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Programs: 181 - 190 of 220
Wed, Feb 5, 2020 - 3:15 PM to 5:00 PM
B-11a: 3-D Electronic Packages SubStandards Development Meeting
Committee Chair: Dudi Amir, Technologist, Intel Corporation
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Packaged Electronic Components
Location: 29B
Wed, Feb 5, 2020 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials SubStandards Development Meeting
Committee Chair: Richard Wessel, Technical Supervisor, Dupont
Seminar Type: Standards Development Meeting
General Committee: Flexible and Rigid-Flex Printed Boards
Location: 28A
Wed, Feb 5, 2020 - 3:15 PM to 5:00 PM
D-21: High Speed/High Frequency Design SubStandards Development Meeting
Committee Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff., DuPont
Seminar Type: Standards Development Meeting
Track: PCB Fabrication and Materials
General Committee: High Speed/High Frequency Interconnections
Location: 25A
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
I-15 iNEMI PCB Technology Forum - Session 2: Materials and Testing Challenges 
Moderator: Grace O’Malley, Vice President of Technical & Project Operations, iNEMI
Speaker: Sarah Czaplewski-Campbell, Advisory PCB Qualification Engineer, IBM
Speaker: Juan Landeros, Design Engineering, Intel Corporation
Speaker: Edward J. Kelley, CTO & Sr. Vice President, Technology, Isola Group SARL
Speaker: Marc Benowitz, CEO, iNEMI - International Electronics
Speaker: Lenora Clark, Director - Autonomous Driving and Safety Technology, MacDermid Alpha Automotive
Speaker: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 33C
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
I-14  interACTION: E-textiles – Application Opportunities, Challenges and Solutions
Moderator: Stephanie Rodgers, Director Product Development, Apex Mills, Inc.
Speaker: Mary Alice Gill, Jabil Circuit, Inc.
Speaker: Ian Tevis, SAFI-Tech
Speaker: Meg Grant, E-Textile Technologist, Meg Grant Consulting
Speaker: Oxana Pantchenko, PhD., Program Manager – Medical Devices, NEXTFLEX
Speaker: Tricia Danitz, Principle Textile Engineer
Speaker: Michael Rein, Senior Product Engineer, AFFOA – Government: Advanced Functional Fabrics
Seminar Type: Sessions @ The Intersection
Track: Emerging Technologies
Location: 31C
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
I-16 interACTION: I4.0 – The Hidden Cost of Data Silos
Speaker: Hassan Aluraibi, Advanced Manufacturing Engineering Manager, Flex
Speaker: Tim Burke, Chief Technology Officer, Arch Systems
Seminar Type: Sessions @ The Intersection
Location: 33AB
Tim Burke
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
S17: Flux Residue Considerations
Moderator: Stanton Rak, Ph.D., Continental Automotive Systems
Speaker: Kim Flanagan, Technical Support Engineer, Indium Corporation
Speaker: Ning-Cheng Lee, PhD., VP Technology, Indium Corporation
Speaker: Douglas Pauls, Principal Materials and Process Engineer, Collins Aerospace
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 30A
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
S18: Getting the Most Out of Your Manufacturing Process
Speaker: Michael Sivigny, Owner and General Manager, CeTaQ Americas
Speaker: Terry York, Regional Product Manager, Kulicke & Soffa Industries Inc
Moderator: Udo Welzel, Robert Bosch GmbH
Seminar Type: Technical Conference Session
Track: Assembly Processes
Location: 30BC
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
S19: Surface Finishes 2
Moderator: David Hoover, TTM Technologies
Speaker: Saminda Dharmarathna, PhD., Senior Research Scientist, MacDermid Alpha Electronics Solutions
Speaker: Rob Weber, Director of Product Management, Fischer Technology, Inc.
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 30DE
Wed, Feb 5, 2020 - 3:30 PM to 5:00 PM
S20: Strategies to Enable Miniaturization
Moderator: Weifeng Liu, PhD., Flex
Speaker: Joerg Nolte, Ersa GmbH
Speaker: Robert Carter, Vice President of Business Development and Technology, Oak-Mitsui Technologies
Speaker: Antonio Caputo, Ph.D., Packaging R & D Engineer, Intel Corporation
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 31AB