Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable Task Group
Chair: David Sommervold, Senior Principal Engineer, TCLAD Incorporated
Chair: Terry Fischer, VP Sales and Marketing, Showa Denko Materials (America), Inc.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 7B
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
4-14B: ENIG Task Group
Chair: Ingrid Swenson, Inner layer engineering manager, TTM Technologies, Inc.
General Committee: Fabrication Processes
Event Type: Standards Development Meeting
Location: 9
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
5-21H: Bottom Termination Components (BTC) Task Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 16B
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
5-33F: Potting and Encapsulation Task Group
Chair: Brian Chislea, AETS, Dow Corning
Chair: Torrey Clark, Technical Service and Development Engineer, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 8
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 15AB
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
Faces of the Future
Event Type: Standards Development Meeting
Location: 14B
Mon, Jan 23, 2023 - 3:15 PM to 5:00 PM
WORKFORCE TRAINING MEETING
Event Type: Standards Development Meeting
Location: 11B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
2-15F: Obsolete and Discontinued Product Task Group
Chair: Adam Wheeler, Principal Consultant, Anthesis Group
Chair: Curtis Grosskopf, Senior Engineer, IBM Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 7B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
2-30: Terms and Definitions Committee
Chair: Aaron Kennedy, Summit Interconnect - Anaheim
Chair: David Caputa, Electronics Engineer, Lockheed Martin Corporation
Chair: Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
General Committee: Terms and Definitions
Event Type: Standards Development Meeting
Location: 11B
Tue, Jan 24, 2023 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Chair: Erik Bergum, VP Technology and Engineering, Founder PCB USA
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 8