Sat, Jan 21, 2023 - 8:00 AM to 5:00 PM
5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Milea Kammer, Engineering Manager
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Sun, Jan 22, 2023 - 8:00 AM to 5:00 PM
5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Milea Kammer, Engineering Manager
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Sun, Jan 22, 2023 - 8:00 AM to 5:00 PM
7-31A/D-33A: IPC-A-600 and IPC-6012 Joint Task Group Meeting
Chair: Gerry Partida, Dir. Of Technology, Summit Interconnect - Anaheim
Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff, Lockheed Martin Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 15AB
Sun, Jan 22, 2023 - 8:00 AM to 11:00 AM
PD01: Application of IPC Smart & Secure Digital Transformation Standards
Instructor/Speaker: Mr. Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Focus: Factory of the Future
Event Type: Professional Development
Location: 2
PD01: Application of IPC Smart & Secure Digital Transformation Standards
Sun, Jan 22, 2023 - 8:00 AM to 11:00 AM
PD02: Customer Contract and Legal Boot Camp for Engineering Professionals
Instructor/Speaker: Mr. Allen Anderson, Attorney, F&B Law Firm, P.C.
Instructor/Speaker: Mr. Patrick Sebesta II, Attorney, F&B Law Firm, P.C.
Focus: Business
Event Type: Professional Development
Location: 5A
PD02: Customer Contract and Legal Boot Camp for Engineering Professionals
PD02: Customer Contract and Legal Boot Camp for Engineering Professionals 2
Sun, Jan 22, 2023 - 8:00 AM to 11:00 AM
PD03: ESD Concept to Reduce Electrostatic Charges in Manufacturing Processes -- ESD Assessment
Instructor/Speaker: Mr. Hartmut Berndt, President, B.E.STAT European ESD competence centre
Focus: Quality, Reliability, Test and Inspecition
Event Type: Professional Development
Location: 5B
PD03: ESD Concept to Reduce Electrostatic Charges in Manufacturing Processes -- ESD Assessment
PD03: ESD Concept to Reduce Electrostatic Charges in Manufacturing Processes -- ESD Assessment 2
PD03: ESD Concept to Reduce Electrostatic Charges in Manufacturing Processes -- ESD Assessment 3
Sun, Jan 22, 2023 - 8:00 AM to 11:00 AM
PD04: Flexible and Rigid Flex Circuit Design for Manufacturing SMT Design, Fabrication and Assembly Process Principles
Instructor/Speaker: Mr. Vern Solberg, Principle Engineer, STC- Solberg Technical Consulting
Focus: Enabling Future Technologies
Event Type: Professional Development
Location: 6D
PD04: Flexible and Rigid Flex Circuit Design for Manufacturing SMT Design, Fabrication and Assembly
Sun, Jan 22, 2023 - 8:00 AM to 11:00 AM
PD05: Field Reliability of Printed Circuit Boards - A Physics of Failure Perspective
Instructor/Speaker: Dr. Bhanu Sood, Deputy Chief Technologist, NASA Goddard Space Flight Center
Focus: Meeting Extreme Requirements
Event Type: Professional Development
Location: 3
PD05: Field Reliability of Printed Circuit Boards - A Physics of Failure Perspective
Sun, Jan 22, 2023 - 8:00 AM to 11:00 AM
PD06: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of Board Talk - Part One
Instructor/Speaker: Mr. Jim Hall, Principal Consultant, ITM Consulting
Instructor/Speaker: Mr. Phil Zarrow, President, ITM Consulting
Focus: Assembly Processes
Event Type: Professional Development
Location: 4
PD06: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of B
Sun, Jan 22, 2023 - 8:00 AM to 11:00 AM
PD07: PCB Fabrication Basics: Process and Specification
Instructor/Speaker: Mr. Jim Vanden Hogen, Senior Staff Designer, Plexus Corporation
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 1AB
PD07: PCB Fabrication Basics: Process and Specification
Sun, Jan 22, 2023 - 8:00 AM to 11:00 AM
PD08: Gold-Aluminum Wire Bonding Process, Quality and Reliability
Instructor/Speaker: Dr. Syed Sajid Ahmad, Director, City of Jamestown ND
Focus: Design and Component Technologies
Event Type: Professional Development
Location: 6C
PD08: Gold-Aluminum Wire Bonding Process, Quality and Reliability
Sun, Jan 22, 2023 - 12:00 PM to 3:00 PM
PD09: Leveraging Industry 4.0 Toward Zero-Downtime, Zero-Defects Manufacturing - Part One
Instructor/Speaker: Dr. Mo Abuali, CEO, Managing Partner, IoTco, LLC
Focus: Factory of the Future
Event Type: Professional Development
Location: 2
PD09: Leveraging Industry 4.0 Toward Zero-Downtime, Zero-Defects Manufacturing - Part One
Sun, Jan 22, 2023 - 12:00 PM to 3:00 PM
PD10: Design and Assembly Challenges Including Backward Compatibility with BGAs
Instructor/Speaker: Mr. Ray Prasad, President, Ray Prasad Consultancy Group
Focus: Design and Component Technologies
Event Type: Professional Development
Location: 6C
PD10: Design and Assembly Challenges Including Backward Compatibility with BGAs
Sun, Jan 22, 2023 - 12:00 PM to 3:00 PM
PD11: Heterogeneous Integrations (System-in-Package)
Instructor/Speaker: Dr. John Lau, Unimicron Technology Corporation
Focus: Enabling Future Technologies
Event Type: Professional Development
Location: 3
PD11: Heterogeneous Integrations (System-in-Package)
Sun, Jan 22, 2023 - 12:00 PM to 3:00 PM
PD12: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of Board Talk - Part Two
Instructor/Speaker: Mr. Jim Hall, Principal Consultant, ITM Consulting
Instructor/Speaker: Mr. Phil Zarrow, President, ITM Consulting
Focus: Assembly Processes
Event Type: Professional Development
Location: 4
PD12: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of B
Sun, Jan 22, 2023 - 12:00 PM to 3:00 PM
PD13: PCB 102 Process Flow and Associated Defects - Part One
Instructor/Speaker: Mr. Paul Cooke, Field Application Engineering Manager, Ventec International Group
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 5B
PD13: PCB 102 Process Flow and Associated Defects - Part One
Sun, Jan 22, 2023 - 12:00 PM to 3:00 PM
PD14: PCB Antennas for Everyone
Instructor/Speaker: Mr. Ben Jordan, Engineer / Consultant, JordanDSP LLC
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 6D
PD14: PCB Antennas for Everyone
Sun, Jan 22, 2023 - 12:00 PM to 3:00 PM
PD15: Developing a J-STD-001 Objective Evidence Package Part One
Instructor/Speaker: Mr. Doug Pauls, Technical Fellow, Collins Aerospace
Instructor/Speaker: Dr. Mike Bixenman, Chief Technology Officer, Co- Founder, Magnalytix and KYZEN Corp.
