Sat, Jan 21, 2023 - 8:00 AM to 5:00 PM
5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Milea Kammer, Engineering Manager
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Sun, Jan 22, 2023 - 8:00 AM to 5:00 PM
5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Milea Kammer, Engineering Manager
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Sun, Jan 22, 2023 - 8:00 AM to 5:00 PM
7-31A/D-33A: IPC-A-600 and IPC-6012 Joint Task Group Meeting
Chair: Gerry Partida, Dir. Of Technology, Summit Interconnect - Anaheim
Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff, Lockheed Martin Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 15AB
Sun, Jan 22, 2023 - 5:00 PM to 6:30 PM
TAEC and Chairman Reception(By Invitation)
Event Type: Standards Development Meeting
Location: West Terrace
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
2-19B: Trusted Supplier Task Group
Chair: Richard Snogren, President, Bristlecone LLC
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 10
Mon, Jan 23, 2023 - 8:00 AM to 12:00 PM
3-11A: Base Materials Committee
Chair: Albert Block, Chief Manufacturing Strategist, National Instruments
Chair: Darren Hitchcoc, OEM Business Development Manager, Panasonic Industrial Devices Sales Company of America
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 7B
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
5-21F: Ball Grid Array Task Group
Chair: Mr. Robert Rowland, Director of Engineering, Axiom Electronics, LLC
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 17A
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Task Group
Chair: Ernst Eggelaar, CEO, Microtronic
Chair: Gerard O'Brien, President, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 9
Mon, Jan 23, 2023 - 8:00 AM to 12:00 PM
5-32G: Residue Assessment Task Group
Chair: Emma Hudson, CTO, Emma Hudson Technical Consultancy Ltd
Chair: Eric Camden, Lead Investigator, Foresite, Inc.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 8
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
Chair: Benoit Dagenais, Electric Vehicle Lead Technician, Innovative Vehicle Institute
Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 16B
Mon, Jan 23, 2023 - 8:00 AM to 5:00 PM
7-31J: IPC-A-630 Task Group
Chair: Eddie Hofer, M&P Engineer, Collins Aerospace
Chair: Richard Rumas, Technical Manager - Materials Engineering, Honeywell Canada
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 11A
Mon, Jan 23, 2023 - 8:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 14B
Mon, Jan 23, 2023 - 8:00 AM to 5:00 PM
E-30, E-31, and E-31A Joint Meeting
Chair: Chuck LePard, DXC Technology
Chair: Walter Jager, Principal Consultant, ECD Compliance
Chair: Randall Flinders, Compliance Specialist, GreenSoft Technology Inc.
Chair: David Carnevale, Compliance Engineer, Dolby Laboratories
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 14A
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
Hermes Initiative
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Mon, Jan 23, 2023 - 8:00 AM to 10:00 AM
V-TSL-MVIA: Weak Interface Microvia Failures Technology Solutions Subcommittee
Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff, Lockheed Martin Corporation
Chair: Gerry Partida, Dir. Of Technology, Summit Interconnect - Anaheim
Chair: Mr. Jerry Magera, Distinguished Innovator, Chemical Engineer, Motorola Solutions
General Committee: Technology Solutions
Event Type: Standards Development Meeting
Location: 15AB
Mon, Jan 23, 2023 - 10:00 AM to 5:00 PM
2-16: Digital Product Model Exchange (DPMX) Subcommittee
Chair: Terry Hoffman, Technical Leader, Cisco Systems Inc.
