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Date
Sat, Jan 21st, 2023
Sun, Jan 22nd, 2023
Mon, Jan 23rd, 2023
Tue, Jan 24th, 2023
Wed, Jan 25th, 2023
Thu, Jan 26th, 2023
Fri, Jan 27th, 2023
Event Type
Standards Development Meeting
General Committee
Assembly Equipment
Assembly and Joining
Base Materials
Cleaning and Coating
Data Generation & Transfer/Documentation
E-Textiles
Electronic Packaging Design
Electronic Product Data Description
Embedded Devices
Fabrication Processes
Flexible and Rigid-Flex Printed Boards
High Speed/High Frequency Interconnections
Packaged Electronic Components
Printed Board Design Technology
Printed Electronics
Process Control
Product Assurance
Product Reliability
Rigid Printed Boards
Technology Solutions
Terms and Definitions
Testing
Speaker
Aaron Kennedy, Summit Interconnect - Anaheim
Adam Wheeler, Anthesis Group
Albert Block, National Instruments
Anthony Lentz, FCT Assembly, Inc.
Ben Gumpert, Lockheed Martin-Missiles & Fire Control
Benoit Dagenais, Innovative Vehicle Institute
Beverley Christian, HDP User Group
Brian Chislea, Dow Corning
Brian Toleno, Facebook
Catherine Hanlin, Precision Manufacturing Company, Inc.
Christina Landon, Naval Surface Warfare Ctr
Chuck LePard, DXC Technology
Curtis Grosskopf, IBM Corporation
Darren Hitchcoc, Panasonic Industrial Devices Sales Company of America
David Caputa, Lockheed Martin Corporation
David Carnevale, Dolby Laboratories
David Sommervold, TCLAD Incorporated
Debbie Wade, dvanced Rework Technology
Dr. Bhanu Sood, NASA Goddard Space Flight Center
Dr. Erika Crandall, TE Connectivity
Dr. Udo Welzel, Robert Bosch GmbH
Dudi Amir, Intel Corporation
Eddie Hofer, Collins Aerospace
Emma Hudson, Emma Hudson Technical Consultancy Ltd
Eric Camden, Foresite, Inc.
Erik Bergum, Founder PCB USA
Ernst Eggelaar, Microtronic
Fonda Wu, Raytheon Company
Frank Honyotsk, STI Electronics, Inc.
Frank Honyotski
Garry McGuire, NASA Marshall Space Flight Center
Gaston Hidalgo, Toyota Motor North America
George Millman, Raytheon Missile Systems
George Tristan, Ball Aerospace & Technologies Corp.
Gerard O'Brien, Solderability Testing & Solutions, Inc.
Gerry Partida, Summit Interconnect - Anaheim
Helena Pasquito, EPTAC Corporation
Herb Snogren, Bristlecone LLC
Ife Hsu, Intel Corporation
Ingrid Swenson, TTM Technologies, Inc.
JB Hollister, Apple Inc.
Jamie Noland, Blackfox Training Institute
Jan Pedersen, Elmatica AS
Jason Gooden, Anthesis
Jason Keeping, Celestica International L.P.
Jeff Schake, ASM Assembly Systems
Jeffrey Duch, TandemWorks Customized Training Solutions L.L.C.
Joe Geiger, Bally Ribbon Mills
John Mastorides, Honeywell Aerospace
Jonathon Vermillion, Ball Aerospace & Technologies Corp.
Jose Rios, Raytheon
Jose Servin Olivares, Vitesco Technologies
Joseph Kane, BAE Systems
Joshua Hudson, Lockheed Martin Missiles & Fire Control
Kazuko Andersen, JEITA
Kevin Kusiak, Lockheed Martin Corporation
Lance Auer, Conductor Analysis Technologies, Inc.
Leo Lambert, EPTAC Corporation
Linda Woody, LWC Consulting
Marie Parliman, BAE Systems
Mark Finstad, Flexible Circuit Technologies, Inc.
Michael Carano, IPC
Michael Creeden, Insulectro
Michelle Gleason, Plexus Corp.
Milea Kammer
Minsu Lee, Korea Packaging Integration Association
Mr. Hiroyuki Watanabe, NEC Corporation
Mr. Jerry Magera, Motorola Solutions
Mr. Karl Sauter, Oracle Corporation
Mr. Michael Ford, Aegis Software
Mr. Robert Rowland, Axiom Electronics, LLC
Naji Norder, National Instruments
Neil Bolding, MacDermid Alpha Electronics Solutions
Nichole Thilges, Raytheon Missile Systems
Nick Koop, TTM Technologies
Nikki Johnson, Source Intelligence
Paula Veske, Universiteit Gent
Philip Henault, Raytheon
Pietro Vergine, Advanced Rework Technology
Pratyush Rai, Nanowear Inc.
Radu Diaconescu, Swissmic
Rajesh Kumar
Randall Flinders, GreenSoft Technology Inc.
Reza Ghaffarian, Jet Propulsion Laboratory
Richard Rumas, Honeywell Canada
Richard Snogren, Bristlecone LLC
Richard Wessel, DuPont Electronics & Imaging
Rick Shanks, Pratt & Whitney
Robert Cooke, NASA Johnson Space Center
Russell Sheperd
Sahar Rostami, Myant, Inc.
Scott Bowles, Lockheed Martin Corporation
Scott Meyer
Shuming Gao, Zhejiang University
Srinivas Chada, Amazon Project Kuiper
Stephen Golemme, ITX Inc.
Steve Martell
Steven Bowles, Lockheed Martin Corporation
Symon Franklin, Custom Interconnect Ltd
Terry Fischer, Showa Denko Materials (America), Inc.
Terry Hoffman, Cisco Systems Inc.
Thomas Keily, JPS Composite Materials Corp.
Thomas Marktscheffel, ASM Assembly Systems GmbH & Co. KG
Tiberiu Baranyi, Flextronics
Tony Senese, Panasonic Industrial Devices Sales Company of America
Torrey Clark, Dow Corporation
Valerie Kuntz, Assent Compliance Inc.
Victor Xu, Intel Corporation
Vladan Koncar, ENSAIT GEMTEX Lab
Walter Jager, ECD Compliance
William Capen, Honeywell FM&T
Zhiqian Sang, Hangzhou Dianzi University
Location
10
11A
11B
12
14A
14B
15AB
16B
17A
18
6E
7A
7B
8
9
West Terrace
Programs: 111 - 112 of 112
Programs per Page
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IPC APEX EXPO 2023
Thu, Jan 26, 2023 - 2:00 PM to 5:00 PM
5-21M: Cold Joining/Press-fit Task Group
Chair: Dr. Udo Welzel, Senior Expert, Robert Bosch GmbH
Chair: Dr. Erika Crandall, R&D, Product Development Engineer, TE Connectivity
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 7B
IPC APEX EXPO 2023
Fri, Jan 27, 2023 - 8:00 AM to 5:00 PM
8-80: PERM Meeting No. 53
Chair: Ben Gumpert, Manufacturing Engineer, Lockheed Martin-Missiles & Fire Control
Event Type: Standards Development Meeting
Location: 15AB
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