Instructor/Speaker: Mr. Dan White, Pr. Electronics Material & Process Engineer | Advanced Operations Engineering, Collins Aerospace
Instructor/Speaker: Mr. Mark McMeen, V.P. Engineering, Magnalytix
Focus: Assembly Processes
Event Type: Professional Development
Location: 5A
PD15: Developing a J-STD-001 Objective Evidence Package intro
PD15: Developing a J-STD-001 Objective Evidence Package 1
PD15: Developing a J-STD-001 Objective Evidence Package 2
PD15: Developing a J-STD-001 Objective Evidence Package 3
PD15: Developing a J-STD-001 Objective Evidence Package - Bibliography
Sun, Jan 22, 2023 - 12:00 PM to 3:00 PM
PD16: Solder Joint Reliability -- Principle and Practice
Instructor/Speaker: Dr. Jennie Hwang, CEO, H-Technologies Group
Focus: Quality, Reliability, Test and Inspecition
Event Type: Professional Development
Location: 1AB
PD16: Solder Joint Reliability -- Principle and Practice
Sun, Jan 22, 2023 - 3:30 PM to 6:30 PM
PD17: Reflow Profiling Simplified
Instructor/Speaker: Mr. Robert Rowland, Director of Engineering, Axiom Electronics, LLC
Focus: Assembly Processes
Event Type: Professional Development
Location: 6D
PD17: Reflow Profiling Simplified
Sun, Jan 22, 2023 - 3:30 PM to 6:30 PM
PD18: PWB Design Engineering - Develop and Engineer a Stable, Producible Focused Board Design - Part One
Instructor/Speaker: Mr. Filbert Arzola, Sr. Principal Electrical Engineer, Raytheon Technologies
Focus: Design and Component Technologies
Event Type: Professional Development
Location: 3
PD18: PWB Design Engineering - Develop and Engineer a Stable, Producible Focused Board Design - Part
Sun, Jan 22, 2023 - 3:30 PM to 6:30 PM
PD19: PCB 102 Process Flow and Associated Defects - Part Two
Instructor/Speaker: Mr. Paul Cooke, Field Application Engineering Manager, Ventec International Group
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 5B
PD19: PCB 102 Process Flow and Associated Defects - Part Two
Sun, Jan 22, 2023 - 3:30 PM to 6:30 PM
PD20: Electronic Textile Evaluation Methods for Product Engineers and Designers
Instructor/Speaker: Ms. Madison Maxey Loomia Technologies, inc., CEO and Founder
Focus: Enabling Future Technologies
Event Type: Professional Development
Location: 1AB
PD20: Electronic Textile Evaluation Methods for Product Engineers and Designers
Sun, Jan 22, 2023 - 3:30 PM to 6:30 PM
PD21: Blockchain, NFT, Cryptocurrency and Metaverse
Instructor/Speaker: Dr. Nahid Majd, Associate Professor in Computer Science, California State University San Marcos
Focus: Factory of the Future
Event Type: Professional Development
Location: 6C
PD21: Blockchain, NFT, Cryptocurrency and Metaverse
Sun, Jan 22, 2023 - 3:30 PM to 6:30 PM
PD22: Developing a J-STD-001 Objective Evidence Package Part Two
Instructor/Speaker: Mr. Dan White, Pr. Electronics Material & Process Engineer | Advanced Operations Engineering, Collins Aerospace
Instructor/Speaker: Dr. Mike Bixenman, Chief Technology Officer, Co- Founder, Magnalytix and KYZEN Corp.
Instructor/Speaker: Mr. Doug Pauls, Technical Fellow, Collins Aerospace
Instructor/Speaker: Mr. Mark McMeen, V.P. Engineering, Magnalytix
Focus: Assembly Processes
Event Type: Professional Development
Location: 5A
PD22: Developing a J-STD-001 Objective Evidence Package 3
PD22: Developing a J-STD-001 Objective Evidence Package 4
PD22: Developing a J-STD-001 Objective Evidence Package 5
PD22: Developing a J-STD-001 Objective Evidence Package Wrap Up
PD22: Developing a J-STD-001 Objective Evidence Package- Bibliography
Sun, Jan 22, 2023 - 3:30 PM to 6:30 PM
PD24: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly) and More - Part One
Instructor/Speaker: Mr. Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Focus: Design and Component Technologies
Event Type: Professional Development
Location: 4
PD24: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA 2
PD24: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA 1
Sun, Jan 22, 2023 - 5:00 PM to 6:30 PM
TAEC and Chairman Reception(By Invitation)
Event Type: Standards Development Meeting
Location: West Terrace
Mon, Jan 23, 2023 - 7:00 AM to 5:00 PM
IPC EMS Leadership Summit: EMS Leaders of Today and Tomorrow Helping Each Other and the Industry to Prosper
Instructor/Speaker: Shawn DuBravac, Chief Economist, IPC
Instructor/Speaker: Coreen Blaylock, Project Management & Planning Operations, Lockheed MFC
Instructor/Speaker: John Vaughn, Vice President-Strategic Markets, Summit Interconnect
Instructor/Speaker: Eddie Smith, CEO, SMTC
Instructor/Speaker: Michael Slater, VP of Global Business Development, Digi-Key
Instructor/Speaker: Chintan Sutaria, CEO, CalcuQuote
Instructor/Speaker: Mr. Allen Anderson, Attorney, F&B Law Firm, P.C.
Instructor/Speaker: Brandy Tharp, Director of Education, IPC
Instructor/Speaker: Carlos Plaza, Senior Director of Education, IPC
Instructor/Speaker: Joel Bloom, Process Engineering Manager, Arc-Tronics
Instructor/Speaker: Dr. Kelly Scanlon, Lead Sustainability Strategist, IPC
Instructor/Speaker: Mark Wolfe, Executive EMS Advisor, IPC
Instructor/Speaker: Joaquin Hernandez, President, Empowered IT Solutions
Instructor/Speaker: Ed Zamborsky, Thermaltronics
Instructor/Speaker: Vijay Takanti, Senior Vice President of Innovation and Informatics, Exostar
Instructor/Speaker: Debie Vorwald, Pr. Quality Instructor, Collins Aerospace
Instructor/Speaker: Thomas Marktscheffel, Director of R&D, ASM Assembly Systems GmbH & Co. KG
Event Type: Management Meeting
Location: 6D
Continuous Improvement - Automation - PPT
Continuous Improvement - CFX - PPT
Cybersecurity CMMC VS Best Fit PPT
EMS Leaders of Today and Tomorrow PPT
IPC Advocacy Update PPT
North American EMS Landscape PPT
North American EMS Survey
Supply Chain Outlook PPT
Sustainability PPT
Workforce Training PPT
2023 Roster
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
2-19B: Trusted Supplier Task Group
Chair: Richard Snogren, President, Bristlecone LLC
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 10
Mon, Jan 23, 2023 - 8:00 AM to 12:00 PM
3-11A: Base Materials Committee
Chair: Albert Block, Chief Manufacturing Strategist, National Instruments
Chair: Darren Hitchcoc, OEM Business Development Manager, Panasonic Industrial Devices Sales Company of America
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 7B
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
5-21F: Ball Grid Array Task Group
Chair: Mr. Robert Rowland, Director of Engineering, Axiom Electronics, LLC
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 17A
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Task Group
Chair: Ernst Eggelaar, CEO, Microtronic
Chair: Gerard O'Brien, President, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 9
Mon, Jan 23, 2023 - 8:00 AM to 12:00 PM
5-32G: Residue Assessment Task Group
Chair: Emma Hudson, CTO, Emma Hudson Technical Consultancy Ltd
Chair: Eric Camden, Lead Investigator, Foresite, Inc.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 8
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
Chair: Benoit Dagenais, Electric Vehicle Lead Technician, Innovative Vehicle Institute
Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 16B
Mon, Jan 23, 2023 - 8:00 AM to 5:00 PM
7-31J: IPC-A-630 Task Group
Chair: Eddie Hofer, M&P Engineer, Collins Aerospace
Chair: Richard Rumas, Technical Manager - Materials Engineering, Honeywell Canada
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 11A
Mon, Jan 23, 2023 - 8:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 14B
Mon, Jan 23, 2023 - 8:00 AM to 5:00 PM
E-30, E-31, and E-31A Joint Meeting
Chair: Chuck LePard, DXC Technology
Chair: Walter Jager, Principal Consultant, ECD Compliance
Chair: Randall Flinders, Compliance Specialist, GreenSoft Technology Inc.