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 10
Mon, Jan 23, 2023 - 10:00 AM to 12:00 PM
2-17A: IPC-CFX Standard Task Group
Chair: Mr. Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Chair: Thomas Marktscheffel, Director of R&D, ASM Assembly Systems GmbH & Co. KG
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Mon, Jan 23, 2023 - 10:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum
Chair: Gaston Hidalgo, Quality Product Engineer, Toyota Motor North America
Chair: Jose Servin Olivares, SMT Expert, Vitesco Technologies
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 6E
Mon, Jan 23, 2023 - 10:15 AM to 12:00 PM
5-21G: Flip Chip Mounting Task Group
Instructor/Speaker: Ife Hsu, Technology & Standards Development Lead, Intel Corporation
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 16B
Mon, Jan 23, 2023 - 10:15 AM to 12:00 PM
5-23A: Printed Board Solderability
Chair: Ernst Eggelaar, CEO, Microtronic
Chair: Gerard O'Brien, President, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 9
Mon, Jan 23, 2023 - 10:15 AM to 12:00 PM
D-36: IPC-PCQR2 Database Subcommittee
Chair: Albert Block, Chief Manufacturing Strategist, National Instruments
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 15AB
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
1-10C: Test Coupon and Artwork Generation Task Group
Chair: Philip Henault, Development Engineer, Raytheon
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: 15AB
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
2-19A: Critical Components Traceability Task Group
Chair: Mr. Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Chair: Radu Diaconescu, Swissmic
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 12
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
3-12D: Woven Glass
Chair: Thomas Keily, General Manager, JPS Composite Materials Corp.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 7B
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
4-14F: ENEPIG Task Group
Chair: Jose Rios, Senior Principal Quality Engineer/Supplier Quality Manage, Raytheon
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 9
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
5-33A: Conformal Coating Task Group
Chair: Brian Chislea, AETS, Dow Corning
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 8
Mon, Jan 23, 2023 - 1:30 PM to 3:00 PM
7-31FT: IPC/WHMA-A-620 Training Committee
Instructor/Speaker: Debbie Wade, Master IPC Trainer, dvanced Rework Technology
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 17A
Mon, Jan 23, 2023 - 1:30 PM to 5:00 PM
D-33AA: IPC-6012 Automotive Addendum
Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 7A
Mon, Jan 23, 2023 - 3:00 PM to 5:00 PM
ITERC (BY INVITATION)
Event Type: Standards Development Meeting
Location: 17A
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
2-19C: Component-Level Authentication (CLA) Standard Task Group
Chair: Mr. Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 12
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable Task Group
Chair: David Sommervold, Senior Principal Engineer, TCLAD Incorporated
Chair: Terry Fischer, VP Sales and Marketing, Showa Denko Materials (America), Inc.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 7B
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
4-14B: ENIG Task Group
Chair: Ingrid Swenson, Inner layer engineering manager, TTM Technologies, Inc.
General Committee: Fabrication Processes
Event Type: Standards Development Meeting
Location: 9
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
5-21H: Bottom Termination Components (BTC) Task Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 16B
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
5-33F: Potting and Encapsulation Task Group
Chair: Brian Chislea, AETS, Dow Corning
Chair: Torrey Clark, Technical Service and Development Engineer, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 8
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 15AB
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
Faces of the Future
Event Type: Standards Development Meeting
Location: 14B
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
WORKFORCE TRAINING MEETING
Event Type: Standards Development Meeting
Location: 11B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
2-15F: Obsolete and Discontinued Product Task Group
Chair: Adam Wheeler, Principal Consultant, Anthesis Group
Chair: Curtis Grosskopf, Senior Engineer, IBM Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
2-30: Terms and Definitions Committee
Chair: Aaron Kennedy, Summit Interconnect - Anaheim
Chair: David Caputa, Electronics Engineer, Lockheed Martin Corporation
Chair: Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
General Committee: Terms and Definitions
Event Type: Standards Development Meeting
Location: 11B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Chair: Erik Bergum, VP Technology and Engineering, Founder PCB USA
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 8
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
5-33B: Solder Mask Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 14A
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
5-33C: Conformal Coating Handbook Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica International L.P.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 15AB
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
7-31BT: IPC-A-610 Training Committee
Chair: Helena Pasquito, Master IPC Trainer, EPTAC Corporation
Chair: Marie Parliman, Technical Instructor, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 14B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Chair: Herb Snogren, Consultant, Bristlecone LLC
Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 7A
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
D-72A: Conductive Yarns for E-Textiles Task Group
Chair: Joe Geiger, Textile Engineer, Bally Ribbon Mills
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 9
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
E-31B-AT-SPR, E-31K-SPR-AT, E-31J-SPR Review A-Teams Joint Meeting
Instructor/Speaker: Jason Gooden, Executive Director, Anthesis
Instructor/Speaker: Chuck LePard, DXC Technology
Instructor/Speaker: Valerie Kuntz, Subject Matter Expert, Materials Management, Assent Compliance Inc.
