APEX EXPO 2018 Agenda Planner - Programs

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IPC APEX EXPO 2018

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Programs: 121 - 130 of 219

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	Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM D-24D: High Frequency Loss Test Methods Task Group Presenter/Committee Chair: Xianoning Ye Seminar Type: Standards Development Committee Track: Quality, Reliability, and Test General Committee: High Speed/High Frequency Interconnections Location: 16B
	Tue, Feb 27, 2018 - 3:15 PM to 5:00 PM D-33A: IPC-6012 Automotive Addendum Task Group Seminar Type: Standards Development Committee Track: PCB Fabrication and Materials General Committee: Rigid Printed Circuit Boards Location: 12
	Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM BZ3: 3D Printed Electronics Are You Ready to Take Your Company to the Next Dimension? Moderator: Chris Jorgensen, Director, Technology Transfer, IPC Presenter/Committee Chair: John Crumpton, DuPont - RTP Presenter/Committee Chair: Mike O'Reilly, Optomec Presenter/Committee Chair: Karen McConnell CID, Manager, EDA, Northrop Grumman Corporation Seminar Type: Buzz Session Location: 5A BZ3 - Mike O'Reilly _Optomec APEX_IEEE Presentation 2018
	Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM BZ4: IPC Edge Presenter/Committee Chair: Dave Hernandez, Sr. Director of Online Learning, IPC Seminar Type: Buzz Session Location: 5B
	Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM S06: PCB Fabrication I Moderator: Stanton Rak, Head of Materials Technology, Continental Automotive Systems Presenter/Committee Chair: Sven Kramer, Lackwerke Peters GmbH & Co. KG Presenter/Committee Chair: Sandra Heinemann, Atotech Deutschland GmbH Presenter/Committee Chair: Javier Gonzalez, Sales Manager, LPKF Laser & Electronics Seminar Type: Technical Conference Session Track: PCB Fabrication and Materials Location: 1A S06: PCB Fabrication I
	Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM S07: Component Reliability 1 (Warpage and Adhesives) Moderator: Beverley Christian, HDPUG User Group Presenter/Committee Chair: Jim Bielick, IBM Corporation Presenter/Committee Chair: Neil Hubble, Akrometrix Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 2 S07: Component Reliability 1 (Warpage and Adhesives)
	Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM S08: Voiding Moderator: Brook Sandy-Smith, Product Support Specialist, Indium Corporation Presenter/Committee Chair: Anthony Lentz, FCT Assembly Presenter/Committee Chair: Norbert Holle, Robert Bosch Seminar Type: Technical Conference Session Track: Assembly Processes for Lead Free and Tin-Lead Location: 1B S08: Voiding
	Tue, Feb 27, 2018 - 3:30 PM to 5:00 PM S10: SIR (Surface Insulation Resistance) Moderator: Karl Sauter, Principal Engineer, Oracle America, Inc. Presenter/Committee Chair: David Edwards, Henkel Electronic Materials LLC Presenter/Committee Chair: Eric Bastow, Indium Corporation Presenter/Committee Chair: Beverley Christian, HDPUG User Group Seminar Type: Technical Conference Session Track: Quality, Reliability, and Test Location: 4 S10: SIR (Surface Insulation Resistance)
	Tue, Feb 27, 2018 - 5:00 PM to 6:00 PM Complimentary Show Floor Reception Seminar Type: Special Event
	Wed, Feb 28, 2018 - 7:30 AM to 9:00 AM 2-16D: IPC-2581 User's Group Presenter/Committee Chair: Kevin Kusiak, Lockheed Martin Space Systems Company Presenter/Committee Chair: Gary Carter, Principal, ThingWeaver Solutions, LLC Seminar Type: Standards Development Committee Track: PCB Fabrication, Materials and Design General Committee: Electronic Product Data Description Location: 8

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Programs: 121 - 130 of 219

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