Chair: David Carnevale, Compliance Engineer, Dolby Laboratories
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 14A
Mon, Jan 23, 2023 - 8:00 AM to 5:00 PM
E-Textiles
Instructor/Speaker: Ms. Madison Maxey Loomia Technologies, inc., CEO and Founder
Instructor/Speaker: Dr. Jesse Jur, Director of Ecosystem Technology, AFFOA (Advanced Functional Fabrics of America)
Instructor/Speaker: Mr. Jim Owens, Founder and Principal, Nautilus Defense LLC
Instructor/Speaker: Dr. Braden M Li, Materials Research Engineer, Air Force Research Laboratory, Wright-Patterson AFB
Instructor/Speaker: Dr. Kelly Scanlon, Lead Sustainability Strategist, IPC
Instructor/Speaker: Dr. Michael Adventure Hopkins, Vice President of Research and Development, Liquid Wire
Instructor/Speaker: Dr. Renuka Dhandapani, Manager, Textile Chemistry Research, Cotton Incorporated
Instructor/Speaker: Mr. Vishwa Aluthge, Chief Product Officer, Softmatter by MAS Holdings (Pvt) Ltd
Instructor/Speaker: Ms. Melanie Hoerr, Head of Product Design & Innovation of Technical Embroidery Applications, Smart & E-Textiles, ZSK Technical Embroidery Systems
Instructor/Speaker: Ms. Lingyi Bi, Materials Science and Engineering PhD Student, Drexel University
Instructor/Speaker: Mr. Eisuke Tsuyuzaki, Founder, GM, Bayflex Solutions
Instructor/Speaker: Ms. Jessica Stanley, PhD candidate, Department of Engineering, Nottingham Trent University
Instructor/Speaker: Ms. Adria Kajenski, Research Assistant, University of Massachusetts Lowell
Instructor/Speaker: Mr. Pulkit Mishra, Project Manager, Textile Research Institute Thuringia-Vogtland
Instructor/Speaker: Mr. Nathanael (Nat) Higgins, Senior Advisor-Human Systems Portfolio, Defense Innovation Unit, US Department of Defense
Instructor/Speaker: Mr. Venk Varadan, CEO & Co-founder, Nanowear
Instructor/Speaker: Mr. Arnar Larusson, Co-Founder, Tyme Wear
Instructor/Speaker: Mr. Tyler Dunbar, Research and Development Manager, Butler Technologies, Inc. (BTI)
Event Type: Special Event
Location: 6F
Continual Improvements in Printed Heating Circuits for Clothing Garments - Renuka Dhandapani
Architecture Innovations to Optimize E-Textile Performance in Complex Systems- Jim Owens
Emerging Reliability & Performance Criteria for Wearable Devices - Eisuke Tsuyuzaki
Comparison Study of Localized Strain Sensor VS Motion Capture for Joint Angle Tracking-Mike Hopkins
Reliable Mass Production of E-Textiles by Using Embroidery Technology- Melanie Hoerr
Deep Dive into Use-Cases of E-Textiles for Automotive, Robotics & Beyond - Madison Maxey
Reliability and Standards of E-Textiles in the Real World- Vishwa Aluthge
Advanced Fabric Heating Technologies for Extreme Cold Weather Environments- Jesse Jur
Scalable Production of MXene Dip-Coated Yarns and Cords- Lingyi Bi
Re-Positionable Textile EMG Electrodes for Physiotherapy in Mobile Rehabilitation- Pulkit Mishra
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
Hermes Initiative
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
V-TSL-MVIA: Weak Interface Microvia Failures Technology Solutions Subcommittee
Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff, Lockheed Martin Corporation
Chair: Gerry Partida, Dir. Of Technology, Summit Interconnect - Anaheim
Chair: Mr. Jerry Magera, Distinguished Innovator, Chemical Engineer, Motorola Solutions
General Committee: Technology Solutions
Event Type: Standards Development Meeting
Location: 15AB
Mon, Jan 23, 2023 - 9:00 AM to 12:00 PM
PD25: PWB Design Engineering - Develop and Engineer a Stable, Producible Focused Board Design - Part Two
Instructor/Speaker: Mr. Filbert Arzola, Sr. Principal Electrical Engineer, Raytheon Technologies
Focus: Design and Component Technologies
Event Type: Professional Development
Location: 3
PD25: PWB Design Engineering - Develop and Engineer a Stable, Producible Focused Board Design - Part
Mon, Jan 23, 2023 - 9:00 AM to 12:00 PM
PD26: Managing Customer Expectations for Full Material Disclosure
Instructor/Speaker: Ms. Brenda Baney, Product Stewardship Expert, CEO, BCubed Consulting, Inc.
Focus: Business and Sustainability
Event Type: Professional Development
Location: 5A
PD26: Managing Customer Expectations for Full Material Disclosure
Mon, Jan 23, 2023 - 9:00 AM to 12:00 PM
PD27: Introduction to Machine Data Analytics in the EMS Industry
Instructor/Speaker: Dr. Tim Burke, Chief Technology Officer, Arch Systems
Focus: Factory of the Future
Event Type: Professional Development
Location: 5B
PD27: Introduction to Machine Data Analytics in the EMS Industry
Mon, Jan 23, 2023 - 9:00 AM to 12:00 PM
PD28: Press-fit Technology - Value Chain, Physics, Process and Standards
Instructor/Speaker: Mr. Frank Uibel, CEO, Uibel Consulting
Instructor/Speaker: Ms. Heike Woldt, Head of Product Development Press-fit technology - Technical Expert, Diehl Metal Application
Instructor/Speaker: Dr. Udo Welzel, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Dr. Philippe Jaeckle, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Mr. Hermann Eicher, Project Manager R & D, EPT
Instructor/Speaker: Dr. Erika Crandall, R&D, Product Development Engineer, TE Connectivity
Focus: Assembly Processes
Event Type: Professional Development
Location: 2
PD28: Press-fit Technology - Value Chain, Physics, Process and Standards
PD28: Press-fit Technology - Value Chain, Physics, Process and Standards 2
Mon, Jan 23, 2023 - 9:00 AM to 12:00 PM
PD29: Defect Analysis on Wave Soldering Process for PCB Assembly
Instructor/Speaker: Mr. Ah Feau Ng, Principal Consultant, TechMent
Event Type: Professional Development
Location: 4
PD29: Defect Analysis on Wave Soldering Process for PCB Assembly
Mon, Jan 23, 2023 - 9:00 AM to 12:00 PM
PD30: Troubleshooting SMT Yield Problems and Failure Analysis
Instructor/Speaker: Mr. Ray Prasad, President, Ray Prasad Consultancy Group
Focus: Quality, Reliability, Test and Inspecition
Event Type: Professional Development
Location: 1AB
PD30: Troubleshooting SMT Yield Problems and Failure Analysis 1
PD30: Troubleshooting SMT Yield Problems and Failure Analysis 2
Mon, Jan 23, 2023 - 10:00 AM to 5:00 PM
2-16: Digital Product Model Exchange (DPMX) Subcommittee
Chair: Terry Hoffman, Technical Leader, Cisco Systems Inc.
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 10
Mon, Jan 23, 2023 - 10:00 AM to 12:00 PM
2-17A: IPC-CFX Standard Task Group
Chair: Mr. Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Chair: Thomas Marktscheffel, Director of R&D, ASM Assembly Systems GmbH & Co. KG
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Mon, Jan 23, 2023 - 10:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum
Chair: Gaston Hidalgo, Quality Product Engineer, Toyota Motor North America
Chair: Jose Servin Olivares, SMT Expert, Vitesco Technologies
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 6E
Mon, Jan 23, 2023 - 10:15 AM to 12:00 PM
5-21G: Flip Chip Mounting Task Group
Instructor/Speaker: Ife Hsu, Technology & Standards Development Lead, Intel Corporation
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 16B
Mon, Jan 23, 2023 - 10:15 AM to 12:00 PM
5-23A: Printed Board Solderability
Chair: Ernst Eggelaar, CEO, Microtronic
Chair: Gerard O'Brien, President, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 9
Mon, Jan 23, 2023 - 10:15 AM to 12:00 PM
D-36: IPC-PCQR2 Database Subcommittee
Chair: Albert Block, Chief Manufacturing Strategist, National Instruments
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 15AB
Mon, Jan 23, 2023 - 12:00 PM to 1:30 PM
Luncheon Featuring a Keynote by: Shawn DuBravac, IPC Chief Economist
PRESENTATION: What's New in Tech: The Micro Trends Defining the Future of Electronics
Instructor/Speaker: Shawn DuBravac, Chief Economist, IPC
Event Type: Special Event
Location: 6A
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
1-10C: Test Coupon and Artwork Generation Task Group
Chair: Philip Henault, Development Engineer, Raytheon
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: 15AB
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
2-19A: Critical Components Traceability Task Group
Chair: Mr. Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Chair: Radu Diaconescu, Swissmic
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 12
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
3-12D: Woven Glass
