Component Value-Added Services: High quality, low prices, fast lead times.

Tape and Reel, IC Programming, Assembly, Laser Marking and Engraving, Lead Trim and Form, Carrier Tape, Kapton Thermoforming

Place-N-Bond™: Patented underfilm made of pre-formed thermoplastic to create corner/edge bonds for BGA/LGA/CSP and many more SMD's, to PCB. This underfill alternative generates major improvements to the solder ball/joint and shock-drop reliability. This durable adhesive eliminates the need for dispensing and curing and seamlessly integrates with SMT assembly. (less)