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 16B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
V-TSL Technology Solutions Committee
General Committee: Technology Solutions
Event Type: Standards Development Meeting
Location: 11A
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
3-13: Halogen-Free Subcommittee
Chair: Naji Norder, Hardware Senior Group Manager PCB Design & Services, National Instruments
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 8
Tue, Jan 24, 2023 - 1:30 PM to 5:00 PM
5-22F: IPC-HDBK-001 Task Group
Chair: John Mastorides, Principle Product Design Engineer, Honeywell Aerospace
Chair: Scott Meyer
Event Type: Standards Development Meeting
Location: 6E
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
5-32E: CAF Task Group
Chair: Mr. Karl Sauter, Senior Principal Engineer, PCB Technology, Oracle Corporation
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 15AB
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
6-10D: SMT Attachment Reliability Task Group
Chair: Reza Ghaffarian, Principal Engineer, Jet Propulsion Laboratory
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 14A
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
7-24: Printed Board Fabrication and Assembly Process Effects Subcommittee
Chair: Michael Carano, VP Technology and Bus. Dev, IPC
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 11A
Tue, Jan 24, 2023 - 1:30 PM to 5:00 PM
7-34: IPC-7711/21 Rework, Repair and Modification
Chair: Frank Honyotsk, Instructor, STI Electronics, Inc.
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 7B
Tue, Jan 24, 2023 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Chair: Michael Creeden, Technical Director Design Education, Insulectro
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 11B
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Instructor/Speaker: Rajesh Kumar
General Committee: Embedded Devices
Event Type: Standards Development Meeting
Location: 16B
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
D-72B: Woven, Knitted and Braided E-Textiles Standard Task Group
Chair: Sahar Rostami, Fiber and Textile Engineer, Myant, Inc.
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 10
Tue, Jan 24, 2023 - 1:30 PM to 5:00 PM
E-31K: Materials and Substances Declaration for the Aerospace, Defense, HE and Other Industries
Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Chair: Walter Jager, Principal Consultant, ECD Compliance
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Tue, Jan 24, 2023 - 1:30 PM to 3:00 PM
EMS Steering Committee
Event Type: Standards Development Meeting
Location: 17A
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
Chair: Radu Diaconescu, Swissmic
Chair: Victor Xu, Principal Engineer, Intel Corporation
Chair: Zhiqian Sang, Hangzhou Dianzi University
Chair: Shuming Gao, Professor, Zhejiang University
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 11A
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Chair: Milea Kammer, Engineering Manager
Chair: Srinivas Chada, Amazon Project Kuiper
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 8
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
5-33C: Conformal Coating Handbook Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica International L.P.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 15AB
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
D-33AM: IPC-6012 Medical Device Addendum Task Group
Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 9
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
D-55A: Embedded Circuitry Guideline Task Group
Instructor/Speaker: Dr. Bhanu Sood, Deputy Chief Technologist, NASA Goddard Space Flight Center
General Committee: Embedded Devices
Event Type: Standards Development Meeting
Location: 16B
Tue, Jan 24, 2023 - 3:15 PM to 5:00 PM
D-70X: Embroidered E-Textiles
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 10
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
2-16D: IPC-2581 Users Task Group
Chair: Kevin Kusiak, LM Associate Fellow, Lockheed Martin Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 8
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 14B
Wed, Jan 25, 2023 - 8:00 AM to 12:00 PM
5-21N: Cold Joining/Press-fit Handbook Task Group
Chair: Dr. Udo Welzel, Senior Expert, Robert Bosch GmbH
Chair: Dr. Erika Crandall, R&D, Product Development Engineer, TE Connectivity
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 16B
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-22AS: Space and Military Electronic Assemblies Task Group
Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 6E
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-22BT: J-STD-001 Training Committee
Chair: George Tristan, Process Control Engineer, Ball Aerospace & Technologies Corp.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 11A
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-24B: Solder Paste Task Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 10
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
5-24G: Polymerics Standard Task Group
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 11B
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
D-15: Flex Test Methods Methods Subcommittee
Chair: Russell Sheperd
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 14A
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
D-22: RF/Microwave Printed Board Performance Subcommittee
Chair: Lance Auer, Engineering Fellow, Conductor Analysis Technologies, Inc.