Chair: Thomas Keily, General Manager, JPS Composite Materials Corp.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 7B
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
4-14F: ENEPIG Task Group
Chair: Jose Rios, Senior Principal Quality Engineer/Supplier Quality Manage, Raytheon
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 9
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
5-33A: Conformal Coating Task Group
Chair: Brian Chislea, AETS, Dow Corning
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 8
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
7-31FT: IPC/WHMA-A-620 Training Committee
Instructor/Speaker: Debbie Wade, Master IPC Trainer, dvanced Rework Technology
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 17A
Mon, Jan 23, 2023 - 1:30 PM to 5:00 PM
D-33AA: IPC-6012 Automotive Addendum
Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 7A
Mon, Jan 23, 2023 - 1:30 PM to 4:30 PM
PD31: PCB Design for High Reliability
Instructor/Speaker: Mr. Paul Cooke, Field Application Engineering Manager, Ventec International Group
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 3
PD31: PCB Design for High Reliability
Mon, Jan 23, 2023 - 1:30 PM to 4:30 PM
PD32: Develop a Robust Selective Soldering Process
Instructor/Speaker: Mr. Gerjan Diepstraten, Advanced Technology Manager, ITWEAE
Focus: Ase
Event Type: Professional Development
Location: 5B
PD32: Develop a Robust Selective Soldering Process
Mon, Jan 23, 2023 - 1:30 PM to 4:30 PM
PD33: Flip Chip, WLCSP, and FOW/PLP Assembly and Reliability
Instructor/Speaker: Dr. John Lau, Unimicron Technology Corporation
Focus: Design and Component Technologies
Event Type: Professional Development
Location: 5A
PD33: Flip Chip, WLCSP, and FOW/PLP Assembly and Reliability 1
D33: Flip Chip, WLCSP, and FOW/PLP Assembly and Reliability 2
Mon, Jan 23, 2023 - 1:30 PM to 4:30 PM
PD34: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly), DFF (Design for Printed Board Fabrication) and More - Part Two
Instructor/Speaker: Mr. Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Focus: Design and Component Technologies
Event Type: Professional Development
Location: 4
PD34: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability) 2
PD34: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability) 1
Mon, Jan 23, 2023 - 1:30 PM to 4:30 PM
PD35: Preventing Product Failure and Manufacturing Defects
Instructor/Speaker: Dr. Jennie Hwang, CEO, H-Technologies Group
Focus: Assembly Processes
Event Type: Professional Development
Location: 1AB
PD35: Preventing Product Failure and Manufacturing Defec
Mon, Jan 23, 2023 - 1:30 PM to 4:30 PM
PD36: Leveraging Industry 4.0 Toward Zero-Downtime, Zero-Defects Manufacturing Part Two
Instructor/Speaker: Dr. Mo Abuali, CEO, Managing Partner, IoTco, LLC
Focus: Factory of the Future
Event Type: Professional Development
Location: 2
PD36: Leveraging Industry 4.0 Toward Zero-Downtime, Zero-Defects Manufacturing Part Tw
Mon, Jan 23, 2023 - 3:00 PM to 5:00 PM
ITERC (BY INVITATION)
Event Type: Standards Development Meeting
Location: 17A
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
2-19C: Component-Level Authentication (CLA) Standard Task Group
Chair: Mr. Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 12
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable Task Group
Chair: David Sommervold, Senior Principal Engineer, TCLAD Incorporated
Chair: Terry Fischer, VP Sales and Marketing, Showa Denko Materials (America), Inc.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 7B
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
4-14B: ENIG Task Group
Chair: Ingrid Swenson, Inner layer engineering manager, TTM Technologies, Inc.
General Committee: Fabrication Processes
Event Type: Standards Development Meeting
Location: 9
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
5-21H: Bottom Termination Components (BTC) Task Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 16B
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
5-33F: Potting and Encapsulation Task Group
Chair: Brian Chislea, AETS, Dow Corning
Chair: Torrey Clark, Technical Service and Development Engineer, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 8
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 15AB
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
Faces of the Future
Event Type: Standards Development Meeting
Location: 14B
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
WORKFORCE TRAINING MEETING
Event Type: Standards Development Meeting
Location: 11B
Mon, Jan 23, 2023 - 5:00 PM to 6:00 PM
Committee Appreciation Reception (By Invitation Only)
Event Type: Special Event
Location: Mezzanine Terrace
Mon, Jan 23, 2023 - 5:00 PM to 6:00 PM
NewComers Networking Reception
Event Type: Special Event
Location: West Terrace
Tue, Jan 24, 2023 - 7:30 AM to 8:30 AM
Technical Conference Speaker Breakfast ( Invitation Only)
Event Type: Technical Conference Session
Location: 6D
Tue, Jan 24, 2023 - 8:00 AM to 9:30 AM
Roadmapping Smart Manufacturing for PCB Manufacturing and Board Assembly, with iNEMI
Instructor/Speaker: Dr. Francis Mullany, Director of Roadmapping, iNEMI
Instructor/Speaker: Ms. Tarja Rapala, Technology Director, EIPC
Instructor/Speaker: Mr. Ranjan Chatterjee, Vice President/General Manager Product and Software Development, Cimetrix
Location: 10
Tue, Jan 24, 2023 - 8:30 AM to 9:30 AM
Opening Keynote Speaker: Emily Calandrelli
Mechanical and Aerospace Engineer, Host and Co-producer of Emily’s Wonder Lab on Netflix and Executive Producer and Host of Xploration Outer Space on FOX
Instructor/Speaker: Emily Calandrelli, Mechanical and Aerospace Engineer, Host and Co-producer of Emily’s Wonder Lab on Netflix and Executive Producer and Host of Xploration Outer Space on FOX
Event Type: Special Event
Location: 6A
Tue, Jan 24, 2023 - 9:45 AM to 10:00 AM
Ribbon Cutting Ceremony
Event Type: Special Event
Location: Lobby D(Near Registration)
Tue, Jan 24, 2023 - 10:00 AM to 11:30 AM
Roadmapping Future Application Drivers and Requirements for PCBs, with iNEMI
Instructor/Speaker: Ms. Tarja Rapala, Technology Director, EIPC
Instructor/Speaker: Dr. Francis Mullany, Director of Roadmapping, iNEMI
Location: 10
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
2-15F: Obsolete and Discontinued Product Task Group
Chair: Adam Wheeler, Principal Consultant, Anthesis Group
Chair: Curtis Grosskopf, Senior Engineer, IBM Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
2-30: Terms and Definitions Committee
Chair: Aaron Kennedy, Summit Interconnect - Anaheim
Chair: David Caputa, Electronics Engineer, Lockheed Martin Corporation
Chair: Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
General Committee: Terms and Definitions
Event Type: Standards Development Meeting
Location: 11B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Chair: Erik Bergum, VP Technology and Engineering, Founder PCB USA
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 8
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
5-33B: Solder Mask Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 14A
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
5-33C: Conformal Coating Handbook Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica International L.P.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 15AB
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
7-31BT: IPC-A-610 Training Committee
Chair: Helena Pasquito, Master IPC Trainer, EPTAC Corporation
Chair: Marie Parliman, Technical Instructor, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 14B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Chair: Herb Snogren, Consultant, Bristlecone LLC
Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 7A
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
D-72A: Conductive Yarns for E-Textiles Task Group
Chair: Joe Geiger, Textile Engineer, Bally Ribbon Mills
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 9
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
E-31B-AT-SPR, E-31K-SPR-AT, E-31J-SPR Review A-Teams Joint Meeting
Instructor/Speaker: Jason Gooden, Executive Director, Anthesis
Instructor/Speaker: Chuck LePard, DXC Technology
Instructor/Speaker: Valerie Kuntz, Subject Matter Expert, Materials Management, Assent Compliance Inc.
