APEX EXPO 2018 Agenda Planner - Programs

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IPC APEX EXPO 2018

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Programs: 141 - 150 of 219

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	Wed, Feb 28, 2018 - 8:00 AM to 12:00 PM 7-35: Assembly and Joining Handbook Subcommittee Seminar Type: Standards Development Committee Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Product Assurance Location: 17A
	Wed, Feb 28, 2018 - 8:00 AM to 10:00 AM D-15: Flexible Circuits Test Methods Subcommittee Presenter/Committee Chair: Russell Shepherd, Coming Soon Seminar Type: Standards Development Committee Track: PCB Fabrication and Materials General Committee: Flexible and Rigid-Flex Printed Boards Location: 11B
	Wed, Feb 28, 2018 - 8:00 AM to 10:00 AM D-22: High Speed/High Frequency Board Performance Subcommittee Presenter/Committee Chair: Lance Auer, Conductor Anaylsis Seminar Type: Standards Development Committee Track: PCB Fabrication and Materials General Committee: High Speed/High Frequency Interconnections Location: 17B
	Wed, Feb 28, 2018 - 9:00 AM to 12:00 PM 2-16: Product Data Description (2581) Presenter/Committee Chair: Gary Carter, Principal, ThingWeaver Solutions, LLC Presenter/Committee Chair: Chris Shaw, Fujitsu Network Communications Seminar Type: Standards Development Committee Track: PCB Fabrication, Materials and Design General Committee: Electronic Product Data Description Location: 8
	Wed, Feb 28, 2018 - 9:00 AM to 5:00 PM Press Office Seminar Type: Special Event Location: 16A
	Wed, Feb 28, 2018 - 9:15 AM to 10:15 AM D-33AT: IPC-6012 Technical Training Committe Seminar Type: Standards Development Committee General Committee: Rigid Printed Boards Location: 12
	Wed, Feb 28, 2018 - 9:30 AM to 11:00 AM SMEMA Council Meeting(By Invitation Only) Seminar Type: Standards Development Committee Location: 14A
	Wed, Feb 28, 2018 - 10:00 AM to 10:30 AM Poster Presentations Posters are also scheduled to be presented at 4:30pm - 5:00pm on Wednesday, February 28, 2018 Presenter/Committee Chair: William Pfingston, Quality Manager, Miraco, Inc. Presenter/Committee Chair: Matthias Zapatka, INGUN USA, Inc. Presenter/Committee Chair: Gerold Müller-Ensslin, Herr Presenter/Committee Chair: Vern Solberg, Sr Consultant, Solberg Technical Consulting Presenter/Committee Chair: Kerri Doyle, Marketing Manager, Siemens Presenter/Committee Chair: Kathy Nargi-Toth, President, Eltek Ltd. Presenter/Committee Chair: John Coonrod, Technical Services Engineer, Rogers Corporation Presenter/Committee Chair: Hartmut Berndt, B.E.STAT European ESD competence centre Presenter/Committee Chair: Daniel Feinberg, Owner, Fein-Line Associates, Inc. Presenter/Committee Chair: Curtis DeSaele, Director of Technology, Geometric Solutions Presenter/Committee Chair: Ramana Kappagantu, PH.D., Siemens PLM Software, Inc. Presenter/Committee Chair: Robert McKerrow, Indium Corporation Presenter/Committee Chair: Johnathan WU, Jabil Presenter/Committee Chair: Arturo Espejo, Kester Presenter/Committee Chair: Rachel Carney, Northrop Grumman Presenter/Committee Chair: Ledain Bernard, Meredit Presenter/Committee Chair: Mike Rouman, Siemens Product Lifecycle Management Software Presenter/Committee Chair: Paul Bennett, Acculogic Ltd Presenter/Committee Chair: Yizhak Bot, BQR Presenter/Committee Chair: Tom Rogers, Polyonics Presenter/Committee Chair: Brian Chislea, Dow Corning Presenter/Committee Chair: Michael Mattioda, Business Development Manager, Siemens Product Lifecycle Management Software Inc. Presenter/Committee Chair: Zac Elliott, Mentor Graphics Seminar Type: Poster Location: Lobby of 6A
	Wed, Feb 28, 2018 - 10:15 AM to 12:00 PM 4-14: Plating Processes Subcommittee Presenter/Committee Chair: George Milad, Coming Soon Presenter/Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc. Seminar Type: Standards Development Committee Track: PCB Fabrication and Materials General Committee: Fabrication Processes Location: 14B
	Wed, Feb 28, 2018 - 10:15 AM to 12:00 PM 5-21F: Ball Grid Array Task Group Presenter/Committee Chair: Ray Prasad, Consultant, Ray Prasad Consultancy Group Seminar Type: Standards Development Committee Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 10

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Programs: 141 - 150 of 219

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