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 7A
Wed, Jan 25, 2023 - 8:00 AM to 10:00 AM
D-75C E-Textiles Printed Electronics Reliability Standard Task Group
Instructor/Speaker: Pratyush Rai, Founding Engineer, Nanowear Inc.
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 18
Wed, Jan 25, 2023 - 8:00 AM to 5:00 PM
E-31B: Materials Declaration Task Group
Chair: Jason Gooden, Executive Director, Anthesis
Chair: JB Hollister, Environmental Engineer, Apple Inc.
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 7B
Wed, Jan 25, 2023 - 10:00 AM to 12:00 PM
1-14: DFX Standards Subcommittee
Chair: Pietro Vergine, President, Advanced Rework Technology
Chair: Stephen Golemme, Manufacturing Engineer, ITX Inc.
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: 8
Wed, Jan 25, 2023 - 10:00 AM to 12:00 PM
5-24A: Flux Specification Task Group
Chair: Anthony Lentz, Chemist / Field Application, FCT Assembly, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 10
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
3-11J: Metal Based Laminates for Printed Boards
Chair: Minsu Lee, Manager, Korea Packaging Integration Association
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 9
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
7-12: Microsection Subcommittee
General Committee: Testing
Event Type: Standards Development Meeting
Location: 14B
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
7-31AT/D-33AT:IPC-A-600 and IPC-6012 Training Joint Meeting
Chair: Jamie Noland, Marketing Manager/MIT, Blackfox Training Institute
Chair: Leo Lambert, Vice President, EPTAC Corporation
Chair: Jeffrey Duch, Industry Trainer, TandemWorks Customized Training Solutions L.L.C.
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 11A
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
7-31K and 7-31H IPC-D-620 and IPC-HDBK-620 Joint Meeting
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 11B
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
D-12: Flexible Printed Circuits Performance Subcommittee
Chair: Nick Koop, Director of Flex Technology, TTM Technologies
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 14A
Wed, Jan 25, 2023 - 10:15 AM to 12:00 PM
D-75A: E-Textiles Wearables Standard Task Group
Instructor/Speaker: Vladan Koncar, ENSAIT GEMTEX Lab
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 18
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
2-12C: Cybersecurity Protection Standard Task Group
Chair: Mr. Hiroyuki Watanabe, Executive Director Global Security, NEC Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Wed, Jan 25, 2023 - 1:30 PM to 5:00 PM
5-21M: Cold Joining/Press-fit Task Group
Chair: Dr. Udo Welzel, Senior Expert, Robert Bosch GmbH
Chair: Dr. Erika Crandall, R&D, Product Development Engineer, TE Connectivity
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 16B
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
5-22H: Thermal Profiling Guide Task Group
Chair: Mr. Robert Rowland, Director of Engineering, Axiom Electronics, LLC
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 10
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
5-24F: Underfill Materials Task Group
Chair: Brian Toleno, Principal Material Scientist, Facebook
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 15AB
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
5-31J: Cleaning Compatibility
Chair: William Capen, Senior Engineering Tech Specialist, Honeywell FM&T
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 14B
Wed, Jan 25, 2023 - 1:30 PM to 5:00 PM
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
7-34T: IPC-7711 7721 Training Committee
Chair: Frank Honyotski
Chair: Nichole Thilges, Sr. Training and Development Spc, Raytheon Missile Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 11A
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Chair: Mark Finstad, Senior Appication Engineer, Flexible Circuit Technologies, Inc.
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 14A
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
D-23: High Speed High Frequency Base Materials Subcommittee
Instructor/Speaker: Tony Senese, Group Mgr. - Bus. Development, Panasonic Industrial Devices Sales Company of America
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 17A
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
D-75B: E-Textiles Wearables Guideline Task Group
Instructor/Speaker: Paula Veske, Universiteit Gent
General Committee: E-Textiles
Event Type: Standards Development Meeting
Location: 18
Wed, Jan 25, 2023 - 1:30 PM to 3:00 PM
ESDS Control Plan
Event Type: Standards Development Meeting
Location: 11B
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Chair: Michelle Gleason, Staff DFX Engineer, Plexus Corp.