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 16B
Tue, Jan 24, 2023 - 10:00 AM to 6:00 PM
Professional Headshots
Event Type: Special Event
Location: Booth 2019
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
V-TSL Technology Solutions Committee
General Committee: Technology Solutions
Event Type: Standards Development Meeting
Location: 11A
Tue, Jan 24, 2023 - 10:30 AM to 12:00 PM
S01: Assembly Process
Instructor/Speaker: Dr. Harry Chou, Engineer, PulseForge
Instructor/Speaker: Dr. Sam McMaster, Materials Scientist, Pillarhouse International
Instructor/Speaker: Mr. Gerjan Diepstraten, Advanced Technology Manager, ITWEAE
Focus: Assembly Process
Event Type: Technical Conference Session
Location: 3
S01 GERJAN DIEPSTRATEN 2023 APEX EXPO
S01 HARRY CHOU 2023 APEX EXPO
S01 SAMUEL MCMASTER 2023 APEX EXPO
Tue, Jan 24, 2023 - 10:30 AM to 12:00 PM
S02: EX 1- High Reliability for Extreme Environments 1
Instructor/Speaker: Dr. Yuan Zhao, Principal Engineer, Henkel Corporation
Instructor/Speaker: Dr. Walter Olbrich, Director Field Application Engineering, TTM Technologies
Instructor/Speaker: Ms. Bethany Turner, Technical Manager, ELECTROLUBE a division of MacDermid Alpha Electronics Solutions
Focus: High Reliability for Extreme Environments
Event Type: Technical Conference Session
Location: 4
S02 BETHANY TURNER 2023 APEX EXPO
S02 YUAN ZHAO 2023 APEX EXPO
S02 WALTER OLBRICH APEX EXPO 2023
Tue, Jan 24, 2023 - 10:30 AM to 12:00 PM
S03: BF-MAT-1 Printed Board Platings and Finishes 1
Instructor/Speaker: Mr. Mustafa Ozkök, Global Product Manager Panel and Pattern Plating, MKS Atotech GmbH
Instructor/Speaker: Dr. Frank Xu, Technology Manager, MacDermid Alpha Electronics Solutions
Instructor/Speaker: Dr. Kunal Shah, President, LiloTree
Focus: Printed Board Platings and Finishes
Event Type: Technical Conference Session
Location: 5A
S03 FRANK XU APEX EXPO
S03 KUNAL SHAH 2023 APEX EXPO
S03 MUSTAFA OZKOK 2023 APEX EXPO
Tue, Jan 24, 2023 - 10:30 AM to 12:00 PM
S04: QRTI- Packaging Assembly Reliability
Instructor/Speaker: Mr. Mattis Obst, Scientist, Fraunhofer IZM
Instructor/Speaker: Ms. Rachel Schwartz, Materials Engineer, Insituware LLC
Instructor/Speaker: Mr. Lars Bruno, Sr Engineer, PBA Manufacturing & Reliability, Ericsson AB
Focus: Packaging Assembly Reliability
Event Type: Technical Conference Session
Location: 5B
S04 LARS BRUNO 2023 APEX EXPO
S04 MATTIS OBST 2023 APEX EXPO
Tue, Jan 24, 2023 - 12:00 PM to 1:30 PM
Luncheon | IPC Annual Meeting and Awards
Event Type: Special Event
Location: 6A
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
3-13: Halogen-Free Subcommittee
Chair: Naji Norder, Hardware Senior Group Manager PCB Design & Services, National Instruments
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 8
Tue, Jan 24, 2023 - 1:30 PM to 5:00 PM
5-22F: IPC-HDBK-001 Task Group
Chair: John Mastorides, Principle Product Design Engineer, Honeywell Aerospace
Chair: Scott Meyer
Event Type: Standards Development Meeting
Location: 6E
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
5-32E: CAF Task Group
Chair: Mr. Karl Sauter, Senior Principal Engineer, PCB Technology, Oracle Corporation
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 15AB
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
6-10D: SMT Attachment Reliability Task Group
Chair: Reza Ghaffarian, Principal Engineer, Jet Propulsion Laboratory
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 14A
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
7-24: Printed Board Fabrication and Assembly Process Effects Subcommittee
Chair: Michael Carano, VP Technology and Bus. Dev, IPC
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 11A
Tue, Jan 24, 2023 - 1:30 PM to 5:00 PM
7-34: IPC-7711/21 Rework, Repair and Modification
Chair: Frank Honyotsk, Instructor, STI Electronics, Inc.
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 7B
Tue, Jan 24, 2023 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Chair: Michael Creeden, Technical Director Design Education, Insulectro
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 11B
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Instructor/Speaker: Rajesh Kumar
General Committee: Embedded Devices
Event Type: Standards Development Meeting
Location: 16B
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
D-72B: Woven, Knitted and Braided E-Textiles Standard Task Group
Chair: Sahar Rostami, Fiber and Textile Engineer, Myant, Inc.
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 10
Tue, Jan 24, 2023 - 1:30 PM to 5:00 PM
E-31K: Materials and Substances Declaration for the Aerospace, Defense, HE and Other Industries
Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Chair: Walter Jager, Principal Consultant, ECD Compliance
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
EMS Steering Committee
Event Type: Standards Development Meeting
Location: 17A
Tue, Jan 24, 2023 - 1:30 PM to 6:00 PM
IPC Design Competition 2023 Finals
Event Type: Special Event
Location: 6F
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
S05: A-REW Assembly Rework and Repair
Instructor/Speaker: Mr. Aaron Caplan, Sr Consultant, PACE Worldwide
Instructor/Speaker: Ms. Mei Ming Khaw, Engineering Program Manager, Keysight Technologies
Instructor/Speaker: Mr. Irving Rodriguez, Product Specialist Dispensing, Essemtec Nano-Dimension
Focus: Assembly Rework and Repair
Event Type: Technical Conference Session
Location: 3
S05 AARON CAPLAN 2023 APEX EXPO
S05 IRVING RODRIGUEZ 2023 APEX EXPO
S05 MEI MING KHAW 2023 APEX EXPO
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
S06: EX 2- High Reliability for Extreme Environments 2
Instructor/Speaker: Mr. Andreas Karch, Regional Technical Manager and Technologist--Advanced Applications, Indium Corporation
Instructor/Speaker: Mr. Manu Vaidya, Global Product Manager, Heraeus Deutschland GmbH
Instructor/Speaker: Ms. Kennedy Fox, Reliability Failure Analysis Scientist, MacDermid Alpha Electronics Solutions
Focus: High Reliability for Extreme Environments
Event Type: Technical Conference Session
Location: 4
S06 ANDREAS KARCH 2023 APEX EXPO
S06 KENNEDY FOX 2023 APEX EXPO
S06 MANU VAIDYA 2023 APEX EXPO
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
S07: Factory of the Future - Additive Manufacturing
Instructor/Speaker: Dr. Stanton Rak, President, SF Rak Company
Instructor/Speaker: Mr. Bryce Gray, EET, Sciperio
Focus: Additive Manufacturing
Event Type: Technical Conference Session
Location: 5A
S07 BRYCE GRAY 2023 APEX EXPO
S07 STANTON RAK 2023 APEX EXPO
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
S08: BF-MAT-2 Printed Board Platings and Finishes 2
Instructor/Speaker: Dr. Britta Schafsteller, Global Product Manager Selective Finishing, Atotech Group
Instructor/Speaker: Mr. Derek Lovejoy, Student/Chemical Engineer, University of Massachusetts/GreenSource Fabrication
Instructor/Speaker: Mr. Robert Weber, Technology Director, Fischer Technology
Focus: Printed Board Platings and Finishes
Event Type: Technical Conference Session
Location: 5B
S08 BRITTA SCHAFSTELLER 2023 APEX EXPO
S08 DEREK LOVEJOY 2023 APEX EXPO
S08 ROBERT WEBER 2023 APEX EXPO
Tue, Jan 24, 2023 - 3:00 PM to 5:00 PM
NASA PCB: Aerospace User/Supplier Open Meeting (Invitation Only)
Location: 14B
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
Chair: Radu Diaconescu, Swissmic
Chair: Victor Xu, Principal Engineer, Intel Corporation
Chair: Zhiqian Sang, Hangzhou Dianzi University
Chair: Shuming Gao, Professor, Zhejiang University
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 11A
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Chair: Milea Kammer, Engineering Manager
Chair: Srinivas Chada, Amazon Project Kuiper
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 8
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
5-33C: Conformal Coating Handbook Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica International L.P.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 15AB
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
D-33AM: IPC-6012 Medical Device Addendum Task Group
Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 9
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
D-55A: Embedded Circuitry Guideline Task Group
Instructor/Speaker: Dr. Bhanu Sood, Deputy Chief Technologist, NASA Goddard Space Flight Center
General Committee: Embedded Devices
Event Type: Standards Development Meeting
Location: 16B
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
D-70X: Embroidered E-Textiles
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 10
Tue, Jan 24, 2023 - 3:30 PM to 5:00 PM
