, Jan 24, 2023 - 9:45 AM to 10:00 AM
Ribbon Cutting Ceremony
Event Type: Special Event
Location: Lobby D(Near Registration)
Tue, Jan 24, 2023 - 10:00 AM to 11:30 AM
Roadmapping Future Application Drivers and Requirements for PCBs, with iNEMI
Instructor/Speaker: Ms. Tarja Rapala, Technology Director, EIPC
Instructor/Speaker: Dr. Francis Mullany, Director of Roadmapping, iNEMI
Location: 10
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
2-15F: Obsolete and Discontinued Product Task Group
Chair: Adam Wheeler, Principal Consultant, Anthesis Group
Chair: Curtis Grosskopf, Senior Engineer, IBM Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
2-30: Terms and Definitions Committee
Chair: Aaron Kennedy, Summit Interconnect - Anaheim
Chair: David Caputa, Electronics Engineer, Lockheed Martin Corporation
Chair: Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
General Committee: Terms and Definitions
Event Type: Standards Development Meeting
Location: 11B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Chair: Erik Bergum, VP Technology and Engineering, Founder PCB USA
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 8
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
5-33B: Solder Mask Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 14A
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
5-33C: Conformal Coating Handbook Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica International L.P.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 15AB
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
7-31BT: IPC-A-610 Training Committee
Chair: Helena Pasquito, Master IPC Trainer, EPTAC Corporation
Chair: Marie Parliman, Technical Instructor, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 14B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Chair: Herb Snogren, Consultant, Bristlecone LLC
Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 7A