General Committee: Electronic Packaging Design
Event Type: Standards Development Meeting
Location: 15AB
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
2-12A: Generic Requirements for Digital Twin Task Group
Chair: Mr. Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
Chair: Radu Diaconescu, Swissmic
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7A
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
4-14E: OSP Task Group
Instructor/Speaker: Michael Carano, VP Technology and Bus. Dev, IPC
General Committee: Fabrication Processes
Event Type: Standards Development Meeting
Location: 17A
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
5-45A: Reflow Oven Process Control Task Group
Chair: Linda Woody, LWC Consulting
General Committee: Assembly Equipment
Event Type: Standards Development Meeting
Location: 11B
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
7-31D: Optical Inspection Aides Task Group
Instructor/Speaker: Joshua Hudson, Lockheed Martin Missiles & Fire Control
Instructor/Speaker: Leo Lambert, Vice President, EPTAC Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 18
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
B-10A: Plastic Chip Carrier Cracking Task Group
Chair: Christina Landon, Engineer, Naval Surface Warfare Ctr
Chair: Steve Martell
General Committee: Packaged Electronic Components
Event Type: Standards Development Meeting
Location: 14B
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
B-11A: Electronic Packages Guideline Task Group
Chair: Dudi Amir, Technologist, Intel Corporation
General Committee: Packaged Electronic Components
Event Type: Standards Development Meeting
Location: 10
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
D-13: Flex Circuits Base Materials
Chair: Richard Wessel, Technical Supervisor, DuPont Electronics & Imaging
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 14A
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
D-21: RF/Microwave Printed Board Design Subcommittee
Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff, Lockheed Martin Corporation
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 8
Wed, Jan 25, 2023 - 3:15 PM to 5:00 PM
D-60: Printed Electronics Committee
Chair: Neil Bolding, Manager, Technical Services & Quality, MacDermid Alpha Electronics Solutions
General Committee: Printed Electronics
Event Type: Standards Development Meeting
Location: 12
Thu, Jan 26, 2023 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Chair: Beverley Christian, Project Facilitator, HDP User Group
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 7A
Thu, Jan 26, 2023 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Instructor/Speaker: Catherine Hanlin, General Manager / Quality Manager, Precision Manufacturing Company, Inc.
Instructor/Speaker: Richard Rumas, Technical Manager - Materials Engineering, Honeywell Canada
Instructor/Speaker: George Millman, Quality Engineer, Raytheon Missile Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 6E
Thu, Jan 26, 2023 - 8:00 AM to 5:00 PM
8-80: PERM Meeting No. 53-2
Chair: Ben Gumpert, Manufacturing Engineer, Lockheed Martin-Missiles & Fire Control
Event Type: Standards Development Meeting
Location: 15AB
Thu, Jan 26, 2023 - 8:00 AM to 12:00 PM
E-31J: Lab Report Declaration Task Group
Chair: JB Hollister, Environmental Engineer, Apple Inc.
Chair: Jason Gooden, Executive Director, Anthesis
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 10
Thu, Jan 26, 2023 - 1:30 PM to 5:00 PM
E-31H: Conflict Minerals Due Diligence Task Group Meeting
Chair: Kazuko Andersen, Deputy Director, JEITA
Chair: Nikki Johnson, Director Environmental Engineering, Source Intelligence
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 10
Thu, Jan 26, 2023 - 2:00 PM to 5:00 PM
5-21M: Cold Joining/Press-fit Task Group
Chair: Dr. Udo Welzel, Senior Expert, Robert Bosch GmbH
Chair: Dr. Erika Crandall, R&D, Product Development Engineer, TE Connectivity
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 7B
Fri, Jan 27, 2023 - 8:00 AM to 5:00 PM
8-80: PERM Meeting No. 53
Chair: Ben Gumpert, Manufacturing Engineer, Lockheed Martin-Missiles & Fire Control
Event Type: Standards Development Meeting
Location: 15AB