S09: A-LASER Assembly Laser Processing
Instructor/Speaker: Mr. Patrick Stockbruegger, Product Manager, LPKF Laser & Electronics AG
Instructor/Speaker: Mr. Javier Gonzalez, Senior Sales Manager, InnoLas Solutions GmbH
Focus: Laser Processing
Event Type: Technical Conference Session
Location: 3
S09 PATRICK STOCKBRUEGGER 2023 APEX EXPO
S09 JAVIER GONZALEZ 2023 APEX EXPO
Tue, Jan 24, 2023 - 3:30 PM to 5:00 PM
S10: ET - Technologies for Miniaturization
Instructor/Speaker: Mr. Ravi Parthasarathy, Sr. Application Engineer, ZESTRON Corporation
Instructor/Speaker: Mr. Tomohiro Fukao, Research Manager, Panasonic Corporation of North America
Focus: Technologies for Miniaturization
Event Type: Technical Conference Session
Location: 4
S10 RAVI PARTHASARATHY 2023 APEX EXPO
S10 TOMOHIRO FUKAO 2023 APEX EXPO
Tue, Jan 24, 2023 - 3:30 PM to 5:00 PM
S11: HDI1 - Microvia Analysis and Modeling
Instructor/Speaker: Dr. Michael Lovellette, Physicist, The Aerospace Corporation
Instructor/Speaker: Dr. Martin Leung, Senior Project Leader, The Aerospace Corporation
Focus: Microvia Analysis and Modeling
Event Type: Technical Conference Session
Location: 5A
S11 MICHAEL LOVELLETTE 2023 APEX EXPO
S11 MARTIN LEUNG-SCOTT SITZMAN 2023 APEX EXPO
Tue, Jan 24, 2023 - 3:30 PM to 5:00 PM
S12: BF-MAT-3 Printed Board Material Innovations
Instructor/Speaker: Mr. Christopher Seidemann, Global Product Manager, Atotech Group
Instructor/Speaker: Mr. Yusuke Watase, Staff Engineer, RESONAC
Focus: Printed Board Material Innovations
Event Type: Technical Conference Session
Location: 5B
S12 CHRISTOPHER SEIDEMANN 2023 APEX EXPO
S12 YUSUKE WATASE 2023 APEX EXPO
Tue, Jan 24, 2023 - 5:00 PM to 6:00 PM
Network with Poster Presenters during the Show Floor Welcome Reception
Event Type: Special Event
Location: Exhibit Show Floor
Tue, Jan 24, 2023 - 5:00 PM to 6:00 PM
Show Floor Welcome Reception
Event Type: Special Event
Location: Exhibit Show Floor
Tue, Jan 24, 2023 - 6:00 PM to 7:30 PM
Women in Electronics Reception 
Emily Calandrelli | Mechanical and Aerospace Engineer, Host and Co-Producer of Emily’s Wonder Lab on Netflix, and Executive Producer and Host of Xploration Outer Space on FOX
Instructor/Speaker: Emily Calandrelli, Mechanical and Aerospace Engineer, Host and Co-producer of Emily’s Wonder Lab on Netflix and Executive Producer and Host of Xploration Outer Space on FOX
Event Type: Special Event
Location: 6D
Wed, Jan 25, 2023 - 7:30 AM to 8:30 AM
Hall of Fame Breakfast(By Invitation)
Event Type: Special Event
Location: 9
Wed, Jan 25, 2023 - 7:30 AM to 8:30 AM
Technical Conference Speaker Breakfast ( Invitation Only)-2
Event Type: Technical Conference Session
Location: 6D
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM

S15: EM1 - Electronic Materials Thermal Interface Materials - TIMS

Instructor/Speaker: Mr. John Prindl, Regional Application Engineering Manager, Industrials, Henkel Corporation
Instructor/Speaker: Mr. Milos Lazic, Product Development Specialist, Indium Corporation
Focus: Electronic Materials TIMS
Event Type: Technical Conference Session
Location: 5A
S15 JOHN PRINDL 2023 APEX EXPO
S15 MILOS LAZIC 2023 APEX EXPO
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
2-16D: IPC-2581 Users Task Group
Chair: Kevin Kusiak, LM Associate Fellow, Lockheed Martin Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 8
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 14B
Wed, Jan 25, 2023 - 8:00 AM to 12:00 PM
5-21N: Cold Joining/Press-fit Handbook Task Group
Chair: Dr. Udo Welzel, Senior Expert, Robert Bosch GmbH
Chair: Dr. Erika Crandall, R&D, Product Development Engineer, TE Connectivity
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 16B
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-22AS: Space and Military Electronic Assemblies Task Group
Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 6E
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-22BT: J-STD-001 Training Committee
Chair: George Tristan, Process Control Engineer, Ball Aerospace & Technologies Corp.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 11A
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-24B: Solder Paste Task Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 10
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-24G: Polymerics Standard Task Group
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 11B
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
D-15: Flex Test Methods Methods Subcommittee
Chair: Russell Sheperd
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 14A
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
D-22: RF/Microwave Printed Board Performance Subcommittee
Chair: Lance Auer, Engineering Fellow, Conductor Analysis Technologies, Inc.
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 7A
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
D-75C E-Textiles Printed Electronics Reliability Standard Task Group
Instructor/Speaker: Pratyush Rai, Founding Engineer, Nanowear Inc.
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 18
Wed, Jan 25, 2023 - 8:00 AM to 5:00 PM
E-31B: Materials Declaration Task Group
Chair: Jason Gooden, Executive Director, Anthesis
Chair: JB Hollister, Environmental Engineer, Apple Inc.
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 7B
Wed, Jan 25, 2023 - 8:00 AM to 9:00 AM
IPC APEX EXPO Tradeshow Committee Meeting (by invitation)
 
Location: Show Manager Office D
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
S13: QRTI- Printed Board Reliability
Instructor/Speaker: Mr. Eric Campbell, Advisory Hardware Development Engineer, IBM Corporation
Instructor/Speaker: Mr. Roger Massey, Technical Marketing Manager, Atotech Group
Instructor/Speaker: Mr. Karl Sauter, Senior Principal Engineer, PCB Technology, Oracle Corporation
Focus: Printed Board Reliability
Event Type: Technical Conference Session
Location: 3
S13 KARL SAUTER 2023 APEX EXPO
S13 ERIC CAMPBELL 2023 APEX EXPO
S13 ROGER MASSEY 2023 APEX EXPO
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
S14: HDI2 - Microvia Formation
Instructor/Speaker: Mr. Konstantine (Gus) Karavakis, Director Advanced Process Development, Averatek
Instructor/Speaker: Dr. Jerker Delsing, Professor and Head of Subject, Chaired Professor, Embedded Intelligent Systems LAB, Lulea University of Technology
Instructor/Speaker: Dr. Gouri Radhakrishnan, Senior Scientist, The Aerospace Corporation
Focus: Microvia Formation
Event Type: Technical Conference Session
Location: 4
S14 JERKER DELSING 2023 APEX EXPO
S14 GOURI RADHAKRISHNAN 2023 APEX EXPO
S14 KONSTANTINE GUS KARAVAKIS 2023 APEX EXPO
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
S16: Factory of the Future - Automated Inspection
Instructor/Speaker: Dr. Norman Armendariz, Engineering Fellow, Raytheon Technologies
Instructor/Speaker: Dr. Eyal Weiss, CTO, Cybord ltd.
Instructor/Speaker: Mr. Feng Xue, Senior Technical Staff Member, IBM Corporation
Instructor/Speaker: Mr. Louis Ungar, President, A.T.E. Solutions, Inc.
Focus: Factory of the Future - Automated Inspection
Event Type: Technical Conference Session
Location: 5B
S16 EYAL WEISS 2023 APEX EXPO
S16 FENG XUE 2023 APEX EXPO
S16 LOUIS UNGAR 2023 APEX EXPO
S16 NORMAN ARMENDARIZ 2023 APEX EXPO
Wed, Jan 25, 2023 - 8:30 AM to 2:30 PM
STEM Outreach
Event Type: Special Event
Location: 6CF
Wed, Jan 25, 2023 - 9:00 AM to 5:00 PM
Professional Headshots
Event Type: Special Event
Location: Booth 2019
Wed, Jan 25, 2023 - 10:00 AM to 12:00 PM
1-14: DFX Standards Subcommittee
Chair: Pietro Vergine, President, Advanced Rework Technology
Chair: Stephen Golemme, Manufacturing Engineer, ITX Inc.
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: 8
Wed, Jan 25, 2023 - 10:00 AM to 12:00 PM
5-24A: Flux Specification Task Group
Chair: Anthony Lentz, Chemist / Field Application, FCT Assembly, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 10
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
3-11J: Metal Based Laminates for Printed Boards
Chair: Minsu Lee, Manager, Korea Packaging Integration Association
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 9
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
7-12: Microsection Subcommittee
General Committee: Testing
Event Type: Standards Development Meeting
Location: 14B
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
7-31AT/D-33AT:IPC-A-600 and IPC-6012 Training Joint Meeting
Chair: Jamie Noland, Marketing Manager/MIT, Blackfox Training Institute
Chair: Leo Lambert, Vice President, EPTAC Corporation
Chair: Jeffrey Duch, Industry Trainer, TandemWorks Customized Training Solutions L.L.C.
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 11A
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
7-31K and 7-31H IPC-D-620 and IPC-HDBK-620 Joint Meeting
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 11B
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
D-12: Flexible Printed Circuits Performance Subcommittee
Chair: Nick Koop, Director of Flex Technology, TTM Technologies
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 14A
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
D-75A: E-Textiles Wearables Standard Task Group
Instructor/Speaker: Vladan Koncar, ENSAIT GEMTEX Lab
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 18
Wed, Jan 25, 2023 - 10:30 AM to 12:00 PM
S17: QRTI- Component Assembly Reliability 1
Instructor/Speaker: Dr. Reza Ghaffarian, Principal Engineer, JPL-Jet Propulsion Laboratory
Instructor/Speaker: Mr. Neil Hubble, President, Akrometrix
Focus: Component Assembly Reliability
Event Type: Technical Conference Session
Location: 3
S17 NEIL HUBBLE 2023 APEX EXPO
S17 REZA GHAFFARIAN 2023 APEX EXPO
Wed, Jan 25, 2023 - 10:30 AM to 12:00 PM
S18: HDI3 - Microvia Substrates
Instructor/Speaker: Dr. Thomas McCarthy, Product Development Manager, AGC
Instructor/Speaker: Mr. Joachim Verhegge, Product Engineering Manager, ACB NV (Advanced Circuit Boards)
Instructor/Speaker: Mr. Jerry Magera, Distinguished Innovator, Chemical Engineer, Motorola Solutions
Focus: Microvia Substrates
Event Type: Technical Conference Session
Location: 4
S18 JERRY MAGERA 2023 APEX EXPO
S18 JOACHIM VERHEGGE 2023 APEX EXPO
S18 THOMAS MCCARTHY 2023 APEX EXPO
Wed, Jan 25, 2023 - 10:30 AM to 12:00 PM
S19: EM2-LTS Electronic Materials Low Temperature Solder
Instructor/Speaker: Ms. Claire Hotvedt, Senior Product Development Specialist, Indium Corporation
Instructor/Speaker: Dr. Hongwen Zhang, R&D Manager, Indium Corporation
Focus: Electronic Materials Low Temperature Solder
Event Type: Technical Conference Session
Location: 5A
S19 CLAIRE HOTVEDT 2023 APEX EXPO
S19 HONGWEN ZHANG 2023 APEX EXPO
Wed, Jan 25, 2023 - 10:30 AM to 12:00 PM
S20: FF3 - Artificial Intelligence for Manufacturing
Instructor/Speaker: Mr. Reinhardt Seidel, Research Assistant, FAU Erlangen-Nürnberg,, Institute for Factory Automation and Production Systems (FAPS)
Instructor/Speaker: Ms. Susan Kayesar, Technical Product Manager, Siemens Digital Industries SW
Focus: Artificial Intelligence for Manufacturing
Event Type: Technical Conference Session
Location: 5B
S20 REINHARDT SEIDEL 2023 APEX EXPO
S20 SUSAN KAYESAR 2023 APEX EXPO
Wed, Jan 25, 2023 - 12:00 PM to 1:30 PM
Luncheon Featuring a Keynote by Dr. John W. Mitchell, IPC President and CEO
Presentation: Fire Your Hiring Habits: Finding and Keeping the Best Talent is Fundamental to Building Electronics Better
Instructor/Speaker: John Mitchell, IPC President and CEO, IPC
Event Type: Special Event
Location: 6A
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
2-12C: Cybersecurity Protection Standard Task Group
Chair: Mr. Hiroyuki Watanabe, Executive Director Global Security, NEC Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Wed, Jan 25, 2023 - 1:30 PM to 5:00 PM
5-21M: Cold Joining/Press-fit Task Group
Chair: Dr. Udo Welzel, Senior Expert, Robert Bosch GmbH
Chair: Dr. Erika Crandall, R&D, Product Development Engineer, TE Connectivity
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 16B
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
5-22H: Thermal Profiling Guide Task Group
Chair: Mr. Robert Rowland, Director of Engineering, Axiom Electronics, LLC
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 10
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
5-24F: Underfill Materials Task Group
Chair: Brian Toleno, Principal Material Scientist, Facebook
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 15AB
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
5-31J: Cleaning Compatibility
Chair: William Capen, Senior Engineering Tech Specialist, Honeywell FM&T
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 14B
Wed, Jan 25, 2023 - 1:30 PM to 5:00 PM
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
7-34T: IPC-7711 7721 Training Committee
Chair: Frank Honyotski
Chair: Nichole Thilges, Sr. Training and Development Spc, Raytheon Missile Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 11A
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Chair: Mark Finstad, Senior Appication Engineer, Flexible Circuit Technologies, Inc.
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 14A
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
D-23: High Speed High Frequency Base Materials Subcommittee
Instructor/Speaker: Tony Senese, Group Mgr. - Bus. Development, Panasonic Industrial Devices Sales Company of America
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 17A
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
D-75B: E-Textiles Wearables Guideline Task Group
Instructor/Speaker: Paula Veske, Universiteit Gent
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 18
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
ESDS Control Plan
Event Type: Standards Development Meeting
Location: 11B
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
S21: QRTI- Component Assembly Reliability 2
Instructor/Speaker: Dr. Alejandra Constante-Perez, Materials Engineer, Axient Corp
Instructor/Speaker: Mr. Louis Diamond, Product Engineer and Project Lead, Department of Energy’s Kansas City National Security Campus
Instructor/Speaker: Dr. Mike Bixenman, Chief Technology Officer, Co- Founder, Magnalytix and KYZEN Corp.
Instructor/Speaker: Mr. Christopher Fitzgerald, Quality Assurance Engineer, Millennium Engineering & Integration Company
Focus: Component Assembly Reliability
Event Type: Technical Conference Session
Location: 3
S21 ALEJANDRA CONSTANTE 2023 APEX EXPO
S21 MIKE BIXENMAN 2023 APEX EXPO
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
S22: HDI4 - Microvia Plating
Instructor/Speaker: Mr. Hidekazu Homma, Chief Research, OKUNO OKUNO Chemical Industries Co., Ltd.
Focus: Microvia Plating
Event Type: Technical Conference Session
Location: 4
S22 HIDEKAZU HOMMA 2023 APEX EXPO
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
S23 EM3-C&C Electronic Materials Cleaning and Coating 1
Instructor/Speaker: Dr. Heiko Elsinger, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Dr. Aysegul Nebioglu, Senior Manager, R&D, Global, Dymax
Focus: Electronic Materials Cleaning and Coating
Event Type: Technical Conference Session
Location: 5A
S23 AYSEGUL NEBIOGLU 2023 APEX EXPO
S23 HEIKO ELSINGER 2023 APEX EXPO
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
S24: Factory of the Future - Process
Instructor/Speaker: Mr. Danny Yeoh, Business Development Manager, camLine
Instructor/Speaker: Mr. Fernando Guedes, Global SMT MTT Manager, Aptiv
Instructor/Speaker: Mr. Edward Nauss, Sr. Sales and Applications Engineer, ITW/EAE
Focus: Factory of the Future - Process
Event Type: Technical Conference Session
Location: 5B
S24 DANNY YEOH 2023 APEX EXPO
S24 EDWARD NAUSS 2023 APEX EXPO
S24 FERNANDO GUEDES 2023 APEX EXPO
Wed, Jan 25, 2023 - 2:30 PM to 3:30 PM
Ice Cream Social on the Show Floor
Event Type: Special Event
Location: Exhibit Show Floor
Wed, Jan 25, 2023 - 2:30 PM to 3:30 PM
Networking with Poster Presenters during the Ice Cream Social
Event Type: Special Event
Location: Aisle 100
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Chair: Michelle Gleason, Staff DFX Engineer, Plexus Corp.
General Committee: Electronic Packaging Design
Event Type: Standards Development Meeting
Location: 15AB
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
2-12A: Generic Requirements for Digital Twin Task Group
Chair: Mr. Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Chair: Radu Diaconescu, Swissmic
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
4-14E: OSP Task Group
Instructor/Speaker: Michael Carano, VP Technology and Bus. Dev, IPC
General Committee: Fabrication Processes
Event Type: Standards Development Meeting
Location: 17A
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
5-45A: Reflow Oven Process Control Task Group
Chair: Linda Woody, LWC Consulting
General Committee: Assembly Equipment
Event Type: Standards Development Meeting
Location: 11B
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
7-31D: Optical Inspection Aides Task Group
Instructor/Speaker: Joshua Hudson, Lockheed Martin Missiles & Fire Control
Instructor/Speaker: Leo Lambert, Vice President, EPTAC Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 18
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
B-10A: Plastic Chip Carrier Cracking Task Group
Chair: Christina Landon, Engineer, Naval Surface Warfare Ctr
Chair: Steve Martell
General Committee: Packaged Electronic Components
Event Type: Standards Development Meeting
Location: 14B
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
B-11A: Electronic Packages Guideline Task Group
Chair: Dudi Amir, Technologist, Intel Corporation
General Committee: Packaged Electronic Components
Event Type: Standards Development Meeting
Location: 10
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
D-13: Flex Circuits Base Materials
Chair: Richard Wessel, Technical Supervisor, DuPont Electronics & Imaging
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 14A
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
D-21: RF/Microwave Printed Board Design Subcommittee
Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff, Lockheed Martin Corporation
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 8
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
D-60: Printed Electronics Committee
Chair: Neil Bolding, Manager, Technical Services & Quality, MacDermid Alpha Electronics Solutions
General Committee: Printed Electronics
Event Type: Standards Development Meeting
Location: 12
Wed, Jan 25, 2023 - 3:30 PM to 5:00 PM
S25: QRTI-Assembly Risk Prediction and Failure Analysis
Instructor/Speaker: Mr. Eric Campbell, Advisory Hardware Development Engineer, IBM Corporation
Instructor/Speaker: Mr. Marius Tarnovetchi, Senior Expert, Vitesco Technologies
Instructor/Speaker: Dr. Lothar Henneken, Senior Expert, Robert Bosch
Focus: Assembly Risk Prediction and Failure Analysis
Event Type: Technical Conference Session
Location: 3
S25 ERIC CAMPBELL 2023 APEX EXPO
S25 LOTHAR HENNEKEN 2023 APEX EXPO
S25 MARIUS TARNOVETCHI 2023 APEX EXPO
Wed, Jan 25, 2023 - 3:30 PM to 5:00 PM
S26: HDI 5- QRTI- Printed Board Reliability 
Instructor/Speaker: Dr. Maarten Cauwe, R&D Team Leader, imec-Cmst
Instructor/Speaker: Mr. Steve Schow, AGC
Focus: Stacked, Staggered and Buried Microvias
Event Type: Technical Conference Session
Location: 4
S26 THOMAS MCCARTHY 2023 APEX EXPO
S26 MAARTEN CAUWE 2023 APEX EXPO
Wed, Jan 25, 2023 - 3:30 PM to 5:00 PM
S27: EM4-C&C2 Electronic Materials Cleaning and Coating 2
Instructor/Speaker: Mr. Phil Kinner, Head of R&D, ELECTROLUBE a division of MacDermid Alpha Electronics Solutions
Instructor/Speaker: Ms. Laura Lecomte, R&D Manager, Inventec
Focus: Electronic Materials Cleaning and Coating
Event Type: Technical Conference Session
Location: 5A
S27 LAURA LECOMTE 2023 APEX EXPO
S27 PHIL KINNER 2023 APEX EXPO
Wed, Jan 25, 2023 - 3:30 PM to 5:00 PM
S28: Factory of the Future - Smart Factory
Instructor/Speaker: Mr. Hiroyuki Watanabe, Executive Director Global Security, NEC Corporation
Instructor/Speaker: Dr. Aroon Tungare, CEO, NODABL Networks, Inc.
Focus: Factory of the Future - Smart Factory
Event Type: Technical Conference Session
Location: 5B
S28 AROON TUNGARE 2023 APEX EXPO
S28 HIROYUKI WATANABE 2023 APEX EXPO
Wed, Jan 25, 2023 - 6:00 PM to 7:30 PM
Career Connections Networking Event
Event Type: Special Event
Location: 6D
Thu, Jan 26, 2023 - 7:30 AM to 8:30 AM
Technical Conference Speaker Breakfast ( Invitation Only)-3
Event Type: Technical Conference Session
Location: 6D
Thu, Jan 26, 2023 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Chair: Beverley Christian, Project Facilitator, HDP User Group
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 7A
Thu, Jan 26, 2023 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Instructor/Speaker: Catherine Hanlin, General Manager / Quality Manager, Precision Manufacturing Company, Inc.
Instructor/Speaker: Richard Rumas, Technical Manager - Materials Engineering, Honeywell Canada
Instructor/Speaker: George Millman, Quality Engineer, Raytheon Missile Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Thu, Jan 26, 2023 - 8:00 AM to 5:00 PM
8-80: PERM Meeting No. 53-2
Chair: Ben Gumpert, Manufacturing Engineer, Lockheed Martin-Missiles & Fire Control
Event Type: Standards Development Meeting
Location: 15AB
Thu, Jan 26, 2023 - 8:00 AM to 12:00 PM
E-31J: Lab Report Declaration Task Group
Chair: JB Hollister, Environmental Engineer, Apple Inc.
Chair: Jason Gooden, Executive Director, Anthesis
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 10
Thu, Jan 26, 2023 - 8:00 AM to 9:30 AM
IPC SMEMA Council Meeting (by invitation)
 
Location: Show Manager Office D
Thu, Jan 26, 2023 - 8:00 AM to 10:00 AM
S29: Special Session: Advanced Packaging 

Advanced Packaging Special Session: From Mils to Microns – Bridging Capabilities from HDI PCBs to IC-Substrates

Instructor/Speaker: Ms. Jan Vardaman, President and Founder, TechSearch International, Inc
Instructor/Speaker: Dr. Sam Salama, CEO, Hyperion Technologies
Instructor/Speaker: Mr. Matt Kelly, CTO, Vice President Technology Solutions, IPC
Instructor/Speaker: Mr. Matthew Neely, Director Process Engineering, North America, TTM Technologies
Instructor/Speaker: Mr. James W. Fuller, Jr., Vice President, Engineering and Technology Development, Sanmina
Focus: Advanced Packaging
Event Type: Technical Conference Session
Location: 2
The Foundational Requirements for High Impact Substrate Manufacturing- James W. Fuller, Jr. Sanmina
IC Substrate Ecosystem and Future Needs - E. Jan Vardaman, TechSearch
From Mils to Micron Bridging Capabilities from HDI-PCB to IC-Substrates- Sam Salama, Hyperion
ADVANCED PACKAGING SPECIAL SESSION- Opening Remarks - Matt Kelly, IPC
HDI PCB’s to IC Substrates - Matt Neely, TTM Technologies
Thu, Jan 26, 2023 - 8:30 AM to 2:30 PM
STEM Outreach
Event Type: Special Event
Location: 6CF
Thu, Jan 26, 2023 - 9:00 AM to 12:00 PM
Professional Headshots
Event Type: Special Event
Location: Booth 2019
Thu, Jan 26, 2023 - 10:00 AM to 1:00 PM
S30: Special Session: e-Mobility/EV Automotive
Instructor/Speaker: Mr. Brian O’Leary, Global Head e-Mobility & Infrastructure, Indium Corporation
Instructor/Speaker: Mr. Loren McDonald, CEO, EVAdoption, LLC
Instructor/Speaker: Mr. Tom Derry, Chief Executive Officer, Institute for Supply Management
Instructor/Speaker: Dr. Udo Welzel, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Mr. Michael Schleicher, Hardware Layout & Service, Semikron Danfoss
Instructor/Speaker: Mr. Jason Schwartz, Business Development Manager, KYZEN
Instructor/Speaker: Mr. Alex Preciado, Product Launch Engineering Manager, RIVIAN
Instructor/Speaker: Ms. April Butterfield, Vice President, Engineering, Regulated Industries, Automotive & Transportation, Jabil
Focus: e-Mobility/EV Automotive
Event Type: Technical Conference Session
Location: 1AB
e-Mobility/EV Automotive Technical Conference Special Session
Thu, Jan 26, 2023 - 1:30 PM to 5:00 PM
E-31H: Conflict Minerals Due Diligence Task Group Meeting
Chair: Kazuko Andersen, Deputy Director, JEITA
Chair: Nikki Johnson, Director Environmental Engineering, Source Intelligence
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 10
Thu, Jan 26, 2023 - 2:00 PM to 5:00 PM
5-21M: Cold Joining/Press-fit Task Group
Chair: Dr. Udo Welzel, Senior Expert, Robert Bosch GmbH
Chair: Dr. Erika Crandall, R&D, Product Development Engineer, TE Connectivity
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 7B
Fri, Jan 27, 2023 - 8:00 AM to 5:00 PM
8-80: PERM Meeting No. 53
Chair: Ben Gumpert, Manufacturing Engineer, Lockheed Martin-Missiles & Fire Control
Event Type: Standards Development Meeting
Location: 15AB